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1. 发明专利

JP2014141741A Copper alloy for electronic/electrical device, copper alloy thin sheet for electronic/electrical device, conductive component for electronic/electrical device and terminal 有权
标题翻译：用于电子/电气设备的铜合金，用于电子/电气设备的铜合金薄片，用于电子/电气设备和终端的导电组件
公开(公告)号：JP2014141741A
公开(公告)日：2014-08-07
申请号：JP2013252331
申请日：2013-12-05
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社 , Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： MAKI KAZUMASA , MORI HIROYUKI , YAMASHITA DAIKI
IPC分类号： C22C9/04 , C22F1/00 , C22F1/02 , C22F1/08 , H01B1/02 , H01B5/02 , H01R13/03
CPC分类号： H01B1/026 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/20 , C22C9/00 , C22C9/04 , C22C9/06 , C22F1/08 , C23C2/08 , C23C30/00 , C23C30/005 , H01B5/02 , Y10T428/12 , Y10T428/12431 , Y10T428/12438 , Y10T428/12715 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy for an electronic/electrical device that is excellent in resistance property to stress relaxation and balance of proof stress and bending, has excellent bending workability even for bending so that a bending axis extends in a direction perpendicular to a rolling direction, and is suitable for a conductive component for an electronic/electrical device.SOLUTION: A copper alloy for an electronic/electrical device contains more than 2.0 mass% and 15.0 mass% or less of Zn, 0.10 mass% or more and 0.90 mass% or less of Sn, 0.05 mass% or more and less than 1.00 mass% of Ni, 0.001 mass% or more and less than 0.100 mass% of Fe and 0.005 mass% or more and 0.100 mass% or less of P, and the balance is composed of Cu and inevitable impurities. The copper alloy satisfies 0.002≤Fe/Ni
摘要翻译：要解决的问题：为了提供一种用于电子/电气设备的铜合金，其具有优异的耐应力松弛性和抗平衡应力和弯曲性，即使弯曲也具有优异的弯曲加工性，使得弯曲轴在垂直方向上延伸适用于电子/电气设备的导电部件。解决方案：用于电子/电气设备的铜合金含有大于2.0质量％和15.0质量％以下的Zn，0.10质量％以上，Sn：0.05质量％以上且小于1.00质量％，Fe：0.001质量％以上且小于0.100质量％，P：0.005质量％以上0.100质量％以下，余量由Cu和不可避免的杂质组成。该铜合金的原子比为0.002≤Fe/ Ni <1.500,3.0 <（Ni + Fe）/ P <100.0，0.10

4. 发明专利

JP4927963B2 Surface treated copper foil, its production method and a copper-clad laminated substrate 有权
公开(公告)号：JP4927963B2
公开(公告)日：2012-05-09
申请号：JP2010012244
申请日：2010-01-22
申请人：古河電気工業株式会社 , 新日鐵化学株式会社
发明人：岳夫宇野 , 公一服部 , 哲藤澤
IPC分类号： C25D7/06 , B32B15/01 , B32B15/08 , B32B15/088 , H05K1/09
CPC分类号： C25D5/34 , B32B15/01 , B32B15/08 , B32B2457/00 , C22C19/002 , C22C19/03 , C25D3/562 , C25D5/48 , H05K3/384 , H05K2201/0154 , Y10T156/10 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12535 , Y10T428/12556 , Y10T428/12792 , Y10T428/12882 , Y10T428/1291
摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 µm or below. On the roughened surface, an Ni-Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 µm, a height of 0.6-1.8 µm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 µm. The aforesaid Ni-Zn alloy layer has a Zn content of 6-30 wt% and a Zn deposition amount of 0.08 mg/dm 2 or more.

