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1. 发明专利

JP2004156068A Vacuum deposition method, and vacuum deposition system 审中-公开
公开(公告)号：JP2004156068A
公开(公告)日：2004-06-03
申请号：JP2002320213
申请日：2002-11-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SATO NOBUO , SHINOHARA AKIHITO , YASUDA OSAMU , ISHIDA MIKIO , ADACHI HIROSHI
IPC分类号： C23C14/34 , G11B5/85
摘要： PROBLEM TO BE SOLVED: To provide a vacuum deposition method and a vacuum deposition system by which a vapor deposition film of high quality can be deposited even on a thin film-shaped support at high speed without causing melting by heat.
SOLUTION: In the vacuum deposition method, the film-shaped support is moved and transported while being fed to the vicinity of a vapor deposition source by a feed roll; further, static electricity is generated on the film-shaped support, and the evaporation source is heated and melted, and is evaporated toward the film-shaped support to perform vapor deposition; and further, static electricity is fed to the film-shaped support, and the vapor-deposited film-shaped support is coiled by a coiling roll while being stuck to a cooling means by the force of the static electricity and cooled. In this case, the electric charge amount in the film-shaped support stuck to the cooling means is measured, and the generation amount of the static electricity on the film-shaped support is feed back-controlled so that the electric charge amount in the film-shaped support is made fixed.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2006147391A Power-feeding conductive tape, its manufacturing method, and manufacturing method of solid electrolytic capacitor using it 有权
标题翻译：动力输送带，其制造方法和使用其的固体电解电容器的制造方法
公开(公告)号：JP2006147391A
公开(公告)日：2006-06-08
申请号：JP2004337090
申请日：2004-11-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TSUJI YASUNOBU , KURANUKI KENJI , NAGAOKA YOSHIYUKI , SHINOHARA AKIHITO
IPC分类号： H01B5/02 , C09J7/02 , C09J201/00 , H01G9/00 , H01G9/028 , H01G9/04
CPC分类号： H01G9/042 , C09J7/28 , C09J2201/602 , H01G9/15
摘要： PROBLEM TO BE SOLVED: To provide a power-feeding conductive tape manufacturable at a low material cost, without impairing the power feeding function in an electrolytic solution.
SOLUTION: By forming a power-feeding conductive tape, having an adhesive on one side of metallic base material foil having a positive electrode oxidation properties in an electrolytic solution or a corrosive property by a chemical reaction, and having, on the other side thereof, a metallic thin-film layer, that does not have a positive electrode oxidation properties in an electrolytic solution nor corrosive properties by a chemical reaction, this inexpensive power-feeding conductive tape allowing an inexpensive material for the metallic base material foil to be selected, without impairing the power feeding function in the electrolytic solution can be provided.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供以低成本制造的供电导电胶带，而不损害电解液中的供电功能。解决方案：通过形成供电导电带，在电解液中具有正极氧化性的金属基材箔的一面上具有粘合剂或通过化学反应具有腐蚀性，并且在另一方上具有粘合剂在电解液中不具有正极氧化性，化学反应的腐蚀性的金属薄膜层的这种廉价的供电用导电性带，使得廉价的金属基材箔的材料为可以提供不损害电解液中的供电功能的选择。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004253353A Manufacturing method of electrochemical element 审中-公开
公开(公告)号：JP2004253353A
公开(公告)日：2004-09-09
申请号：JP2003114824
申请日：2003-04-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NISHIMURA MASARU , ARAI NAOTO , OSHIMA TORU , OO FUMIO , SHINOHARA AKIHITO
IPC分类号： H01M2/26 , H01M4/139 , H01M10/04 , H01M10/05 , H01M10/0587 , H01M4/04 , H01M10/40
CPC分类号： Y02E60/122
摘要： PROBLEM TO BE SOLVED: To efficiently manufacture an electrochemical element having a simple structure, high reliability and a high electric capacity. SOLUTION: The method for manufacturing the electrochemical element comprises steps of successively providing long-size first and second electrode groups as a laminate while laminating the groups via separators; winding the laminate by a tabular bobbin 25; and cutting the laminate wound around the bobbin 25 at Y1, Y2 to obtain a plurality of laminated electrode plate groups. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2005264254A Metal evaporated film and metal evaporated member provided with the metal evaporated film and method for manufacturing the same 有权
标题翻译：金属蒸镀膜和金属蒸镀膜的金属蒸镀膜及其制造方法
公开(公告)号：JP2005264254A
公开(公告)日：2005-09-29
申请号：JP2004079875
申请日：2004-03-19
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IWAOKA KAZUO , SHINOHARA AKIHITO , NISHIGORI YOSHITOMO , YASUDA OSAMU
IPC分类号： C23C14/24 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a metal evaporated film with which the problem with the conventional metal evaporated film of difficulty in handling due to an extremely thin film thickness is solved, the film of a large film thickness can be formed and the bonding power to a carrier is high.
SOLUTION: The metal evaporated film is formed of the aggregate of columnar bodies 2 and the shape viewed from the surface is divided to microareas by cracks 2. When the film is effectively utilized as an electrode of electronic components, etc., the bonding to a base material can be intensified and the electrode of the large film thickness can be formed. Also, the transfer along the prescribed shape is possible at the time of transfer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种金属蒸镀膜，解决了由于极薄的膜厚而难以处理的常规金属蒸镀膜的问题，可以形成较大膜厚的膜，对载体的接合功率很高。解决方案：金属蒸镀膜由柱状体2的集合体形成，从表面观察的形状通过裂纹2分割为微区。当膜被有效地用作电子部件等的电极时，可以加强与基材的接合，可以形成大膜厚的电极。此外，沿着规定形状的转印在转印时是可能的。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004156069A Vacuum deposition method and vacuum deposition apparatus 有权
标题翻译：真空沉积方法和真空沉积装置
公开(公告)号：JP2004156069A
公开(公告)日：2004-06-03
申请号：JP2002320214
申请日：2002-11-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SATO NOBUO , SHINOHARA AKIHITO , YASUDA OSAMU , ISHIDA MIKIO , ADACHI HIROSHI
IPC分类号： C23C14/56 , G11B5/85
摘要： PROBLEM TO BE SOLVED: To provide a vacuum deposition method and a vacuum deposition apparatus which enable a vapor deposition film of high quality to be deposited even on a thin film-shaped support at high speed without causing the melting of the support by heat.
SOLUTION: In the vacuum deposition method, the film-shaped support is moved and transported by an intermediate roll while feeding the same to the vicinity of a vapor deposition source by a feed roll, and, an evaporation source is heated and melted, and is evaporated toward the film-shaped support to perform vapor deposition, and further, the vapor-deposited film-shaped support is wound by a winding roll while sticking the same to a cooling means, and performing cooling. In the vacuum deposition method, the intermediate roll and the winding roll are insulated from the film-shaped support.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种真空沉积方法和真空沉积装置，其能够使高质量的气相沉积膜甚至在薄膜状载体上高速沉积，而不会引起支撑体的熔化热。解决方案：在真空沉积方法中，通过中间辊将膜状载体移动并输送，同时通过进料辊将其送入气相沉积源附近，并将蒸发源加热熔化并向薄膜状支持体蒸发，进行蒸镀，另外，将蒸镀膜状支持体卷绕在卷绕辊上，同时将其粘贴在冷却机构上，进行冷却。在真空沉积方法中，中间辊和卷绕辊与膜状支撑体绝缘。版权所有（C）2004，JPO

