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1. 发明专利

JP2014204006A 電力用半導体装置有权
标题翻译：功率半导体器件
公开(公告)号：JP2014204006A
公开(公告)日：2014-10-27
申请号：JP2013079786
申请日：2013-04-05
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： SUDO SHINGO , ASADA SHINSUKE , ARAKI TAKAO
IPC分类号： H01L25/07 , H01L21/60 , H01L23/29 , H01L25/18
CPC分类号： H01L24/40 , H01L24/37 , H01L2224/36 , H01L2224/376 , H01L2224/40 , H01L2224/40137 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2924/00014 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/84801 , H01L2224/8485
摘要：【課題】従来に比べて生産性が高く、長期にわたる動作信頼性を確保可能な電力用半導体装置を提供する。【解決手段】複数の電力用半導体素子3、4を実装した絶縁基板1と、この絶縁基板に対向して配置される両面配線のプリント基板7と、絶縁基板及びプリント基板を保持する樹脂筐体9と、プリント基板7の回路に接続される外部端子8と、絶縁基板1とプリント基板との間に設けられる可撓性端子6とを有し、可撓性端子は、2つの電力用半導体素子の電極間を接続する素子間接続部60と、素子間接続部に対して折れ曲がって延在し屈伸部61を有してプリント基板と電気的に接続する素子−回路接続部61Aとを有する。【選択図】図1
摘要翻译：要解决的问题：提供一种功率半导体器件，其操作可靠性长期可以确保，同时与现有技术相比提高生产率。解决方案：功率半导体器件具有绝缘基板1，其安装多个功率半导体元件3,4，布置成面向绝缘基板的双面布线的印刷电路板7，用于保持绝缘基板和印刷电路板的树脂壳体9，用于与印刷电路的电路连接的外部端子8 以及设置在绝缘基板1和印刷电路板之间的柔性端子6。柔性端子具有用于连接两个功率半导体元件的电极的元件间连接60以及通过弯曲到元件间连接而具有弯曲和拉伸部61的元件电路连接61A，并且与印刷电路板。