5. 发明专利

JPWO2010010893A1 表面処理銅箔及び銅張積層板有权
公开(公告)号：JPWO2010010893A1
公开(公告)日：2012-01-05
申请号：JP2010521714
申请日：2009-07-22
申请人：古河電気工業株式会社
发明人：哲藤澤 , 哲藤澤 , 鈴木　裕二 , 裕二鈴木 , 岳夫宇野 , 岳夫宇野
IPC分类号： C25D7/06 , B32B15/08 , B32B27/34
CPC分类号： H05K3/384 , B32B15/01 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2255/06 , B32B2255/205 , B32B2307/20 , B32B2307/306 , B32B2307/50 , B32B2307/538 , B32B2307/714 , B32B2457/08 , C22C19/03 , C25D3/562 , C25D7/0614 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12882 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993
摘要：ポリイミドに対する銅箔との接着強度、耐酸性、エッチング性を全て満足する表面処理銅箔、並びに該表面処理銅箔を用いた積層回路基板を提供するため、未処理銅箔の少なくとも片面にNi-Zn合金を付着してなる表面処理銅箔であって、Zn含有率(wt%)=Zn付着量/(Ni付着量+Zn付着量)×100が6%以上15%以下で、かつ、Zn付着量が0.08mg/dm2以上である表面処理銅箔、あるいは、未処理銅箔の少なくとも片面にNi-Zn合金を付着してなる表面処理銅箔をポリイミドフィルムに貼り合せたCCLであって、該CCLは、前記銅箔表面に付着のNi-Zn合金中のZn含有率(wt%)=Zn付着量/(Ni付着量+Zn付着量)×100が6%以上15%以下で、かつ、Zn付着量が0.08mg/dm2以上である表面処理銅箔とする。

6. 发明专利

JP4802895B2 A method of manufacturing a cast iron member, cast iron member, and the engine for a vehicle 有权
公开(公告)号：JP4802895B2
公开(公告)日：2011-10-26
申请号：JP2006185846
申请日：2006-07-05
申请人：トヨタ自動車株式会社
发明人：健治木寺 , 稔河崎 , 善統石川 , 耕平谷中
IPC分类号： B23K26/34 , B23K26/20 , B23K35/30 , B23K103/06 , C21D1/09 , C21D5/00 , C22C9/06 , F01L3/02
CPC分类号： F01L3/04 , B23K26/32 , B23K26/342 , B23K35/0238 , B23K35/30 , B23K35/302 , B23K2203/06 , B23K2203/50 , B32B15/015 , C21D1/09 , C21D5/00 , C21D2221/10 , C21D2251/02 , C22C9/06 , F01L3/02 , F01L2003/255 , F01L2003/256 , F01L2101/00 , F01L2103/00 , F01L2820/01 , Y10T29/4927 , Y10T29/49272 , Y10T29/49298 , Y10T29/49306 , Y10T428/12882
摘要： There is provided a method for manufacturing a cast iron member in which the production of gas defects such as blowholes or pinholes in a clad layer formed on the surface of a cast iron material can be reduced, and the generation of bead cracks in the clad layer can be restrained. In the method for manufacturing a cast iron member, including a step of forming the clad layer by melting a material for cladding by means of irradiation of a laser emitted from a laser irradiation device and by depositing the melted material on the surface of a part of the cast iron material, the step of forming the clad layer is performed by using a material the main ingredient of which is a copper element as the material for cladding so that when the clad layer is formed, a hardened layer having a thickness of 0.01 to 2.0 mm is formed on the surface of the cast iron material.

