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    • 6. 发明专利
    • CERAMIC MULTILAYER CIRCUIT SUBSTRATE
    • JPH01138793A
    • 1989-05-31
    • JP29714987
    • 1987-11-25
    • NARUMI CHINA CORP
    • FUKUDA JUNZONODA KUNIHARUNISHIGAKI SUSUMU
    • H01B1/16H05K1/09H05K3/40H05K3/46
    • PURPOSE:To prevent a crack from occurring at a through-hole conductor and its vicinity by a method wherein a paste, which contains specified metal components that are flat conductive metal powders of a specified ratio of components by weight, is filled into a through-hole and calculated at a prescribed temperature. CONSTITUTION:A flat metal powder used for a conductive paste is manufactured in such a manner that a metal salt solution is precipitated making use of the reducing agent to form spherical powders, which are crashed through a ball mill or kneaded. And, a metallic component included in the conductive paste consists of, at least, one or more kinds of metals selected from Ag, Pd, Pt, and Cu and flat powders are made to amount to 30% or more of the whole metal component, so that the conductive metal component section of a through- holed 2 grows a multi-cellular structure because of an inferior sintering property when the paste filled into the hole 2 is sintered with a ceramic green sheet 1, consequently the conductive metal component section serves to alleviate a stress caused by a rapid temperature change and prevent cracks occurring at the ceramic section and the conductor section.
    • 7. 发明专利
    • THICK FILM RESISTOR COMPOSITE
    • JPH01120003A
    • 1989-05-12
    • JP27782887
    • 1987-11-02
    • NARUMI CHINA CORP
    • FUKAYA MASASHINODA KUNIHARUSHIBATA HIROTAKENISHIGAKI SUSUMU
    • H01C7/00
    • PURPOSE:To obtain a thick film resistor composite, wherein a ceramic substrate for low temperature firing and a resistor are able to be simultaneously fired so as to reduce the number of firing, being able to incorporate a resistor and to widen a mounting area and having an excellent high voltage characteristic by adding a specific amount of an Ni compound to RuO2 powder and to glass powder of a borosilicate alminocalcium system or the like. CONSTITUTION:0.5-7.0wt.% of an Ni compound as Ni is added to a total wt.% of RuO2 powder and glass powder of 10-55wt.% of MO (provided M is Ca or Mg), 45-70wt.% of SiO2, 0-30wt.% of Al2O3 and 0-30wt.% of B2O3. As said Ni compound, various kinds of Ni chloride, for instance, of Ni NiO or an organic Ni compound can be used. For instance, the Ni compound as Ni is mixed with a total 100wt.% of 15-25wt.% of RuO2 powder and the rest of borosilicate glass (32wt.% of CaO, 4wt.% of Al2O3, 42wt.% of SiO2 and 22wt.% of B2O3) powder at a blending rate of 0.5-7.0wt.% and a terpineol solution containing ethyl cellulose as an organic vehicle is added so as to obtain a thick film resistor composite.
    • 8. 发明专利
    • MANUFACTURE OF CERAMIC ELECTRONIC CIRCUIT BOARD
    • JPH03285385A
    • 1991-12-16
    • JP8725390
    • 1990-03-31
    • NARUMI CHINA CORP
    • FUKUDA JUNZOYOSHIKAWA SHINJINODA KUNIHARU
    • H05K3/12
    • PURPOSE:To improve a solder wet property by applying reduction processing to copper oxide generated in the copper conductor of a substrate by using the aqueous solution of one or more kinds of hydrazine, hydrazine hydrate, formic acid, alkorubin acid and oxalic acid. CONSTITUTION:The method of manufacturing a ceramic electronic circuit substrate is disclosed wherein reduction processing by one or more kinds of aqueous solutions of hydrazine, hydrazine hydrate, formic acid, alkorubin acid and oxalic acid is applied to copper oxide generated in the copper conductor of the ceramic electronic circuit board. Even when copper oxide is generated in baking, by performing reduction using a reducing agent as described above, a copper conductor with an excellent solder wet property can be provided on the ceramic electronic circuit board. Such a ceramic electronic circuit board provided with the surface copper conductor thereon can be easily industrially manufactured. The same effect can be obtained also from the ceramic electronic circuit board provided therein with an inner layer conductor, such as W, Ag or Ag/Pd.
    • 10. 发明专利
    • CERAMIC MULTILAYER CIRCUIT BOARD
    • JPH01232797A
    • 1989-09-18
    • JP5891088
    • 1988-03-11
    • NARUMI CHINA CORP
    • FUKAYA MASASHIFUKUDA JUNZONAKAMURA TSUYOSHINODA KUNIHARU
    • H01B5/14H01B1/22H01B5/00H05K1/09H05K3/46
    • PURPOSE:To obtain a low temperature baked ceramic multilayer board which is excellent in bonding strength and soldering wetness and allows high density fine patterns to be thereon formed by coating a ceramic green sheet baked at a low temperature with a conductive paste in which predetermined amounts of Ag, Pd, Cr, RuO2, Rh are mixed and by baking the coated ceramic green sheet at a predetermined temperature. CONSTITUTION:Materials such as a low temperature baked ceramic, an organic binder, a plasticizer, and a solution are converted into a slurry in a ball mill and formed into a green sheet by a doctor blade method. A conductive paste is prepared by mixing powders of Ag, Pd, Cr, RuO2, and Rh together with an organic vehicle. The ratio of addition of these powders with the total of Ag and Pd being 100 parts by weight are as follows: 70-100 parts by weight for Ag, 0-30 parts by weight for Pd, 0.01-8.0 parts by weight for Cr, and X and Y parts by weight for RuO2 and Rh, respectively, X and Y being within the range determined by the following formulas: (-1/7)X+1.0>=Y>=-0.05X+0.01, X>0, Y>=0 (where, X is a value in parts by weight for RuO2 and Y is a value in parts by weight for Rh). The obtained paste is screen-printed on the ceramic green sheet, stacked where necessary, and thin backed at 800-1000 deg.C.