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1. 发明专利

JP2007146289A Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil 审中-公开
标题翻译：电解铜箔制造方法，使用电解铜箔制造的表面处理铜箔和使用电解铜箔或表面处理铜箔制造的铜箔层压板制造的电解铜箔
公开(公告)号：JP2007146289A
公开(公告)日：2007-06-14
申请号：JP2006294778
申请日：2006-10-30
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： DOBASHI MAKOTO , MATSUDA MITSUYOSHI , TOMONAGA SAKIKO , SAKAI HISAO , SAKATA TOMOHIRO , TATSUOKA AYUMI , YOSHIOKA ATSUSHI , HATA HIROSHI , MOGI AKIRA , TAGUCHI TAKEO
IPC分类号： C25D1/04 , C25C1/12
CPC分类号： C25D3/38 , C25D1/04 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacture of an electrolytic copper foil having a lower profile compared to a conventional, commercially available low-profile electrolytic copper foil and also having excellent mechanical strength, with good efficiency.
SOLUTION: The method comprises electrolyzing a sulfate-type copper electrolyte solution containing a quaternary ammonium salt polymer having a cyclic structure and a chlorine to form the electrolytic copper foil, wherein the quaternary ammonium salt polymer to be added to the sulfate-type copper electrolyte solution is a DDAC polymer composed of two or more monomer units. Preferably, the quaternary ammonium salt polymer is a diaryldimethylammonium chloride having a number average molecular weight of 300 to 10,000. Preferably, the sulfate-type copper electrolyte solution comprises bis(3-sulfopropyl)disulfide or 3-mercapto-1-propanesulfonic acid which has a mercapto group.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造与现有的市售薄膜电解铜箔相比具有较低外形的电解铜箔的方法，并且具有优异的机械强度，效率高。解决方案：该方法包括电解含有具有环状结构和氯的季铵盐聚合物的硫酸盐型铜电解质溶液以形成电解铜箔，其中加入硫酸盐型的季铵盐聚合物铜电解质溶液是由两个或多个单体单元组成的DDAC聚合物。优选地，季铵盐聚合物是数均分子量为300〜10,000的二芳基二甲基氯化铵。优选地，硫酸盐型铜电解质溶液包含具有巯基的二（3-磺丙基）二硫化物或3-巯基-1-丙磺酸。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2014005545A Electrolytic copper foil with carrier foil, method for manufacturing electrolytic copper foil with carrier foil and copper clad laminate obtained using electrolytic copper foil with carrier foil 有权
标题翻译：具有载体箔的电解铜箔，用载体膜制造电解铜箔的方法和使用带有载体箔的电解铜箔获得的铜箔层压板
公开(公告)号：JP2014005545A
公开(公告)日：2014-01-16
申请号：JP2013179909
申请日：2013-08-30
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： TSUYOSHI HIROAKI , OBATA SHINICHI , TATSUOKA AYUMI
IPC分类号： C25D7/06 , C25D1/04 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic copper foil with a peelable type carrier foil, capable of easily peeling the carrier foil even when heated at a temperature over 300°C.SOLUTION: In an electrolytic copper foil 1 with a carrier foil, having a layer structure of a carrier foil 2, a junction interface layer 3, a heatproof metal layer 5 and an electrolytic copper foil layer 4, an electrolytic copper foil having a predetermined surface roughness (Rzjis), glossiness [Gs(60°)], etc., is used as the carrier foil. In a GDS analyser, used are the electrolytic copper foil with the carrier foil etc., satisfying a relationship of ([W2]-[W1])/[W1]≤0.3, where W1 represents the half width of a peak when a component profile in a depth direction of the heatproof metal layer is measured toward a carrier foil side from an electrolytic copper foil layer side of the electrolytic copper foil with a carrier foil, and W2 represents the half width of a peak when a component profile in a depth direction of the heatproof metal layer is measured after the electrolytic copper foil with a carrier foil is heated at a temperature of 300°C.
摘要翻译：要解决的问题：提供具有剥离型载体箔的电解铜箔，即使在300℃以上的温度下加热也能够容易地剥离载体箔。溶解性：在具有载体箔的电解铜箔1中，具有载体箔2，接合界面层3，耐热金属层5和电解铜箔层4的层结构，具有预定表面粗糙度（Rzjis），光泽度[Gs（60°）]的电解铜箔，等用作载体箔。在GDS分析仪中，使用满足（[W2] - [W1]）/ [W1]≤0.3的关系的载体箔等的电解铜箔，其中，W1表示当成分在具有载体箔的电解铜箔的电解铜箔层侧向载体箔侧测量耐热金属层的深度方向的轮廓，W2表示深度的构件轮廓的峰的半值宽度在具有载体箔的电解铜箔在300℃的温度下加热之后，测量耐热金属层的方向。

