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1. 发明专利

JP2008098229A Electronic component mounting apparatus and electronic component mounting method 有权
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：JP2008098229A
公开(公告)日：2008-04-24
申请号：JP2006274939
申请日：2006-10-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHINO TAKASHI , SHINOZAKI TADASHI , EGUCHI TOMOFUMI , NAKAZONO TORU , YAMAUCHI NAOKI
IPC分类号： H05K13/04 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method capable of reducing a frequency of work required for changing a kind of components to improve productivity. SOLUTION: In mounting electronic components for carrying and mounting a plurality of kinds of the electronic components while changing a nozzle of a single mounting head corresponding to each kind of the components, a mounting order is determined so that the component finally mounted to each substrate during a component mounting process including stack components (components of kinds A and B) limited in the mounting order and normal components (components of kinds C and D) as objects to be mounted is the normal component. Part of a normal mounting process is carried out by picking up the normal component which can be mounted by the nozzle used in mounting the finally mounted component on a preceding substrate as the initial component on the current substrate. Then, the nozzle is changed to complete a process of mounting the stack components, and thereafter the remaining normal mounting process is carried out for the normal component remained as the component to be finally mounted. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够降低更换一种部件所需的工作频率以提高生产率的电子部件安装装置和电子部件安装方法。解决方案：在安装用于承载和安装多种电子部件的电子部件的同时，在改变与各种部件对应的单个安装头的喷嘴的同时，确定安装顺序，使得部件最终安装到每个基板在包括以安装顺序限制的堆叠部件（种类A和B的部件）和正常部件（类型C和D的部件）作为被安装对象的部件安装过程中是正常部件。正常的安装过程的一部分是通过将用于将最终安装的部件安装在前面的基板上的喷嘴安装的正常部件作为当前基板上的初始部件来进行。然后，改变喷嘴以完成安装堆叠部件的处理，然后对作为最终安装部件的正常部件进行剩余的正常安装处理。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008117992A Electronic component mounting equipment, and electronic component mounting method 有权
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：JP2008117992A
公开(公告)日：2008-05-22
申请号：JP2006301182
申请日：2006-11-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHINO TAKASHI , SHINOZAKI TADASHI , EGUCHI TOMOFUMI , YAMAUCHI NAOKI , NAKAZONO TORU
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting equipment which can reduce a frequency of pallet exchange, and to provide its electronic component mounting method. SOLUTION: In mounting one kind of electronic components among a plurality of kinds of electronic components contained in a pallet 14 held on a pallet holding device 13, when all the electronic components of the kind are used up, the mounting of the electronic components of the kind is suspended, and another kind of electronic components held on the same pallet 14 are mounted. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以降低托盘交换频率的电子部件安装设备，并提供其电子部件安装方法。解决方案：在将一种电子部件安装在容纳在托盘保持装置13上的托盘14中的多种电子部件中时，当这种电子部件全部用尽时，电子装置该类型的部件被悬挂，并且安装在同一托盘14上的另一种电子部件。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007258319A Electronic component mounting device, and method therefor 有权
标题翻译：电子元件安装装置及其方法
公开(公告)号：JP2007258319A
公开(公告)日：2007-10-04
申请号：JP2006078447
申请日：2006-03-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHINO TAKASHI , SHINOZAKI TADASHI , EGUCHI TOMOFUMI , YAMAUCHI NAOKI , HIDAKA MASAO , NAKAZONO TORU
