会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明专利
    • Measuring method of concentration and molecular weight distribution of glue and gelatin
    • GLUE和GELATIN浓度和分子量分布测定方法
    • JP2007064990A
    • 2007-03-15
    • JP2006334164
    • 2006-12-12
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • TAGUCHI TAKEOKOMODA YASUOOKADA KENZOHATA HIROSHIKURIHARA YOSHIO
    • G01N30/88G01N30/26G01N30/46
    • PROBLEM TO BE SOLVED: To provide a measuring method of concentration and molecular weight distribution of glue and gelatin in liquid, especially glue and gelatin of low molecular weight.
      SOLUTION: In this measuring method, the concentration or molecular weight distribution of the glue or the gelatin contained in an electrolytic solution containing an electrolyte component using high-speed liquid chromatography. The glue or gelatin is separated from the electrolyte component in the electrolytic solution using a pretreatment column as a column of high-speed liquid chromatography. The liquid containing the glue or gelatin with the electrolyte component separated is introduced into another column filled with a filling agent of size exclusion mode, and the glue or gelatin is separated according to the molecular weight or molecular weight distribution. The liquid containing the separated glue or gelatin is subsequently introduced into a detector.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供液体,特别是低分子量的胶和明胶中胶和明胶的浓度和分子量分布的测量方法。 解决方案:在该测量方法中,使用高速液相色谱法,包含在含有电解质组分的电解液中的胶水或明胶的浓度或分子量分布。 使用预处理柱作为高速液相色谱柱,将胶或明胶与电解液中的电解质成分分离。 将含有分离的电解质成分的胶或明胶的液体引入到填充有尺寸排阻模式的填充剂的另一个柱中,并根据分子量或分子量分布分离胶或明胶。 随后将含有分离的胶或明胶的液体引入检测器。 版权所有(C)2007,JPO&INPIT
    • 8. 发明专利
    • Mold for forming wiring board and its manufacturing method
    • 用于成型布线的模具及其制造方法
    • JP2006339366A
    • 2006-12-14
    • JP2005161618
    • 2005-06-01
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • KAJINO HITOSHITAGUCHI TAKEOSATO KANJIISHII MASATO
    • H05K3/00
    • PROBLEM TO BE SOLVED: To provide a mold used for forming a wiring pattern by a so-called imprinting method and to provide a manufacturing method of the mold. SOLUTION: A mold for forming wiring board 10 is provided with a support substrate and a printed pattern formed by making it project to one surface of the support substrate 12. Cross section width of a support substrate-side in the same cross section of the printed pattern is wider than that of a tip-side. The printed pattern can be formed by selectively etching a metal layer formed on the surface of the support substrate. A gap where a wiring pattern is formed can easily be formed by the printed pattern whose cross section shape is trapezoid. The wiring pattern and a via hole can simultaneously be formed by using the mold for forming substrate. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供用于通过所谓的压印方法形成布线图案的模具,并提供模具的制造方法。 解决方案:用于形成布线板10的模具设置有支撑基板和通过使其突出到支撑基板12的一个表面而形成的印刷图案。支撑基板侧的截面宽度在同一横截面 的印刷图案比尖端侧的图案宽。 可以通过选择性地蚀刻形成在支撑基板的表面上的金属层来形成印刷图案。 通过横截面形状为梯形的印刷图案可以容易地形成布线图案形成的间隙。 可以通过使用用于形成基板的模具同时形成布线图案和通孔。 版权所有(C)2007,JPO&INPIT