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1. 发明专利

JP2004156068A Vacuum deposition method, and vacuum deposition system 审中-公开
公开(公告)号：JP2004156068A
公开(公告)日：2004-06-03
申请号：JP2002320213
申请日：2002-11-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SATO NOBUO , SHINOHARA AKIHITO , YASUDA OSAMU , ISHIDA MIKIO , ADACHI HIROSHI
IPC分类号： C23C14/34 , G11B5/85
摘要： PROBLEM TO BE SOLVED: To provide a vacuum deposition method and a vacuum deposition system by which a vapor deposition film of high quality can be deposited even on a thin film-shaped support at high speed without causing melting by heat.
SOLUTION: In the vacuum deposition method, the film-shaped support is moved and transported while being fed to the vicinity of a vapor deposition source by a feed roll; further, static electricity is generated on the film-shaped support, and the evaporation source is heated and melted, and is evaporated toward the film-shaped support to perform vapor deposition; and further, static electricity is fed to the film-shaped support, and the vapor-deposited film-shaped support is coiled by a coiling roll while being stuck to a cooling means by the force of the static electricity and cooled. In this case, the electric charge amount in the film-shaped support stuck to the cooling means is measured, and the generation amount of the static electricity on the film-shaped support is feed back-controlled so that the electric charge amount in the film-shaped support is made fixed.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004156069A Vacuum deposition method and vacuum deposition apparatus 有权
标题翻译：真空沉积方法和真空沉积装置
公开(公告)号：JP2004156069A
公开(公告)日：2004-06-03
申请号：JP2002320214
申请日：2002-11-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SATO NOBUO , SHINOHARA AKIHITO , YASUDA OSAMU , ISHIDA MIKIO , ADACHI HIROSHI
IPC分类号： C23C14/56 , G11B5/85
摘要： PROBLEM TO BE SOLVED: To provide a vacuum deposition method and a vacuum deposition apparatus which enable a vapor deposition film of high quality to be deposited even on a thin film-shaped support at high speed without causing the melting of the support by heat.
SOLUTION: In the vacuum deposition method, the film-shaped support is moved and transported by an intermediate roll while feeding the same to the vicinity of a vapor deposition source by a feed roll, and, an evaporation source is heated and melted, and is evaporated toward the film-shaped support to perform vapor deposition, and further, the vapor-deposited film-shaped support is wound by a winding roll while sticking the same to a cooling means, and performing cooling. In the vacuum deposition method, the intermediate roll and the winding roll are insulated from the film-shaped support.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种真空沉积方法和真空沉积装置，其能够使高质量的气相沉积膜甚至在薄膜状载体上高速沉积，而不会引起支撑体的熔化热。解决方案：在真空沉积方法中，通过中间辊将膜状载体移动并输送，同时通过进料辊将其送入气相沉积源附近，并将蒸发源加热熔化并向薄膜状支持体蒸发，进行蒸镀，另外，将蒸镀膜状支持体卷绕在卷绕辊上，同时将其粘贴在冷却机构上，进行冷却。在真空沉积方法中，中间辊和卷绕辊与膜状支撑体绝缘。版权所有（C）2004，JPO

3. 发明专利

JPS5127436A 失效
公开(公告)号：JPS5127436A
公开(公告)日：1976-03-08
申请号：JP10036674
申请日：1974-08-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANAKA MASANOBU , EDA KAZUO , KAJITA HARUMASA , ISHIDA MIKIO , MATSUOKA MICHIO
IPC分类号： H01C7/12 , H01T1/14

