专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008124785A Surface acoustic wave device 审中-公开
标题翻译：表面声波设备
公开(公告)号：JP2008124785A
公开(公告)日：2008-05-29
申请号：JP2006306345
申请日：2006-11-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave device suppressing frequency variation during surface mounting.
SOLUTION: The surface acoustic wave device according to the present invention includes a piezoelectric substrate 11, an interdigital transducer 12 and a pad electrode provided on the piezoelectric substrate 11, a resin wall 14 provided to surround an excitation region of the interdigital electrode 12 on the piezoelectric substrate 11, a top plate 15 covering an opening portion of the resin wall 14 to seal the excitation region, an external electrode 16 provided on the top plate 15 and connected to the pad electrode 13, and a via electrode 17 provided in the top plate 15 and resin wall 14 and connecting the pad electrode 13 and external electrode 16 to each other, wherein the via electrode 17 is divided into a first via electrode 17a disposed on the side of the piezoelectric substrate 11 and a second via electrode 17b disposed on the side of the top plate 15, and the diameter of the first via electrode 17a is made smaller than the diameter of the second via electrode 17b.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供抑制表面安装期间的频率变化的表面声波装置。解决方案：根据本发明的声表面波装置包括压电基板11，叉指式换能器12和设置在压电基板11上的焊盘电极，树脂壁14设置成围绕指状电极的激发区域 12，压电基板11上形成有覆盖树脂壁14的开口部以密封激发区域的顶板15，设置在顶板15上并与焊盘电极13连接的外部电极16，以及设置有通孔电极17 在顶板15和树脂壁14中，并且将焊盘电极13和外部电极16彼此连接，其中通孔电极17被分成设置在压电基板11侧的第一通孔电极17a和第二通孔电极 17b，并且第一通孔电极17a的直径小于第二通孔电极17b的直径。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008124784A Manufacturing method for surface acoustic wave device 有权
标题翻译：表面声波装置的制造方法
公开(公告)号：JP2008124784A
公开(公告)日：2008-05-29
申请号：JP2006306344
申请日：2006-11-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H03H3/08 , H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which can be improved in reliability and productivity.
SOLUTION: A manufacturing method for the surface acoustic wave device mounted on a surface of a mounting substrate by using solder comprises steps of: forming an interdigital electrode 2 constituting a surface acoustic wave element on a piezoelectric substrate 1 made of LiTaO
3 ; forming a side wall 3 made of thermosetting resin surrounding an excitation region where the interdigital electrode 2 is formed on the piezoelectric substrate 1; performing a heat treatment at a temperature higher than the soldering temperature in the surface mounting; and forming a lid body 4 so that an opening part of the side wall 3 is covered to seal the excitation region, wherein the piezoelectric substrate 1 has an oxygen defect.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以提高可靠性和生产率的表面声波装置。解决方案：通过使用焊料安装在安装基板的表面上的声表面波装置的制造方法包括以下步骤：在由LiTaO 3 ; 在压电基板1上形成由交叉指型电极2形成的激励区域的热固性树脂构成的侧壁3; 在高于表面安装的焊接温度的温度下进行热处理; 并且形成盖体4，使得侧壁3的开口部分被覆盖以密封激发区域，其中压电基板1具有氧缺陷。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007214169A Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：JP2007214169A
公开(公告)日：2007-08-23
申请号：JP2006029369
申请日：2006-02-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H01L23/29 , H01L23/31 , H05K1/18
CPC分类号： H01L2224/48091 , H01L2224/49171 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To mitigate damages on an electronic component.