9. 发明专利

JP2008012564A Method for production of cast iron-made member, cast iron-made member, and engine for vehicle 有权
标题翻译：铸铁铸铁件，铸铁件及其发动机的生产方法
公开(公告)号：JP2008012564A
公开(公告)日：2008-01-24
申请号：JP2006185846
申请日：2006-07-05
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAWASAKI MINORU , YANAKA KOHEI , KIDERA KENJI , ISHIKAWA YOSHIMUNE
IPC分类号： B23K26/34 , B23K26/42 , B23K35/30 , B23K103/06 , C21D1/09 , C21D5/00 , C22C9/06 , F01L3/02
CPC分类号： F01L3/04 , B23K26/32 , B23K26/342 , B23K35/0238 , B23K35/30 , B23K35/302 , B23K2203/06 , B23K2203/50 , B32B15/015 , C21D1/09 , C21D5/00 , C21D2221/10 , C21D2251/02 , C22C9/06 , F01L3/02 , F01L2003/255 , F01L2003/256 , F01L2101/00 , F01L2103/00 , F01L2820/01 , Y10T29/4927 , Y10T29/49272 , Y10T29/49298 , Y10T29/49306 , Y10T428/12882
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a cast iron-made member capable of reducing occurrence of gas defects such as blow holes and pinholes in a build-up layer formed on the surface of a cast iron material, and suppressing occurrence of bead cracks in the build-up layer. SOLUTION: The manufacturing method for the cast iron-made member includes a step of forming a build-up layer by melting a material for build-up weld by irradiating the material with laser beams, and depositing a part of the molten material on the surface of a part of a cast-iron material to form a build-up layer. A material mainly composed of a copper element is used as the material for the build-up weld. When the build-up layer is formed, the step of forming the build-up layer is performed so that a quenched layer having the thickness of 0.01-2.0mm is formed on the surface of the cast-iron material. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够减少形成在铸铁材料表面上的积聚层中发生气体缺陷如气孔和针孔的铸铁件的制造方法，以及抑制积层中的珠粒裂纹的发生。＆lt; P＆gt;解决方案：铸铁构件的制造方法包括通过用激光束照射材料来熔化用于积聚焊接的材料来形成堆积层的步骤，并且将一部分熔融材料在铸铁材料的一部分的表面上形成堆积层。使用主要由铜元素组成的材料作为堆焊焊缝的材料。当形成堆积层时，进行形成堆积层的步骤，使得在铸铁材料的表面上形成具有0.01-2.0mm厚度的淬火层。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2003347149A Metal transfer sheet, its manufacturing process and method for manufacturing ceramic capacitor 审中-公开
标题翻译：金属转印片及其制造工艺及制造陶瓷电容器的方法
公开(公告)号：JP2003347149A
公开(公告)日：2003-12-05
申请号：JP2002148469
申请日：2002-05-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ISHIZAKA HITOSHI , YAMAMOTO YASUHIKO , OUCHI KAZUO , ODA TAKASHI , OKEYUI TAKUJI
IPC分类号： H01G4/12 , C23C28/00 , C25D1/04 , C25D5/34 , H01G4/30 , H05K1/03 , H05K3/20
CPC分类号： C23C28/023 , C25D1/04 , C25D5/34 , H05K1/0306 , H05K3/205 , Y10T428/12882 , Y10T428/1291
摘要： PROBLEM TO BE SOLVED: To provide a metal transfer sheet capable of easy and reliable transfer with a low stripping force, its manufacturing method, and a method for manufacturing a ceramic capacitor in which a small and highly reliable thin layer ceramic capacitor can be manufactured with high production efficiency by transferring a metal layer using the metal transfer sheet. SOLUTION: After a first metal layer 2 is formed on a carrier film 1 by sputtering or electrolytic plating, it is immersed into a plating bath and a passive state film 3 is formed by applying a voltage while setting an anode on the first metal layer 2 side. Subsequently, polarity is inverted and a second metal layer 4 is formed by applying a voltage while setting a cathode on the passive state film 3 side. A metal transfer sheet 5 where the first metal layer 2 and the second metal layer 4 are layered through the passive state film 3 is obtained and the second metal layer 4 is transferred as an inner electrode to a ceramic green sheet 11. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够以低剥离力容易且可靠地转印的金属转印片，其制造方法和陶瓷电容器的制造方法，其中小而高可靠性的薄层陶瓷电容器可以通过使用金属转印片转印金属层而以高生产效率制造。解决方案：在通过溅射或电解电镀在载体膜1上形成第一金属层2之后，将其浸入电镀槽中，并且通过施加电压来形成无源状态膜3，同时将阳极设置在第一金属层2侧。随后，极性反转，并且通过施加电压而形成第二金属层4，同时在被动状态膜3侧设置阴极。得到第一金属层2和第二金属层4通过被动状态膜3层叠的金属转印片5，将第二金属层4作为内部电极转印到陶瓷生片11上。版权所有（C）2004，JPO

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