4. 发明专利

JP2000282221A VACUUM DEPOSITION METHOD 失效
公开(公告)号：JP2000282221A
公开(公告)日：2000-10-10
申请号：JP8583699
申请日：1999-03-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIDA MIKIO , YASUDA OSAMU , NISHIGORI YOSHITOMO , MORIWAKI MICHIYASU , ISHIDA KENJI
IPC分类号： H01G4/015 , C23C14/24 , H01G4/18
摘要： PROBLEM TO BE SOLVED: To maintain the effect of preventing the deposition of a vapor depositing material on masking tape over the long length by retaining the distribution of the molecular weight of oil for preventing vapor deposition in the longitudinal direction. SOLUTION: As oil for preventing vapor deposition, liq. paraffin with molecular weight in the range of 194 to 562 is used. In the case the oil is evaporated by an evaporator, there is a tendency that the evaporation occurs from the low molecular part at first, and it deposits on masking tape, and by the deposition of the one with molecular weight part from 194 to 392 suitable for application on the tape, the effect of screening a vapor depositing material can be obtd. Oil on the high molecular side from 392 not only has the effect less, but also has the tendency to remain in the evaporator and cause sudden evaporation. Thus, fresh oil is fed by the amt. to be required, an oil exhausting mechanism is added on a space between the oil evaporator and an exhausting tank, and the amt. same as that to be fed is exhausted, by which the oil in the molecular weight part (from 194 to 392) in the range effective for screening the vapor depositing material can easily be maintained in the longitudinal direction.

5. 发明专利

JP2000178718A VACUUM DEPOSITING METHOD 失效
公开(公告)号：JP2000178718A
公开(公告)日：2000-06-27
申请号：JP36262698
申请日：1998-12-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIGORI YOSHITOMO , MORIWAKI MICHIYASU , ISHIDA MIKIO , YASUDA OSAMU , TAMAKI SHIGERU
IPC分类号： H01G4/015 , C23C14/04 , C23C14/24 , H01G4/18
摘要： PROBLEM TO BE SOLVED: To prevent the deposition of vapor depositing material onto a tape by executing atomizing or coating by contact transfer of oil for preventing vapor deposition on the face of a masking tape which runs together with a vapor depositing substrate while being brought into contact with it at a position on the upstream more than the vapor depositing position in a vacuum depositing chamber and the contact starting position with the vapor depositing substrate. SOLUTION: As oil for preventing vapor deposition, liq. paraffin of 194 to 562 molecular weight is preferable. A coating method in which an oil evaporator is used, and an endless tape is atomized with oil as vapor is preferable. At this time, the total molecular number of the liq. paraffin of 194 to 394 molecular weight is desirably controlled to 10 to 50% of the molecular number of the whole oil. A box of metal or the like is arranged at the back side of the tape at a position in which the oil is applied on the tape, and the scattering oil is trapped to suppress the increase of the pressure in the vacuum depositing chamber. In the case that the vapor deposition film resistance is 2±0.5 Ω/cm, the depositing thickness of Al in the masking tape is 0.2 mm, and vapor deposition of 32,000 m is made possible without generating the peeling and releasing of Al on the tape.

6. 发明专利

JPH10241994A SLIT METHOD OF LAMINATED FILM FOR LAMINATED FILM CAPACITOR 失效
公开(公告)号：JPH10241994A
公开(公告)日：1998-09-11
申请号：JP4194197
申请日：1997-02-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIYAMA SHIGERU , KIMURA YOSHIO , ISHIDA MIKIO
IPC分类号： H01G4/18 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To improve productivity and current-resistance of a capacitor by relaxing a compression force at an electrode formation part of a laminated film when pressed, and cutting the laminated film by moving a slit blade parallel to a cutting plane of the electrode formation part while it is tilted by a specified angle in the slit direction. SOLUTION: Both sides of an electrode formation part 12 of a laminated film 11 are suppressed from above with fixing plates 13 and 14. The fixing plates 13 and 14 are suppressed with such force as a film material is not moved at slit time with cylinders 15 and 16. A slit blade 18 is fixed with an upper part slit blade fixing block 19 and a lower part slit blade fixing block 20, and tilted by a specified angle in the slit direction while parallel to the cutting plane of the electrode formation part 12. Then, with a slit blade movement actuator, the slit blade 18 and fixing blocks 19 and 20 are moved in longitudinal direction to slit a plate-like film into strips.