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H05K13/0478 , H01L21/67144 , H01L24/29 , H01L24/83 , H01L24/97 , H01L2224/83192 , H01L2224/8385 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2224/83
摘要： PROBLEM TO BE SOLVED: To provide electronic component mounting device and method which can enhance productivity by reducing the frequency of a work required when the type of the component is switched. SOLUTION: The component mounting work for takes out the chips of component types A, B and C from a component feeder by means of a single mounting head, and mounts them on two sheets of substrate held on first and second lanes. If such a state as the component mounting operation of a subsequent substrate can be performed before completing the mounting process of a preceding substrate is brought about in the process performing the component mounting operation of the preceding substrate among a plurality of substrates, following substrate mounting process is started at that timing for the objective chip of the component mounting operation onto the preceding substrate as a mounting start component, thus continuing the not-yet-completed preceding substrate mounting process. Consequently, the frequency of a work required can be reduced when the type of component is switched. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件安装装置和方法，其可以通过减小当切换部件的类型所需的工作频率时提高生产率。
解决方案：组件安装工作，通过单个安装头从组件进料器中取出组件类型A，B和C的芯片，并将其安装在保持在第一和第二通道上的两块基板上。在进行多个基板中的前述基板的部件安装动作的处理中，在完成前一基板的安装处理之前，可以进行如下的后续基板的部件安装动作的状态，随后的基板安装工序在该定时将元件安装操作的目标芯片作为安装起动部件开始，从而继续尚未完成的先前的基板安装工艺。因此，当切换组件的类型时，可以减少所需工作的频率。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2003004661A Coating-state inspection method 有权
标题翻译：涂料状态检测方法
公开(公告)号：JP2003004661A
公开(公告)日：2003-01-08
申请号：JP2001190976
申请日：2001-06-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： EGUCHI TOMOFUMI , ABE HISAKI
IPC分类号： G01B11/02 , G01N21/88 , G01N21/956 , H01L21/52
CPC分类号： H01L24/743 , H01L2224/743 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a coating-state inspection method in which a coating state can be inspected with satisfactory efficiency by shortening the time required for an image recognition operation.
SOLUTION: In the coating-state inspection method, the coating state of a paste 3 coated on a board by a plotting coating operation is inspected. First inspection lines IL1 and second inspection lines IL2 which are separated by a first distance D1 and a second distance D2 are set respectively in parallel with center lines L as coating lines constituting a coating pattern in an image obtained by imaging the board coated with the paste 3, first inspection points P1 and second inspection points P2 which are separated by a third distance D3 and a fourth distance D4, are set respectively on outer sides from turned-up points TP of a coating nozzle in a coating pattern, and the coating state of the paste 3 is judged on the basis of a luminance distribution on the lines IL1 and the lines IL2 and on the basis of the luminance of the points P1 and the points P2.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种涂覆状态检查方法，其中通过缩短图像识别操作所需的时间，可以以令人满意的效率检查涂覆状态。解决方案：在涂布状态检查方法中，检查通过绘图涂布操作涂布在板上的糊剂3的涂布状态。分隔第一距离D1和第二距离D2的第一检查线IL1和第二检查线IL2分别设置为与中心线L平行的涂层线，该涂布线构成通过对涂布有该膏体的板进行成像而获得的图像中的涂布图案如图3所示，分隔第三距离D3和第四距离D4的第一检查点P1和第二检查点P2分别设置在涂布图案的涂布喷嘴的折叠点TP的外侧，涂布状态基于线IL1和线IL2上的亮度分布，并基于点P1和点P2的亮度来判断糊状物3。