2. 发明专利

JP2008265163A Resin welded body, and its manufacturing method 有权
标题翻译：树脂焊接体及其制造方法
公开(公告)号：JP2008265163A
公开(公告)日：2008-11-06
申请号：JP2007111985
申请日：2007-04-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： FUJIMOTO SEIZO , HARA CHIKAFUMI , ASADA SHINSUKE , KOBAYASHI HIROSHI , TARUYA KIMIAKI
IPC分类号： B29C65/16
CPC分类号： B29C65/1635 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/24221 , B29C66/54 , B29C66/542 , B29C66/55 , B29C66/7392 , B29C66/7394 , B29C66/8322 , B29C66/836 , B29K2995/0027 , B29L2031/3481 , Y10T428/17 , Y10T428/19 , Y10T428/8305
摘要： PROBLEM TO BE SOLVED: To provide a resin welded body for which the sinking amount of a bonded section is highly precisely managed without requiring a highly precise control of a bonding process or an extremely high precise dimension management for a molten surface, and to provide its manufacturing method. SOLUTION: A first resin part 2 having absorbency with respect to a laser beam 5, and a second resin part 3 having permeability with respect to the laser beam are fitted. At the same time, the laser beam 5 is cast to a specified position from the first resin part side to weld the first and second resin parts, and the bonded section 4 is formed between both resin parts for this resin welded body. In the resin welded body, on either one of the first or second resin part, a protuberance 8 which regulates the sinking amount at the bonded section 4 by coming into contact with the other resin part at the time of welding is installed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种树脂焊接体，其不需要高度精确地控制熔融表面的接合过程或极高的精确尺寸管理，可以高度精确地管理接合部的下沉量，以及提供其制造方法。解决方案：安装相对于激光束5具有吸收性的第一树脂部分2和相对于激光束具有磁导率的第二树脂部分3。同时，将激光束5从第一树脂部分侧铸造到特定位置，以焊接第一和第二树脂部分，并且在两个用于该树脂焊接体的树脂部分之间形成接合部分4。在树脂焊接体中，在第一或第二树脂部分中的任一个上安装有通过在焊接时与另一个树脂部分接触来调节接合部4处的下沉量的突起8。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008260161A Resin welded object and its manufacturing method 有权
标题翻译：树脂焊接对象及其制造方法
公开(公告)号：JP2008260161A
公开(公告)日：2008-10-30
申请号：JP2007103068
申请日：2007-04-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ASADA SHINSUKE , HARA CHIKAFUMI , FUJIMOTO SEIZO , TARUYA KIMIAKI
IPC分类号： B29C65/16
CPC分类号： B29C66/3242 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1674 , B29C65/1696 , B29C65/7829 , B29C66/112 , B29C66/114 , B29C66/322 , B29C66/326 , B29C66/3282 , B29C66/542 , B29C66/71 , B29C66/7332 , B29C66/7392 , B29C66/81267 , B29C66/8322 , B29K2023/06 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2077/00 , B29K2081/04 , B29K2995/0027 , Y10T428/195 , Y10T428/8305 , B29C65/00 , B29K2071/00 , B29K2067/003
摘要： PROBLEM TO BE SOLVED: To obtain a manufacturing method for a resin welded object for preventing the falling-off of a rejected resin after laser welding even in the case of the occurrence of the rejected resin. SOLUTION: The manufacturing method of the resin welded object includes the process of superposing a resin part 2 pervious to a laser beam and a resin component 3 having absorbability with respect to the laser beam one upon another to form the mutual contact part 21 of both resin parts, the process of forming the closed space 6 adjacent to the contact part 21 so as to face one end part of the contact part 21 and the process of pressing both resin components mutually through the contact part 21, irradiating both resin components from the resin component 2 having laser beam permeability to heat the contact part 21 to melt the resin of the contact part 21 to melt the resin of the contact part 21, housing the resin 7 molten to be rejected from the contact part 21 in the closed space 6 and coagulating the resin molten at the contact part 21 to weld it to both resin components. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得即使在出现拒收树脂的情况下，也可以获得用于防止激光焊接后的拒绝树脂脱落的树脂焊接物体的制造方法。解决方案：树脂焊接物体的制造方法包括将可透过激光束的树脂部分2叠加并且相对于激光束具有吸收能力的树脂部件3彼此叠置以形成相互接触部分21的过程两个树脂部件的形成过程中，形成与接触部分21相邻以闭合接触部分21的一个端部的封闭空间6的过程以及通过接触部分21相互挤压两个树脂部件的过程，照射两个树脂部件从具有激光束透过性的树脂部件2加热接触部21，使接触部21的树脂熔融，熔融接触部21的树脂，将从被接触部21熔融的待被排出的树脂7收纳在封闭状态空间6，使在接触部21熔融的树脂凝固，将其熔合到两个树脂成分上。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007033047A Semiconductor pressure sensor 审中-公开
标题翻译：半导体压力传感器
公开(公告)号：JP2007033047A
公开(公告)日：2007-02-08
申请号：JP2005212438
申请日：2005-07-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ASADA SHINSUKE , NAKAMURA HIROSHI , TARUYA KIMIAKI
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , G01L19/0627 , G01L19/143 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor for simplifying a conveyer in a manufacturing line while dramatically enhancing manufacturing work efficiency to reduce a manufacturing cost. SOLUTION: This semiconductor pressure sensor is equipped with a semiconductor sensor chip 1 for detecting a pressure, a processing circuit IC2 for correcting and amplifying an electrical signal from the sensor chip 1, a sub-package 5 comprising a terminal 5b electrically connected to the sensor chip 1 and to the processing circuit IC2 by means of a bonding wire 3, and a housing 4 integrated by insert-mold forming and provided outside the sub-package 5. In this pressure sensor, the sub-package 5 has a mounting surface 5d formed thereon to be mounted with the sensor chip 1 and the processing circuit IC2. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于简化制造线中的输送机的半导体压力传感器，同时显着提高制造工作效率以降低制造成本。解决方案：该半导体压力传感器配备有用于检测压力的半导体传感器芯片1，用于校正和放大来自传感器芯片1的电信号的处理电路IC2，包括端子5b电连接的子组件5 通过接合线3和通过插入模具成形而一体化并设置在副包装5的外部的壳体4传递到传感器芯片1和处理电路IC2。在该压力传感器中，子包装5具有安装表面5d形成在其上以与传感器芯片1和处理电路IC2一起安装。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2014107378A Power semiconductor device 有权
标题翻译：功率半导体器件
公开(公告)号：JP2014107378A
公开(公告)日：2014-06-09
申请号：JP2012258490
申请日：2012-11-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TOKUMARU JUN , ASADA SHINSUKE , FUJINO JUNJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L24/72 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive, high-performance, and highly reliable power semiconductor device.SOLUTION: A power semiconductor device 100 comprises: a semiconductor element 3 for controlling a current; a circuit board 1 on which the semiconductor element is mounted; a printed circuit board 7 that is arranged oppositely to the circuit board and has conductor portions 6, 7a; and a flexible terminal 4 for electrically connecting the semiconductor element and the conductor portions of the printed circuit board. An end of the flexible terminal is bonded to the semiconductor element, and the other end of the flexible terminal is elastically in contact with the conductive portions of the printed circuit board.
摘要翻译：要解决的问题：提供廉价，高性能，高可靠性的功率半导体器件。解决方案：功率半导体器件100包括：用于控制电流的半导体元件3; 其上安装有半导体元件的电路板1; 印刷电路板7，其布置成与电路板相对并具有导体部分6,7a; 以及用于电连接印刷电路板的半导体元件和导体部分的柔性端子4。柔性端子的端部接合到半导体元件，并且柔性端子的另一端与印刷电路板的导电部分弹性地接触。