SOLUTION: The electronic component package is provided with a mounting substrate 15, external electrodes (external signal electrode 38, external ground electrode 39) arranged on the mounting substrate 15, an electronic component (SAW duplexer 13) mounted on the mounting substrate 15 via the external electrodes 38, 39, and a mold resin 16 covering the electronic component 13 on the mounting substrate 15. The electronic component 13 includes a component substrate 18, an element (IDT electrode 19) arranged at the lower surface of the component substrate 18, an element cover 20 covering the lower part of the element 19, and a component cover 21 covering the element cover 20 at the lower surface of the component substrate 18. At least any of the plurality of external electrodes 38, 39 is provided on the mounting substrate 15 opposing to the element 19. Consequently, damage on the electronic component 13 may be suppressed by dispersing or reducing an external stress, and by improving strength for external pressure of electronic component package.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：减轻电子元件的损坏。解决方案：电子部件封装设置有安装基板15，安装在安装基板15上的外部电极（外部信号电极38，外部接地电极39），安装在安装基板上的电子部件（SAW双工器13）通过外部电极38,39和覆盖安装基板15上的电子部件13的模制树脂16.电子部件13包括部件基板18，配置在部件的下表面的元件（IDT电极19）基板18，覆盖元件19的下部的元件盖20和在元件基板18的下表面覆盖元件盖20的元件盖21.至少设置多个外部电极38,39中的任一个在与元件19相对的安装基板15上。因此，可以通过分散或减小外部应力来抑制电子元件13的损坏，并且通过改善电缆电子元件封装的外部压力。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006217226A Surface acoustic wave element and manufacturing method thereof 审中-公开
标题翻译：表面声波元件及其制造方法
公开(公告)号：JP2006217226A
公开(公告)日：2006-08-17
申请号：JP2005027573
申请日：2005-02-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUKAWA MITSUHIRO , MATSUI ATSUSHI
IPC分类号： H03H9/25 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To simplify processes, and to obtain a surface acoustic wave element that is further reduced in size and low-profiled.
SOLUTION: The surface acoustic wave element is provided with: a piezoelectric substrate 11; interdigital electrodes 12, provided to a principal side of the piezoelectric substrate; protection films 13 for covering the interdigital electrodes; a surrounding wall 14 for surrounding the surrounding of the interdigital electrodes; a cover 15, provided to cover the upper part of the part surrounded by the surrounding wall; bumps 16, provided on the principal side of the piezoelectric substrate; and a first bump enclosing layer 17 for surrounding the bumps, and the height of the bumps from the principal side of the piezoelectric substrate is selected larger than the height of the cover from the principal side of the piezoelectric substrate in the surface acoustic wave element, and then the processes can be simplified and the size-reduced and low-profiled surface acoustic wave element can be obtained.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了简化工艺，并获得进一步减小尺寸和低外形的表面声波元件。解决方案：声表面波元件设置有：压电基板11; 设置在压电基板的主要侧的叉指电极12; 用于覆盖指状电极的保护膜13; 用于围绕叉指电极的周围的环绕壁14; 盖15，其设置成覆盖由周围壁围绕的部分的上部; 设置在压电基板的主面上的凸块16; 以及用于围绕凸块的第一凸块包围层17，并且从压电基板的主侧的凸起的高度被选择为大于表面声波元件中的压电基板的主要侧的盖的高度，然后可以简化工艺，并且可以获得尺寸减小和低剖面的声表面波元件。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005302711A Actuator, its control method and switch using this 审中-公开
标题翻译：执行器，其控制方法和开关使用此
公开(公告)号：JP2005302711A
公开(公告)日：2005-10-27
申请号：JP2005072543
申请日：2005-03-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKAYAMA RYOICHI , KORECHIKA AKIHIRO , NOMURA KOJI , FURUKAWA MITSUHIRO
IPC分类号： B81B3/00 , H01H57/00 , H01H59/00 , H01L41/09 , H01L41/187 , H02N2/00
CPC分类号： H01H2057/006
