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1. 发明专利

JP2005348199A Actuator and switch using the same 有权
标题翻译：执行器和开关使用相同
公开(公告)号：JP2005348199A
公开(公告)日：2005-12-15
申请号：JP2004166840
申请日：2004-06-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUKAWA MITSUHIRO , KORECHIKA AKIHIRO , TAKAYAMA RYOICHI , NOMURA KOJI
IPC分类号： H01H57/00 , H01H59/00 , H01P1/12
摘要： PROBLEM TO BE SOLVED: To provide an actuator of which a driving area is enlarged, and a switch using the same.
SOLUTION: Driving electrode parts 4, 5 provided on a driving arm 3 of an inboard beam comprising an actuator are divided into both terminal side areas 6 and a middle area 7 of the driving arm 3, so that the driving electrode parts can be independently controlled, respectively to improve driving efficiency and a driving area of the actuator can be enlarged as a result.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供驱动区域扩大的致动器和使用该致动器的开关。解决方案：设置在包括致动器的内侧梁的驱动臂3上的驱动电极部分4,5分成驱动臂3的两个端子侧区域6和中间区域7，使得驱动电极部件分别独立地控制以提高驱动效率，并且因此可以扩大致动器的驱动区域。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005302711A Actuator, its control method and switch using this 审中-公开
标题翻译：执行器，其控制方法和开关使用此
公开(公告)号：JP2005302711A
公开(公告)日：2005-10-27
申请号：JP2005072543
申请日：2005-03-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKAYAMA RYOICHI , KORECHIKA AKIHIRO , NOMURA KOJI , FURUKAWA MITSUHIRO
IPC分类号： B81B3/00 , H01H57/00 , H01H59/00 , H01L41/09 , H01L41/187 , H02N2/00
CPC分类号： H01H2057/006
摘要： PROBLEM TO BE SOLVED: To attain high drive speed and low drive voltage for an actuator and a switch using it. SOLUTION: This actuator is provided with: a substrate 3 at least whose surface is insulated; a drive arm 4 whose at least one part is supported by the substrate 3; an electrostatic electrode 8 provided in a position facing the substrate 3 and the drive arm 4; and a first voltage applying means applying voltage to the electrostatic electrode 8. A piezoelectric drive electrode 7 having electrodes 6 in upper and lower surfaces of a piezoelectric material layer 5 is provided in the drive arm 4, and a second voltage applying means applying voltage to the piezoelectric drive electrode 7 is provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了实现致动器和使用它的开关的高驱动速度和低驱动电压。解决方案：该致动器设置有：至少表面绝缘的基板3; 驱动臂4，其至少一部分被基板3支撑; 设置在面向基板3和驱动臂4的位置的静电电极8; 以及向静电电极8施加电压的第一电压施加装置。在驱动臂4中设置有在压电体层5的上表面和下表面具有电极6的压电驱动电极7，以及第二电压施加装置，设置压电驱动电极7。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JPH11274596A Magnetic reluctance element and magnetic detector using the same 失效
标题翻译：磁性元件和磁性探测器使用它
公开(公告)号：JPH11274596A
公开(公告)日：1999-10-08
申请号：JP7214998
申请日：1998-03-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HATTORI TAKAMICHI , UEDA SHINJIRO , KORECHIKA AKIHIRO , KAWASAKI TETSUO , YAMAGUCHI MASAKO
IPC分类号： H01L43/02 , G01R33/09
摘要： PROBLEM TO BE SOLVED: To improve heat resistance of a magnetic reluctance element wherein a semiconductor thin film magnetic reluctance film is used.
SOLUTION: The element has an element chip with a pair of electrode parts, an enclosing part 12 provided to enclose a periphery of an element chip, one or more pairs of inner lead parts 13a, 13b which are extended inside the enclosing part 12 and electrically connected to a pair of electrode parts of the element chip mounted inside the enclosing part 12, and a pair of outer lead parts 14a, 14b and a common outer lead part electrically connected to an external circuit extended outside the enclosing part 12. The enclosing part 12 is provided with a lead comb terminal 11 wherein cut-off parts 16a, 16b are arranged to prevent a pair of outer lead parts 14a, 14b and a common outer lead are not electrically connected and a resin mold formed to cover a surface and a side surface of the element chip and at least a part of an enclosing part of the lead comb terminal 11.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提高使用半导体薄膜磁阻膜的磁阻元件的耐热性。解决方案：元件具有带有一对电极部件的元件芯片，设置成包围元件芯片周边的封闭部分12，一对或多对内引线部分13a，13b，其在封闭部分12内延伸并且电连接到安装在包围部分12内部的元件芯片的一对电极部分，以及一对外部引线部分14a，14b和与外部电路延伸到外部部分12外部的公共外引线部分。封闭部分在图12中，设置有引线梳端子11，其中，切断部分16a，16b设置成防止一对外部引线部分14a，14b和公共外引线不电连接，并且形成为覆盖表面的树脂模具和元件芯片的侧表面和引线梳端子11的封闭部分的至少一部分。