5. 发明专利

JP2006332417A Pickup device and pickup method for chip 有权
标题翻译：用于芯片的PICKUP设备和PICKUP方法
公开(公告)号：JP2006332417A
公开(公告)日：2006-12-07
申请号：JP2005155284
申请日：2005-05-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： EGUCHI TOMOFUMI , SHINOZAKI TADASHI
IPC分类号： H01L21/50 , H01L21/67 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a pickup device and pickup method for a chip capable of efficiently detecting the position of the chip in a chip holding jig at a low cost. SOLUTION: In the chip pickup processing of picking up the chips 5a held in a prescribed array by a wafer jig 3 from the wafer jig 3 mounted and held on a jig table 2a, position coordinates corresponding to a first reference chip R1 to be referred to first among a plurality of reference chips (R1, R2 and R3) set for position reference are taught by manual teaching on a display monitor as coordinates corresponding to the first reference chip; and the following reference chips R2 and R3 are obtained by automatic detection by image recognition, on the basis of the coordinates corresponding to the first reference chip, the array data of the chips, and a reference chip position in the array data. Thus, the position of the chip in the chip holding jig is efficiently detected at a low cost without exclusively forming a chip for position reference. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以低成本有效地检测芯片保持夹具中的芯片的位置的芯片的拾取装置和拾取方法。解决方案：在通过晶片夹具3从安装并保持在夹具台2a上的晶片夹具3拾取由规定阵列保持的芯片5a的芯片拾取处理中，将与第一参考芯片R1对应的位置坐标在用于位置参考的多个参考芯片（R1，R2和R3）中的第一参考是通过在显示监视器上的手动教学来教导作为与第一参考芯片相对应的坐标; 并且基于与第一参考芯片对应的坐标，芯片的阵列数据和阵列数据中的参考芯片位置，通过图像识别的自动检测获得以下参考芯片R2和R3。因此，芯片在芯片保持夹具中的位置以低成本被有效地检测，而不必专门地形成用于位置参考的芯片。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005175356A Apparatus and method for picking up electronic component 有权
标题翻译：用于拾取电子元件的装置和方法
公开(公告)号：JP2005175356A
公开(公告)日：2005-06-30
申请号：JP2003416217
申请日：2003-12-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： EMOTO YASUHIRO , EGUCHI TOMOFUMI
IPC分类号： H01L21/67 , H01L21/52 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an electronic component pickup apparatus that enables an imaging state, in which electronic components held by an adhesive sheet are imaged, to be stabilized, and to provide an electronic component pickup method. SOLUTION: In an electronic component pickup operation for picking up and absorbing a plurality of electronic components 6 held by the adhesive sheet 5, a first camera 35 for identifying electronic components is moved beyond the electronic components 6 to be absorbed, and a lower supporting unit 8 is sequentially moved below the electronic components 6, before they are absorbed by a plurality of nozzles of the work head, to image the electronic components 6 which are kept in a horizontal position by a supporting surface 14a on the upper surface of the lower supporting unit 8. This makes it possible to stabilize an imaging state in which the electronic components 6 held by the adhesive sheet 5 are imaged, to secure precision in position detection, and thereby to reduce errors in picking up the electronic components. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件拾取装置，其能够使由粘合片保持的电子部件成像的成像状态稳定，并且提供电子部件拾取方法。解决方案：在用于拾取和吸收由粘合片5保持的多个电子部件6的电子部件拾取操作中，用于识别电子部件的第一照相机35移动超过电子部件6以被吸收，并且下支撑单元8在它们被工作头的多个喷嘴吸收之前被顺序地移动到电子部件6的下方，以便通过支撑表面14a在水平位置上保持水平位置的电子部件6成像在这使得可以稳定由粘合片5保持的电子部件6成像的成像状态，以确保位置检测的精度，从而减少拾取电子部件的误差。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2003007734A Apparatus and method for coating viscous material 有权
标题翻译：用于涂覆粘胶材料的装置和方法
公开(公告)号：JP2003007734A
公开(公告)日：2003-01-10
申请号：JP2001190977
申请日：2001-06-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： EGUCHI TOMOFUMI , ABE HISAKI
IPC分类号： B05D7/24 , B05C5/00 , H01L21/52
CPC分类号： H01L24/743 , H01L2224/743 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for coating a viscous material capable of inspecting an efficient coating state by shortening a time required to recognize an image and reducing a labor hour at the time of switching a type.
SOLUTION: The apparatus for coating the viscous material coats a paste on a substrate by drawing coating. In the apparatus, inspection information used in the inspection of the coating state by a first inspecting unit 9 for inspecting operating patterns of X-, Y- and Z-shafts of a moving means for moving the coating nozzle of a dispenser 6 based on the coating pattern generated in response to a chip size to be bonded and the coating state of the paste is set. The apparatus inspects the coating state based on the inspection information after the paste is coated based on the operating pattern. Thus, the apparatus can efficiently inspect the coating state by shortening the time required for recognizing the image and can reduce the labor hour at the time of switching the type.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种能够通过缩短识别图像所需的时间并减少切换时的劳动时间来涂覆能够检查有效涂覆状态的粘性材料的装置和方法。解决方案：用于涂覆粘性材料的设备通过拉伸涂布将基体上的糊料涂覆在基材上。在该装置中，用于检查第一检查单元9的涂覆状态的检查信息，用于检查用于移动分配器6的涂布喷嘴的移动装置的X，Y轴和Z轴的操作模式，基于响应于要粘合的芯片尺寸产生的涂布图案和糊料的涂布状态。该装置基于操作模式涂布糊剂后，基于检查信息来检查涂布状态。因此，该设备可以通过缩短识别图像所需的时间并且可以减少切换时的劳动时间来有效地检查涂布状态。