3. 发明专利

JP2014053342A Manufacturing method of printed wiring board and the printed wiring board 审中-公开
标题翻译：印刷线路板和印刷线路板的制造方法
公开(公告)号：JP2014053342A
公开(公告)日：2014-03-20
申请号：JP2012194738
申请日：2012-09-05
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： YOSHIKAWA KAZUHIRO , TSUYOSHI HIROAKI , TATSUOKA AYUMI
IPC分类号： H05K3/42 , H05K1/11 , H05K3/00 , H05K3/40
CPC分类号： H05K3/427 , H05K1/0271 , H05K3/0035 , H05K3/0038 , H05K2203/0554
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board with which, even when performing inter-layer connection between metal foil layers provided on both sides of a thin insulation layer through a bottomed via hole, satisfactory inter-layer connection can be performed while suppressing warping of a double-sided metal-coated laminate and dispersion in a hole diameter or hole shape, and the printed wiring board.SOLUTION: There are provided a manufacturing method of a printed wiring board and the printed wiring board. The manufacturing method of the printed wiring board includes: a via hole forming step of irradiating a surface of a one-side carrier foil with a laser to form a via hole with a bottom with a metal foil layer on the other side as a bottom, with respect to a double-sided metal-clad laminate comprising metal foil layers and carrier foils of which the thickness is 15 μm or less in order from a side of an insulation layer of 200 μm or less on both sides of the insulation layer; and a carrier foil exfoliation step of exfoliating the carrier foils from surfaces of the metal foil layers after the via hole with the bottom is formed.
摘要翻译：要解决的问题：提供一种印刷电路板的制造方法，即使在通过有底通孔在薄绝缘层的两侧设置的金属箔层之间进行层间连接时，也能够良好地进行层间连接同时抑制双面金属包覆层压板的翘曲和孔直径或孔形状的分散体以及印刷线路板。解决方案：提供印刷线路板和印刷线路板的制造方法。印刷布线板的制造方法包括：通孔形成步骤，用激光照射单面载体箔片的表面，形成具有底部的通孔，另一侧的金属箔层作为底部，相对于包含金属箔层和厚度为15μm以下的载体箔的双面金属覆层层叠体，从绝缘层两侧的绝缘层的一侧开始依次为200μm以下; 并且形成在具有底部的通孔之后，将金属箔层的表面剥离载体箔的载体箔剥离步骤。

4. 发明专利

JP2014080636A Surface-treated copper foil, method of producing surface-treated copper foil, anode collector and anode material for nonaqueous secondary battery 有权
标题翻译：表面处理铜箔，生产表面处理铜箔的方法，非阳极二次电池的阳极收集器和阳极材料
公开(公告)号：JP2014080636A
公开(公告)日：2014-05-08
申请号：JP2012227367
申请日：2012-10-12
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： TASHIRO MICHI , TATSUOKA AYUMI
IPC分类号： C23C30/00 , C23C10/28 , C25D5/50 , H01M4/64 , H01M4/66
CPC分类号： C22C9/00 , B32B15/01 , C22C18/00 , C22F1/00 , C22F1/08 , C23C22/05 , C25D1/04 , C25D3/38 , C25D3/565 , C25D5/50 , C25D7/0614 , H01M4/64 , H01M4/661 , H01M10/052 , H05K1/09 , H05K3/385 , H05K3/389 , H05K2201/0355 , H05K2203/0726 , H05K2203/1194
摘要： PROBLEM TO BE SOLVED: To provide a surface-treated copper foil causing less deterioration of the tensile strength even when subjected to a high-temperature heat treatment for a long time, a method of producing a surface-treated copper foil, a collector using the surface-treated copper foil and an anode material for nonaqueous secondary batteries.SOLUTION: A surface-treated copper foil has a surface-treated layer containing 20 mg/m-1000 mg/m, per side, of zinc on both sides of a copper foil containing a total content of 100 ppm or more of one or more minor ingredients selected from carbon, sulfur, chlorine and nitrogen and is subjected to a pre-annealing treatment in which heating is performed in the temperature range of 200-280°C.
摘要翻译：要解决的问题：即使长期进行高温热处理，即使长时间进行高温热处理也能够提供拉伸强度降低变差的表面处理铜箔，表面处理铜箔的制造方法，使用表面处理铜箔和非水二次电池用阳极材料。溶液：表面处理铜箔的表面处理层每侧含有20mg / m-1000mg / m 2的锌两面的锌包含总含量为100ppm以上的一种或多种选自碳，硫，氯和氮的次要成分的箔，并进行在200-280℃的温度范围内进行加热的预退火处理。