6. 发明专利

JP2011164057A Semiconductor pressure sensor, and method of manufacturing the same 审中-公开
标题翻译：半导体压力传感器及其制造方法
公开(公告)号：JP2011164057A
公开(公告)日：2011-08-25
申请号：JP2010030132
申请日：2010-02-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： DEO SHINICHI , YOSHIKAWA EIJI , ASADA SHINSUKE , TOKUNAGA TAKASHI
IPC分类号： G01L9/00 , B81B3/00 , B81C3/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor, capable of improving the destructive pressure resistance by reducing the stress concentration in the boundary between a part facing a recess and a part jointed to a first silicon substrate on the surface of a second silicon substrate facing the first silicon substrate, and to provide a method of manufacturing the semiconductor pressure sensor.
SOLUTION: This semiconductor pressure sensor includes the first silicon substrate 2 having a recess 8a in its one surface 3, the second silicon substrate 6 whose one surface 7 is joined to the first silicon substrate 2 so as to seal the recess 8a, a strain detecting element 13 formed on the other surface 12 of the second silicon substrate 6, and a first silicon oxide film 18 formed in a part of the one surface 7 of the second silicon substrate 6 that faces the recess 8a so as to cover the boundary between the part facing at least the recess 8a and the part joined to the one surface 3 of the first silicon substrate 2.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体压力传感器，其能够通过降低面向凹部的部分与与第一硅基板的表面上接合的部分之间的边界处的应力集中来提高耐破坏性，第二硅衬底面对第一硅衬底，并提供制造半导体压力传感器的方法。解决方案：该半导体压力传感器包括在其一个表面3中具有凹部8a的第一硅衬底2，其一个表面7与第一硅衬底2接合以密封凹部8a的第二硅衬底6，形成在第二硅衬底6的另一个表面12上的应变检测元件13和形成在第二硅衬底6的面向凹部8a的一个表面7的一部分上的第一氧化硅膜18，以覆盖至少面向凹部8a的部分和与第一硅衬底2的一个表面3接合的部分之间的边界。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2007040772A Semiconductor pressure sensor 审中-公开
标题翻译：半导体压力传感器
公开(公告)号：JP2007040772A
公开(公告)日：2007-02-15
申请号：JP2005223699
申请日：2005-08-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKAHATA YOSHIMITSU , NAKAMURA HIROSHI , TARUYA KIMIAKI , ASADA SHINSUKE
IPC分类号： G01L9/00
CPC分类号： H01L23/057 , G01L19/0084 , G01L19/141 , G01L19/147 , H01L23/24 , H01L24/45 , H01L24/48 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of reducing breakage of a bonding wire even in an environment having great temperature change or pressure actuation, and elongating a lifetime. SOLUTION: This semiconductor pressure sensor includes a resin package 1 having a recessed part 1a; a lead 2 whose one end is exposed to the recessed part 1a and whose other end is drawn out to the outside of the package 1, integrated with the package 1 by insert molding; a sensor chip 3 provided on the recessed part 1a, for detecting the pressure; and the bonding wire 4 for connecting electrically the sensor chip 3 to the lead 2. In the sensor, the recessed part 1a side of the interface between the lead 2 and the package 1 is coated by the first insulating protection resin part 6, and the bonding wire 4 is coated by the second protection resin part 7 which is softer than the first protection resin part 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供即使在具有大的温度变化或压力驱动的环境中也能够减少接合线断裂并延长使用寿命的半导体压力传感器。解决方案：该半导体压力传感器包括具有凹部1a的树脂封装1; 引线2的一端暴露于凹部1a，另一端被拉出到封装1的外部，通过嵌入成型与封装1一体化; 设置在凹部1a上用于检测压力的传感器芯片3; 以及用于将传感器芯片3电连接到引线2的接合线4.在传感器中，引线2和封装1之间的界面的凹部1a侧被第一绝缘保护树脂部6涂覆，接合线4由比第一保护树脂部分6软的第二保护树脂部分7涂覆。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2014082362A Method for manufacturing electronic device 有权
标题翻译：制造电子器件的方法
公开(公告)号：JP2014082362A
公开(公告)日：2014-05-08
申请号：JP2012229799
申请日：2012-10-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ASADA SHINSUKE , HAMAGUCHI TSUNEO , HAYASHI KENICHI , YAMAGUCHI YOSHIHIRO , ISHIBASHI HIDETOSHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device capable of forming a large-area solder bump in which height variations are suppressed.SOLUTION: A method for manufacturing an electronic device comprises the steps of: preparing a solder bump forming tool 1 in which a recess 2 is formed and a plate-like solder member 3; arranging the solder member 3 in the recess 2; arranging a substrate 4 including an electrode 5 or an electronic component so that the electrode 5 covers the recess 2 in which the solder member 3 is installed; and forming a solder bump by fixing the solder member 3 at the electrode 5 by melting the solder member 3 by heating.
摘要翻译：要解决的问题：提供一种能够形成其中抑制高度变化的大面积焊料凸块的电子器件的制造方法。解决方案：一种电子器件的制造方法，包括以下步骤：制备焊料凸块形成工具 1，其中形成凹部2和板状焊料3; 将焊料构件3设置在凹部2中; 布置包括电极5或电子部件的基板4，使得电极5覆盖其中安装有焊料部件3的凹部2; 以及通过将焊料3加热熔化而将焊料3固定在电极5上而形成焊锡凸块。