8. 发明专利

JP2003004660A Inspection method for bonding state 有权
标题翻译：联邦检验方法
公开(公告)号：JP2003004660A
公开(公告)日：2003-01-08
申请号：JP2001190975
申请日：2001-06-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ABE HISAKI , EGUCHI TOMOFUMI
IPC分类号： G01B11/30 , G01N21/956 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide an inspection method for a bonding state in which the wet spread state of an adhesive can be inspected at high speed and stably.
SOLUTION: When the bonding state of a semiconductor chip bonded to a board via the adhesive is inspected, an inspection line IL which surrounds the circumference of the semiconductor chip is set in a position separated by a prescribed distance D corresponding to one to two pixels from the edge E of the semiconductor chip, in an image obtained by imaging the semiconductor chip bonded to the board via the adhesive. A luminance distribution on the inspection line IL is detected, and whether the spread state of the adhesive is satisfactory or not is judged. Consequently, it is possible to prevent irregularities in a luminance detection value when the pixel of an object whose luminance is to be detected is situated on a terminator on a screen, and the spread state of the adhesive can be judged at high speed and stably.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供可以高速且稳定地检查粘合剂的湿扩展状态的接合状态的检查方法。解决方案：当检查通过粘合剂粘合到板上的半导体芯片的结合状态时，围绕半导体芯片周围的检查线IL被设置在与从一个到两个像素相对应的规定距离D 在通过粘合剂对与板接合的半导体芯片成像而获得的图像中，半导体芯片的边缘E。检测检查线IL上的亮度分布，判断粘合剂的扩展状态是否满意。因此，当要检测亮度的物体的像素位于屏幕上的终端器上时，可以防止亮度检测值的不规则性，并且可以高速且稳定地判断粘合剂的展开状态。

9. 发明专利

JP2000077460A Conductive ball mounting device and method therefor 审中-公开
标题翻译：导电球安装装置及其方法
公开(公告)号：JP2000077460A
公开(公告)日：2000-03-14
申请号：JP24806798
申请日：1998-09-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KASAI TERUAKI , EGUCHI TOMOFUMI , SASAKURI SHINJI
IPC分类号： H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive ball mounting device and a mounting method therefor, which can correctly discriminate the presence of conductive balls.
SOLUTION: In this mounting method of conductive balls, which mounts the conductive ball on a work by a sucking head 31, a method which discriminates the presence of the conductive ball at the lower surface of the sucking head 31, based on the electric signal outputted from a light receiving part 43b by illuminating light from a light emitting part 43a, and a method which discriminates the presence of the conductive balls at the lower surface of the sucking head 31 based on the image data obtained by picking up the image of the lower surface of the sucking head 31 with a camera 4, are combined. Thus, the excess attached conductive balls on the lower surface of the sucking head 31 and the conductive balls remaining at the lower surface of the sucking head 31 after the mounting of the work are detected. In this way, the presence of the conductive balls can be discriminated correctly.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：提供可以正确地区分导电球的存在的导电球安装装置及其安装方法。解决方案：在这种通过吸头31将导电球安装在工件上的导电球的安装方法中，基于输出的电信号来区分在吸头31的下表面处的导电球的存在的方法从受光部43b通过照射来自发光部43a的光，以及基于通过拾取下部图像的图像而获得的图像数据来识别吸引头31的下表面处的导电球的存在的方法具有相机4的吸头31的表面被组合。因此，检测在安装工件之后，在吸头31的下表面上剩余的多余的导电球和残留在吸头31的下表面的导电球。以这种方式，可以正确地区分导电球的存在。

10. 发明专利

JPH11251729A METHOD AND DEVICE FOR TRANSFERRING ADHESIVE MATERIAL 失效
公开(公告)号：JPH11251729A
公开(公告)日：1999-09-17
申请号：JP5322698
申请日：1998-03-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAKAMI SEIJI , KASAI TERUAKI , EGUCHI TOMOFUMI
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method and device for transferring an adhesive material wherein transfer error is prevented. SOLUTION: Related to a method for transferring an adhesive material wherein a cream solder 5 is transferred by lowering a conductive ball 10 or an electronic part with a bump held by a sucking tool 9 to a coated part 2 where the adhesive material is coated so as to be submerged in the cream solder 5, the conductive ball 10 and the bump is vibrated relative to the cream solder 5 when they are lifted after the conductive ball 10 or the electronic part with a bump is submerged in the cream solder 5. A rising speed at the start of rising is set to low, then it is switched to a high speed. Since an adhesive force or true cream solder 5 is lowered by this, the conductive ball 10 or the electronic part with a bump is prevented from dropping from the sucking tool 9 when grasped by the cream solder 5.

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