5. 发明专利

JP2010222657A Electrolytic copper foil with carrier foil, method of manufacturing electrolytic copper foil with carrier foil and copper-clad laminate obtained by using electrolytic copper foil with carrier foil 有权
标题翻译：具有载体箔的电解铜箔，使用电解铜箔与载体箔制备的具有载体箔和铜箔层压体的电解铜箔的方法
公开(公告)号：JP2010222657A
公开(公告)日：2010-10-07
申请号：JP2009072381
申请日：2009-03-24
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： TSUYOSHI HIROAKI , OBATA SHINICHI , TATSUOKA AYUMI
IPC分类号： C25D7/06 , C25D3/38
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic copper foil with carrier foil of peelable type capable of easily peeling a carrier foil even when being heated at a temperature exceeding 300°C. SOLUTION: The electrolytic copper foil with carrier foil having the layer configuration of carrier foil 2/joint interface layer 3/heat-resistant metal layer 5/electrolytic copper foil layer 4 satisfies the relation of ([W2]-[W1])/[W1]≤0.3, wherein half-value width of a peak in the normal state when a depth direction profile of the heat-resistant metal component toward the carrier foil side from the electrolytic copper foil layer side of the electrolytic copper foil with carrier foil is measured by using a GDS analytic instrument is defined as W1, and half-value width of the same peak when the depth direction profile after heating the electrolytic copper foil with carrier foil for 120 min in an atmospherical environment of 300°C is defined as W2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在超过300℃的温度下加热时，也可以提供一种具有能够容易地剥离载体箔的能剥离型载体箔的电解铜箔。解决方案：具有载体箔2 /接合界面层3 /耐热金属层5 /电解铜箔层4的层构造的载体箔的电解铜箔满足（[W2] - [W1] ）/ [W1]≤0.3，其中当耐热金属成分朝向载体箔侧的深度方向分布与电解铜箔的电解铜箔层侧的正常状态下的峰值的半值宽度与通过使用GDS分析仪器定义为载体箔，并且在300℃的大气环境下用载体箔加热电解铜箔120分钟后的深度方向分布，相同峰的半值宽度为定义为W2。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2007131909A Copper electrolytic solution used for producing electrolytic copper foil, and electrolytic copper foil obtained by using the copper electrolytic solution 有权
标题翻译：用于生产电解铜箔的铜电解液和使用铜电解液获得的电解铜箔
公开(公告)号：JP2007131909A
公开(公告)日：2007-05-31
申请号：JP2005325717
申请日：2005-11-10
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： DOBASHI MAKOTO , MATSUDA MITSUYOSHI , SAKAI HISAO , TOMONAGA SAKIKO , SAKATA TOMOHIRO , TATSUOKA AYUMI
IPC分类号： C25C1/12 , B32B15/08
CPC分类号： Y02P10/236
摘要： PROBLEM TO BE SOLVED: To provide a copper electrolytic solution which stably imparts an electrolytic copper foil a lower profile than that of a low profile electrolytic copper foil which has been conventionally supplied in a market. SOLUTION: The adopted sulfuric acid-based copper electrolytic solution for achieving the purpose includes Janus green added to a copper electrolytic solution for producing the low profile electrolytic copper foil, which is an acidic copper sulfate electrolytic solution containing 3-mercapto-1-propane sulfonic acid, a polymer of a quaternary ammonium salt having a cyclic structure, and chlorine. A method for producing the electrolytic copper foil includes carrying out electrolysis in the sulfuric acid-based copper electrolytic solution at a predetermined temperature and with a predetermined current density. The electrolytic copper foil is obtained by the production method. A surface-treated copper foil is obtained by subjecting the deposition face of the electrolytic copper foil to one or more treatments selected from among roughening treatment, rust-preventing treatment, and silane coupling treatment. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种铜电解液，该铜电解溶液稳定地赋予电解铜箔低于通常在市场上供应的低剖面电解铜箔的外形。解决方案：用于实现该目的的所采用的硫酸基铜电解液包括将Janus green加入到用于生产低电解铜箔的铜电解液中，该薄铜电解铜箔是含有3-巯基-1 丙烷磺酸，具有环状结构的季铵盐的聚合物和氯。电解铜箔的制造方法包括在规定的温度和规定的电流密度下在硫酸系铜电解液中进行电解。电解铜箔通过制造方法得到。通过对电解铜箔的沉积面进行从粗化处理，防锈处理和硅烷偶联处理中选择的一种或多种处理而获得表面处理铜箔。版权所有（C）2007，JPO＆INPIT

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