9. 发明专利

JP2014053363A Solder bump formation method 审中-公开
标题翻译：焊接形成方法
公开(公告)号：JP2014053363A
公开(公告)日：2014-03-20
申请号：JP2012195010
申请日：2012-09-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , ASADA SHINSUKE , HAYASHI KENICHI , YAMAGUCHI YOSHIHIRO
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a formation method of a solder bump which achieves high connection reliability.SOLUTION: A solder member, which is suctioned to be held, is disposed on an electrode of an electronic component or a substrate. Ultrasonic vibrations are applied to the solder member thereby forming a solder bump on the electrode.
摘要翻译：要解决的问题：提供一种能够实现高连接可靠性的焊料凸块的形成方法。解决方案：将被吸附的待被保持的焊料部件设置在电子部件或基板的电极上。超声振动被施加到焊料部件上，从而在电极上形成焊料凸块。

10. 发明专利

JP2013239512A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013239512A
公开(公告)日：2013-11-28
申请号：JP2012110397
申请日：2012-05-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KAJIWARA TAKANOBU , ASADA SHINSUKE , FUJINO JUNJI , SUDO SHINGO , TOKUMARU JUN
IPC分类号： H01L25/07 , H01L23/12 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce manufacturing cost and repair cost and which can achieve downsizing.SOLUTION: The semiconductor device comprises: an electrically insulating substrate 2 on which a semiconductor element 1 is mounted; a control substrate 5 on which an electronic component 7 relevant to the semiconductor element 1 is mounted; a spring terminal 10 for electrically connecting the semiconductor element 1 and the control substrate 5; and a positioning pin 9 for connecting one end of the spring terminal 10 and the control substrate 5. The spring terminal 10 includes an elastic part. The one end of the spring terminal 10 and the control substrate 5 are detachably fastened to each other by the positioning pin 9, and the other end of the spring terminal 10 and the electrically insulating substrate 2 come in contact with each other by elastic deformation of the elastic part of the spring terminal 10.
摘要翻译：要解决的问题：提供一种能够降低制造成本和修理成本并可实现小型化的半导体器件。解决方案：半导体器件包括：安装有半导体元件1的电绝缘基板2; 安装有与半导体元件1相关的电子部件7的控制基板5; 用于电连接半导体元件1和控制基板5的弹簧端子10; 以及用于连接弹簧端子10的一端和控制基板5的定位销9.弹簧端子10包括弹性部。弹簧端子10的一端和控制基板5通过定位销9可拆卸地彼此固定，并且弹簧端子10的另一端和电绝缘基板2通过弹性变形彼此接触弹簧端子10的弹性部分。

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