7. 发明专利

JPS5111151A 失效
公开(公告)号：JPS5111151A
公开(公告)日：1976-01-29
申请号：JP8282374
申请日：1974-07-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAJITA HARUMASA , EDA KAZUO , TANAKA MASANOBU , ISHIDA MIKIO , MATSUOKA MICHIO
IPC分类号： H02H9/04 , H01C8/04 , H01T1/14 , H02H7/24

8. 发明专利

JP2002004035A VACUUM DEPOSITION APPARATUS, AND VACUUM DEPOSITION METHOD USING THE APPARATUS 失效
公开(公告)号：JP2002004035A
公开(公告)日：2002-01-09
申请号：JP2000179653
申请日：2000-06-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIDA MIKIO , YASUDA OSAMU , MORIWAKI MICHIYASU , TAMAKI SHIGERU , NISHIGORI YOSHITOMO
IPC分类号： C23C14/24 , H01G4/015 , H01G4/18 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus, and a vacuum deposition method which can efficiently remove a metal layer deposited on an inner circumferential surface of a masking tape and prevent an oil for preventing the vapor deposition from coming around an outer circumferential surface of the endless masking tape and adversely affecting a polymer film. SOLUTION: This vacuum deposition apparatus is provided with a metal layer peeling roll 10 which can be advanced/retracted between a first position at which a circumferential surface thereof is pressed against the outer circumferential surface of the masking tape 7 to allow the masking tape to meander and a second position at which the circumferential surface thereof is not pressed against the outer circumferential surface of the masking tape 7 not to impede the rotational traveling of the masking tape 7 so that the metal layer vapor- deposited on the inner circumferential surface of the endless masking tape 7 via the metal layer peeling oil is peeled.

9. 发明专利

JP2001155956A METHOD FOR SLITTING LAMINATED FILM FOR LAMINATED FILM CAPACITOR, AND APPARATUS THEREOF 失效
公开(公告)号：JP2001155956A
公开(公告)日：2001-06-08
申请号：JP2000353801
申请日：2000-11-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIYAMA SHIGERU , KIMURA YOSHIO , ISHIDA MIKIO
IPC分类号： B26D1/04 , H01G4/18 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for slitting a laminated film for a laminated film capacitor and an apparatus for the method, whereby the improved productivity of the film capacitor and the improved current proof of its capacitor characteristic can be obtained. SOLUTION: In this method for slitting a laminated film for a laminated film capacitor, there is cut by a slitting blade 18 a portion 12 to be changed into an external-electrode forming portion of a laminated film 11 where films having deposited metals are laminated. Particularly, the portion 12 t be changed into the external-electrode forming portion is so cut that the upper and lower portion of the slitting blade 18 are fastened respectively to upper and lower slitting-blade fastening blocks 19, 20, and the slitting blade 18 is moved in parallel with the cutting plane of the portion 12 to form prescribed angle with the slitting direction of the portion 12.

10. 发明专利

JP2001003167A METHOD FOR MEASURING RESISTANCE VALUE OF METALLIC VAPOR DEPOSITION FILM 失效
公开(公告)号：JP2001003167A
公开(公告)日：2001-01-09
申请号：JP17501199
申请日：1999-06-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YASUDA OSAMU , ADACHI TOSHIO , MORIWAKI MICHIYASU , KATO SHINICHI , ISHIDA MIKIO
IPC分类号： C08J7/06 , C23C14/54 , G01N27/72 , G01R27/02
摘要： PROBLEM TO BE SOLVED: To provide a method for measuring each of resistance value of the surface and back face in a both side vapor deposition film without forming non-vapor deposited parts in an online system with the improved precision at the time of measuring the resistance value of the film. SOLUTION: This is a method for measuring the resistance value of a metallic vapor deposition film in which the film resistance value R of a metallic vapor deposition film is measured, where the film is obtd. by laminating a conductor metallic layer 7 on a belt like film 4 to be vapor-deposited by vapor- depositing a conductor metal on one side of the film 4 to be vapor-deposited running so as to be supplied from a raw sheet film roll 1 toward a take-up roll 9 in the process of its running, in which, by eddy current type coil sensors 5 and 8, the eddy current generated on the conductor metallic layer 7 is measured and is transformed into voltage V, and by the voltage V, the resistance value R of the metallic vapor deposition film is measured by the following approximate expression: R=a/V2+b/V+c [where (a), (b) and (c) are constants].

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