摘要： PROBLEM TO BE SOLVED: To attain high drive speed and low drive voltage for an actuator and a switch using it. SOLUTION: This actuator is provided with: a substrate 3 at least whose surface is insulated; a drive arm 4 whose at least one part is supported by the substrate 3; an electrostatic electrode 8 provided in a position facing the substrate 3 and the drive arm 4; and a first voltage applying means applying voltage to the electrostatic electrode 8. A piezoelectric drive electrode 7 having electrodes 6 in upper and lower surfaces of a piezoelectric material layer 5 is provided in the drive arm 4, and a second voltage applying means applying voltage to the piezoelectric drive electrode 7 is provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了实现致动器和使用它的开关的高驱动速度和低驱动电压。解决方案：该致动器设置有：至少表面绝缘的基板3; 驱动臂4，其至少一部分被基板3支撑; 设置在面向基板3和驱动臂4的位置的静电电极8; 以及向静电电极8施加电压的第一电压施加装置。在驱动臂4中设置有在压电体层5的上表面和下表面具有电极6的压电驱动电极7，以及第二电压施加装置，设置压电驱动电极7。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2003282692A Substrate carrying tray and substrate processing apparatus using this tray 审中-公开
标题翻译：使用本托盘的托盘和基板加工设备的基板
公开(公告)号：JP2003282692A
公开(公告)日：2003-10-03
申请号：JP2002087860
申请日：2002-03-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KUROTAKE HIROYUKI , YAMASHITA KIYOHARU , FURUKAWA MITSUHIRO , WATANABE MAMORU , SEKIGUCHI HIROYOSHI
IPC分类号： C23C14/50 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To solve the problem that the processing efficiency of a substrate can not be heightened as a following substrate can not be replaced until the present substrate cools down after its process has been accomplished if a test piece stand is fixed to a substrate processing apparatus. SOLUTION: The substrate carrying tray can heighten the processing efficiency of the substrate by means of installing a substrate cooling section, an electrostatic chuck and a heat dissipating portion in the substrate carrying tray detachable from the substrate processing apparatus. Further the substrate processing apparatus uses this tray. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题为了解决如下的问题：如果固定在试件台上，在本发明的基板在其工艺完成之后，直到本基板冷却下来为止，才能更换基板的加工效率不能随之升高涉及基板处理装置。解决方案：通过在可从基板处理装置拆卸的基板搬运托盘中安装基板冷却部分，静电卡盘和散热部分，可以提高基板的加工效率。此外，基板处理装置使用该托盘。版权所有（C）2004，JPO

7. 发明专利

JP2008124786A Surface acoustic wave device 有权
标题翻译：表面声波设备
公开(公告)号：JP2008124786A
公开(公告)日：2008-05-29
申请号：JP2006306346
申请日：2006-11-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave device suppressing frequency variation during surface mounting. SOLUTION: The surface acoustic wave device according to the present invention includes a piezoelectric substrate 11, an interdigital transducer 12 and a pad electrode provided on the piezoelectric substrate 11, a resin wall 14 provided to surround an excitation region of the interdigital electrode 12 on the piezoelectric substrate 11, a top plate 15 covering an opening portion of the resin wall 14 to seal the excitation region, an external electrode 16 provided on the top plate 15 and connected to the pad electrode 13, and a via electrode 17 provided in the top plate 15 and resin wall 14 and connecting the pad electrode 13 and external electrode 16 to each other, wherein the via electrode 17 is divided into a first via electrode 17a disposed on the side of the piezoelectric substrate 11 and a second via electrode 17b disposed on the side of the top plate 15, and the center position of the first via electrode 17a and the center position of the second via electrode 17b are made different. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供抑制表面安装期间的频率变化的表面声波装置。解决方案：根据本发明的声表面波装置包括压电基板11，叉指式换能器12和设置在压电基板11上的焊盘电极，树脂壁14设置成围绕指状电极的激发区域 12，压电基板11上形成有覆盖树脂壁14的开口部以密封激发区域的顶板15，设置在顶板15上并与焊盘电极13连接的外部电极16，以及设置有通孔电极17 在顶板15和树脂壁14中，并且将焊盘电极13和外部电极16彼此连接，其中通孔电极17被分成设置在压电基板11侧的第一通孔电极17a和第二通孔电极 17b设置在顶板15的一侧，并且使第一通孔电极17a的中心位置和第二通孔电极17b的中心位置不同 ENT。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007142812A Composite rf module package 审中-公开
标题翻译：复合RF模块封装
公开(公告)号：JP2007142812A
公开(公告)日：2007-06-07
申请号：JP2005333899