4. 发明专利

JP2003045762A Circuit module 有权
标题翻译：电路模块
公开(公告)号：JP2003045762A
公开(公告)日：2003-02-14
申请号：JP2001231444
申请日：2001-07-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MIKI KATSUMASA , MIDO YUJI , KORECHIKA AKIHIRO , KIMURA RYO , IDA HIDEJI
IPC分类号： H01G9/28 , H01G9/00 , H01G9/004 , H01G9/012 , H01G9/04 , H01G9/08 , H01G9/15 , H01L23/12 , H01L23/50 , H01L25/00 , H05K1/16 , H05K1/18 , H05K3/46
CPC分类号： H05K1/185 , H01G4/40 , H01G9/15 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/162 , H05K2201/0187 , H05K2203/0315 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit module which can reduce the mounting area and the volume of the electronic component which includes a sheet-like solid electrolytic capacitor. SOLUTION: In a sheet-like solid electrolytic capacitor, a dielectric film 13 and a current collecting layer 12 are formed in a surface of a valve metal sheet body 11 and packaged inside armor parts 14, 15. Since the capacitor is buried inside the circuit substrate 18, a mounting volume of a solid electrolytic capacitor is reduced and furthermore, another component can be mounted immediately above on a solid electrolytic capacitor, thus realizing reduction in area and volume of the entire circuit substrate.
摘要翻译：要解决的问题：提供可以减少包括片状固体电解电容器的电子部件的安装面积和体积的电路模块。解决方案：在片状固体电解电容器中，在阀金属片体11的表面形成电介质膜13和集电层12，并封装在铠装部分14,15内。由于电容器埋在电路内基板18，固体电解电容器的安装体积减少，而且另外的部件可以立即安装在固体电解电容器上，从而实现整个电路基板的面积和体积的减小。

5. 发明专利

JP2006041589A Surface acoustic wave device and manufacturing method thereof 审中-公开
标题翻译：表面声波装置及其制造方法
公开(公告)号：JP2006041589A
公开(公告)日：2006-02-09
申请号：JP2004214040
申请日：2004-07-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： INOUE TAKASHI , KORECHIKA AKIHIRO
IPC分类号： H03H9/145 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To obtain a surface acoustic wave device having less deterioration in insertion loss by improving moisture resistance. SOLUTION: This device is provided with a substrate 1, an interdigital transducer 2 provided on this substrate 1 and a protective film 4 for covering the interdigital transducer 2. In this device, the thickness of the protective film 4 on the top surface of each of electrode fingers 3 forming the interdigital transducer 2 is almost the same as the thickness of the protective film 4 in side face of the electrode finger 3. In this way, the surface acoustic wave device having less deterioration in insertion loss and improved moisture resistance can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过改善耐湿性来获得插入损耗的劣化较小的表面声波装置。解决方案：该装置设置有基板1，设置在该基板1上的叉指式换能器2和用于覆盖叉指换能器2的保护膜4.在该装置中，保护膜4在顶面上的厚度形成叉指式换能器2的每个电极指3几乎与电极指3的侧面中的保护膜4的厚度相同。这样，具有较小的插入损耗和改善的水分的弹性表面波器件可获得电阻。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005333048A Actuator 有权
标题翻译：执行器
公开(公告)号：JP2005333048A
公开(公告)日：2005-12-02
申请号：JP2004151556
申请日：2004-05-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI , KORECHIKA AKIHIRO , NOMURA KOJI
IPC分类号： B81B3/00 , H01H57/00 , H01L41/09
摘要： PROBLEM TO BE SOLVED: To solve a problem in which a conventional electrical fine machine device (MEMS) type actuator needs to have a larger driving arm when having a larger driving area, which causes upsizing.
SOLUTION: A driving arm 4 which constitutes an actuator 1 is made wider at its middle part than at both the ends, and driving electrodes 6 are provided at both ends of the driving arm 4. Consequently, an area for the driving electrodes 6 imparting a driving force is secured and the driving arm 4 is more flexible and bendable to expand a driving area.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决传统的电动精密机械装置（MEMS）型致动器在具有较大的驱动面积时需要具有较大的驱动臂的问题，这导致尺寸增大。解决方案：构成致动器1的驱动臂4在其中间部比在两端形成得较宽，驱动电极6设置在驱动臂4的两端。因此，驱动电极的区域确保赋予驱动力的驱动力，并且驱动臂4更加柔软并且可弯曲以扩大驱动区域。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004088073A Solid electrolytic capacitor 审中-公开
公开(公告)号：JP2004088073A
公开(公告)日：2004-03-18
申请号：JP2003138826
申请日：2003-05-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWACHI AYUMI , TAKAGI SEIJI , MIDO YUJI , KORECHIKA AKIHIRO
IPC分类号： H01G9/028 , H01G9/04 , H01G9/048 , H01G9/14 , H01G9/15
CPC分类号： H01G9/028 , H01G9/04 , H01G9/048 , H01G9/14 , H01G9/15
摘要： PROBLEM TO BE SOLVED: To provide a small solid electrolytic capacitor with high capacity and low ESR.
SOLUTION: A first sheet-shaped capacitor element, in which a dielectric coating 2 is formed on the surface of a valve metal porous foil 1, a solid electrolytic layer 6 is formed on the dielectric coating 2, and a carbon layer 7 is formed on the solid electrolytic layer 6, and a second sheet-shaped capacitor element, in which a valve metal porous body 4 is formed on the surface of a valve metal foil 3, a dielectric coating 5 is formed on the surface of the valve metal porous body 4, a solid electrolytic layer 6 is formed on the dielectric coating film 5, and a collector layer is formed on the solid electrolytic layer 6, are laminated. An exterior electrode connected to the valve metal porous foil 1 and the valve metal foil 3 of the first and second capacitor elements and an exterior electrode connected to each collector bodies of the first and second capacitor elements are provided.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2001307956A SHEET CAPACITOR 失效
公开(公告)号：JP2001307956A
公开(公告)日：2001-11-02
申请号：JP2000119011
申请日：2000-04-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MIDO YUJI , KORECHIKA AKIHIRO , KIMURA RYO , KOJIMA KOICHI , MASUMI HIDEKI , TAKAGI SEIJI
IPC分类号： H01G9/032 , H01G9/012 , H01G9/028 , H01G9/04 , H01G9/052
摘要： PROBLEM TO BE SOLVED: To provide a sheet capacitor for improving high-frequency response. SOLUTION: A dielectric oxide film 3, a solid electrolytic layer 4, and cathode electrode layer 5 are laminated sequentially on a porous face of a valve metal porous sheet body 1. A protective layer 7 is provided on a side face in a laminated direction.