6. 发明专利

JP2001279425A OIL MASKING DEVICE AND VACUUM DEPOSITION DEVICE PROVIDED WITH IT 失效
公开(公告)号：JP2001279425A
公开(公告)日：2001-10-10
申请号：JP2000093177
申请日：2000-03-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIYAMA JUN , SHINOHARA AKIHITO , KOBAYASHI YASUO , ITO ATSUSHI
IPC分类号： C23C14/04 , H01G4/015 , H01G4/18 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide an oil masking device in which the size of an opening part, through which masking oil sprayed from a masking roller passes, is minia turized and the width of mask layers on a polymer film can be made more thin, and the width of each mask layer, interval between the adjacent mask layers or shape of the opening part can easily and inexpensively be changed, and to provide a vacuum deposition devic provided with it. SOLUTION: This oil masking device is provided with a cylindrical masking roll 2 in which masking oil is fed to the inside, an opening part 21 provided on the circumference of the masking rill 2, through which the masking oil is discharged and a thin film 3 having through holes 31 for discharging of the masking oil, formed between the outer circumference of the masking roll and the film and overlapped with the opening part.

7. 发明专利

JPH0452606B2 失效
公开(公告)号：JPH0452606B2
公开(公告)日：1992-08-24
申请号：JP6935584
申请日：1984-04-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZAWA SHINICHI , OOSHIMA KUNIO , YAMAMURA SHIGENARI , NISHIKAWA KOREYASU , NOZU NORITO , SHINOHARA AKIHITO
IPC分类号： H01G4/228 , H01G4/18

8. 发明专利

JPS60220921A ELECTRONIC PART 失效
公开(公告)号：JPS60220921A
公开(公告)日：1985-11-05
申请号：JP6935584
申请日：1984-04-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZAWA SHINICHI , OOSHIMA KUNIO , YAMAMURA SHIGENARI , NISHIKAWA KOREYASU , NOZU NORITO , SHINOHARA AKIHITO
IPC分类号： H01G4/228 , H01G4/18

9. 发明专利

JPS629614A ELECTRONIC COMPONENT 失效
公开(公告)号：JPS629614A
公开(公告)日：1987-01-17
申请号：JP14957385
申请日：1985-07-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OOTA SATORU , SUGIURA NORIYUKI , NISHIKAWA KOREYASU , KOBAYASHI YASUO , SHINOHARA AKIHITO
IPC分类号： H01G4/18

10. 发明专利

JPS60192318A Film condenser 失效
公开(公告)号：JPS60192318A
公开(公告)日：1985-09-30
申请号：JP3166284
申请日：1984-02-22
申请人： Matsushita Electric Ind Co Ltd
发明人： NISHIKAWA KOREYASU , OOSHIMA KUNIO , YAMAMURA SHIGENARI , SUZAWA SHINICHI , NOZU NORITO , SHINOHARA AKIHITO
IPC分类号： H01G4/224 , H01G2/14 , H01G4/18

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