申请日：2005-11-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKANO ATSUSHI , FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H03H9/25 , H03H9/72 , H04B1/3822 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To improve the temperature characteristic of an SAW element in a composite RF module package mounted with a power amplifier. SOLUTION: This composite RF module package is provided with a mounting substrate 1; a power amplifier 2 arranged on the mounting substrate 1; an SAW element (SAW duplexer 6) arranged on the mounting substrate with a predetermined distance from the power amplifier 2; and a mold resin 5 covering the power amplifier 2 and the SAW element on the mounting substrate. In the composite RF module package, a coil 3a as a first reactance element 3 is arranged between the power amplifier 2 and the SAW element on the mounting substrate 1, and the coil 3a is electrically connected to a via 15 formed on the mounting substrate 1 on its lower part. By this configuration, the temperature characteristic of the SAW duplexer is improved, and the SAW duplexer 6 can be incorporated into the composite RF module package mounted with the power amplifier 2 without impairing the reliability of the SAW duplexer 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高安装有功率放大器的复合RF模块封装中的SAW元件的温度特性。解决方案：该复合RF模块封装设置有安装基板1; 布置在安装基板1上的功率放大器2; 布置在距离功率放大器2预定距离的安装基板上的SAW元件（SAW双工器6）; 以及覆盖功率放大器2和安装基板上的SAW元件的模制树脂5。在复合RF模块封装中，在功率放大器2和安装基板1上的SAW元件之间布置有作为第一电抗元件3的线圈3a，线圈3a与安装基板1上形成的通孔15电连接在其下部。通过这种配置，改善了SAW双工器的温度特性，并且可以将SAW双工器6并入到安装有功率放大器2的复合RF模块封装中，而不会损害SAW双工器6的可靠性。版权所有（ C）2007，JPO＆INPIT

9. 发明专利

JP2006246112A Surface acoustic wave device and its manufacturing method 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：JP2006246112A
公开(公告)日：2006-09-14
申请号：JP2005060129
申请日：2005-03-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUKAWA MITSUHIRO , AZUMA KAZUJI , MAEKAWA YUKIHIRO , KASHIWAGI TAKAFUMI , TAKAYAMA RYOICHI
IPC分类号： H03H9/25 , H03H3/08
CPC分类号： H01L2224/94
摘要： PROBLEM TO BE SOLVED: To solve the problem that a surface acoustic wave device of a conventional CSP type is weak against heat since substrates of different materials are bonded to each other. SOLUTION: The surface acoustic wave device comprises a piezo-electric substrate 11, a comb type electrode 12 provided on the piezo-electric substrate, and a lid object 14 composed of the same quality of the material as the piezo-electric substrate. Even in the case of reducing the device in size and lowering the height of the back of the device, it is made possible to obtain the surface acoustic wave device which is hard to destroy a junction interface with heat, and strong to a temperature change etc. , by using a substrate of the same material, even if it is made of a strong crystal of anisotropy. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了解决由于不同材料的基板彼此结合而导致的常规CSP型的声表面波器件相对于热弱的问题。解决方案：声表面波装置包括压电基板11，设置在压电基板上的梳状电极12和由与压电基板相同质量的盖体14 。即使在使装置尺寸减小并且降低装置的背部的高度的情况下，也可以获得难以破坏接合界面的表面声波装置，并且强到温度变化等通过使用相同材料的基材，即使它是由各向异性的强晶体制成的。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006202799A Composite electronic component 审中-公开
标题翻译：复合电子元件
公开(公告)号：JP2006202799A
公开(公告)日：2006-08-03
申请号：JP2005009848
申请日：2005-01-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUKAWA MITSUHIRO , TAKAYAMA RYOICHI
IPC分类号： H01L23/08 , H01L23/02
摘要： PROBLEM TO BE SOLVED: To obtain a composite electronic component including a sealed electronic component having an active element performing mechanical operation upon application of an electric signal in a sealed space and contributive to reduction in size and multifunction of an electronic apparatus employing it.
SOLUTION: The electronic apparatus comprises a plurality of electronic components including a sealed electronic component 4 having an active region 9 performing mechanical operation upon application of an electric signal in a sealed space. At least one wall face of a package 10 forming the sealed space in the sealed electronic component 4 is formed using the outer surface of other electronic component 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得包括具有有源元件的密封电子部件的复合电子部件，所述有源元件在密封空间中施加电信号并且有助于使用它的电子设备的尺寸和多功能性而进行机械操作。解决方案：电子设备包括多个电子部件，包括密封电子部件4，密封电子部件4具有在密封空间中施加电信号时进行机械操作的有源区域9。使用其他电子部件3的外表面形成形成密封电子部件4中的密封空间的封装体10的至少一个壁面。（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式