9. 发明专利

JP2001036163A MANGETOELECTRIC ELEMENT AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2001036163A
公开(公告)日：2001-02-09
申请号：JP21044099
申请日：1999-07-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWASAKI TETSUO , HATTORI TAKAMICHI , YAMAGUCHI MASAKO , KORECHIKA AKIHIRO
IPC分类号： G01D5/18 , H01L43/06
摘要： PROBLEM TO BE SOLVED: To improve reliability of a galvanomagnetic element by securing continuity of a conducting layer in the step section of a magnetism sensitive layer, by providing a conductive step coating layer either continuously from the partial surface of the conductive layer on the magnetism sensitive layer to the partial surface of at least the continuous or approximate conductive layer on a substrate. SOLUTION: A galvanomagnetic element is provided with a magnetism sensitive layer 12 on the upper surface of a substrate 11, and the layer 12 converts the variation of magnetic field intensity into variation of electrical characteristics by the Hall effect possessed of a semiconductor. The element is also provided with a conductive layer 13 at a desired spot on the upper surface of the magnetism sensitive layer 12 and the layer 13 electrically connects the layer 12 to connection terminals 15. In addition, the element is also provided with a step coating layer 14 formed continuously from the upper surface of the conductive layer 13 on the magnetism sensitive layer 12 and the upper surface of the layer 13 on the substrate 11 for securing continuity between the conductive layer 13 on the magnetism sensitive layer 12 and the layer 13 on the substrate 11. The element is connected to external electric terminals through the connection terminals 15 provided on the partial surface of the conductive layer 13 on the upper surface of the substrate 11 in a region, where the layer 13 is not in contact with the coating layer 14.

10. 发明专利

JP2001023126A MAGNETIC SENSOR AND ITS MANUFACTURE 失效
公开(公告)号：JP2001023126A
公开(公告)日：2001-01-26
申请号：JP18873799
申请日：1999-07-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HATTORI TAKAMICHI , KORECHIKA AKIHIRO , KAWASAKI TETSUO , YAMAGUCHI MASAKO
IPC分类号： G11B5/39 , G01R33/09 , H01L43/02
摘要： PROBLEM TO BE SOLVED: To reduce the change in temperature dependent characteristic by covering side faces of two magnetoresistance element chips respectively electrically connected to a power supply electrode and a passive electrode in insertion parts of the two magnetoresistive element chips with a resin mold. SOLUTION: A first magnetoresistance element chip 11 and a second magnetoresistance element chip 12 are set to a chip set part of a substrate 1. An output wiring 24 is electrically connected to a first magnetic magnetoresistance element chip bump electrode 41 of the first magnetoresistance element chip 11, and a power source wiring 23 is electrically connected to a second chip bump electrode 42 of the chip. Then, a ground wiring 25 is electrically connected to a third magnetic magnetoresistance element chip bump electrode 43 of the second magnetoresistance element chip 12, and the output wiring 24 is electrically connected to the other chip bump electrode 44 of the chip. Finally, a resin is injected and molded into a resin insert hold part from side faces of the two magnetoresistance element chips 11 and 12.

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