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1. 发明专利

JPWO2009025016A1 部品実装装置及び方法有权
公开(公告)号：JPWO2009025016A1
公开(公告)日：2010-11-18
申请号：JP2009528890
申请日：2007-08-17
申请人：富士通株式会社
发明人：西野　徹 , 徹西野 , 和之伊倉 , 和之伊倉
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0015 , H01L21/70 , H01L21/82 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/85 , H01L25/50 , H01L27/14601 , H01L31/18 , H01L2224/16 , H01L2224/279 , H01L2224/43 , H01L2224/75 , H01L2224/75743 , H01L2224/81121 , H01L2224/81801 , H01L2224/82 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H05K13/0413 , H05K13/0452 , H05K13/0478 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49169 , Y10T29/53174 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要：フェースアップアライメント実装で基板(1)に実装した第1の実装部品(3A,3B)の上に、フェースダウンアライメント実装で第2の実装部品(20)を実装する場合に、第2の実装部品(20)の機能部分の位置にばらつきがあっても精度良く実装するために、第1及び第2の実装部品を基板(1)に実装する際に、第2の実装部品(20)の形状を下方から画像認識して、第2の実装部品の形状の画像認識結果に基づいて、複数の第1の実装部品(3A,3B)を基板(1)に実装し、第2の実装部品(20)を基板に実装された第1の実装部品(3A,3B)の上に実装する。

2. 发明专利

JP3749160B2 Surface mounting apparatus and method 有权
公开(公告)号：JP3749160B2
公开(公告)日：2006-02-22
申请号：JP2001353030
申请日：2001-11-19
申请人：ミラエ・コーポレーションMirae Corporation
发明人：ヒュンフワングジ , ヒュンキムド
IPC分类号： H05K13/04 , H05K13/00
CPC分类号： H05K13/0061 , H05K13/0478 , Y10T29/5196 , Y10T29/53174 , Y10T29/53187

3. 发明专利

JPS59102537A Press-fitting head for connector pin inserter 失效
标题翻译：用于连接器插针的压配头
公开(公告)号：JPS59102537A
公开(公告)日：1984-06-13
申请号：JP20862682
申请日：1982-11-30
申请人： Fujitsu Ltd
发明人： KAWASAKI YOSHIAKI
IPC分类号： B23P19/04 , B23P21/00 , H01R43/20 , H05K13/04
CPC分类号： H01R43/205 , H05K13/0478
摘要： PURPOSE:To heighten the efficiency of work, by causing a press-fitting head for a connector pin inserter to clamp connector pins in two rows on an intermediate member to press-fit the connector pins in two rows at the same time. CONSTITUTION:When an intermediate member 6 is in a position 6', connector pins 32, 32' manufactured on a band-shaped carrier 31 are brought in a direction P. The intermediate member 6 is then elevated. A cam plate 26 is turned by cams 28. Pressure levers 24, 24' are operated to push the backs of the cutting- off arms 4, 4' of a press-fitting head 23 so that the pins 32, 32' are clamped on both the sides of the intermediate member 6 by clamp arms 2, 2' and simultaneously cut off from the carrier 31. After that, a pressure head 22 and the press-fitting head 23 are moved down to press-fit the pins 32, 32' into the through holes of a printed circuit board 30 through a guide 27. The connector pins in two rows can thus be press-fitted simultaneously.
摘要翻译：目的：为了提高工作效率，通过使连接器插头的压配头将连接器针脚夹在中间构件上的两排中，同时将连接器针脚压入两行。构成：当中间构件6处于位置6'时，在带状载体31上制造的连接器销32,32'沿方向P。然后中间构件6升高。凸轮板26由凸轮28转动。压力杆24,24'被操作以推动压配头23的切割臂4,4'的后部，使得销32,32'被夹紧中间构件6的两侧通过夹紧臂2,2'同时从载体31切断。然后，压头22和压入头23向下移动以压配合销32,32 通过引导件27插入到印刷电路板30的通孔中。因此可以同时压配两列的连接器销。

4. 发明专利

JP2013516066A Assemblies, and methods for engagement with the integrated circuit unit 有权
公开(公告)号：JP2013516066A
公开(公告)日：2013-05-09
申请号：JP2012545909
申请日：2010-12-23
申请人：ロッコ・システムズ・プライベイト・リミテッドRokko Systems Pte Ltd
发明人：ヤン・ヘチュン , チョン・ジョンジェ , ヤン・ドチュン , チョン・チェン・ゲイリー・リム
IPC分类号： H05K13/04 , B25J15/00 , H01L21/67
CPC分类号： H05K13/0408 , H05K13/0413 , H05K13/0478 , Y10T74/18296 , Y10T74/19051
摘要：ピッカー組立体は、選択的に変更できる間隔をあけて配置される関係にある複数のピッカーと、同軸上にあると共に変更できる厚さを有する複数のカムプレートを有するシャフトと、前記ピッカーと係合すると共に前記ピッカー間の隙間間隔内に位置付けられる前記カムプレートとを有し、間隔を選択的に変更できることは、前記カムプレートの厚さ変動によってそれぞれのピッカーを前記シャフトに平行な軸に沿って移動するようにした前記シャフトの回転によって与えられる。

5. 发明专利

JP4883181B2 Component mounting method 有权
公开(公告)号：JP4883181B2
公开(公告)日：2012-02-22
申请号：JP2009528890
申请日：2007-08-17
申请人：富士通株式会社
发明人：和之伊倉 , 徹西野
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0015 , H01L21/70 , H01L21/82 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/85 , H01L25/50 , H01L27/14601 , H01L31/18 , H01L2224/16 , H01L2224/279 , H01L2224/43 , H01L2224/75 , H01L2224/75743 , H01L2224/81121 , H01L2224/81801 , H01L2224/82 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H05K13/0413 , H05K13/0452 , H05K13/0478 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49169 , Y10T29/53174 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： When mounting first and second mounting parts (3A, 3B, 20), an image of a configuration of the second mounting part (20) is taken and an image-recognition is performed. A plurality of first mounting parts are mounted to a board (1) based on a result of the image-recognition of the configuration of the second mounting part, and the second mounting part (20) is mounted to the board (1).

6. 发明专利

JP2010074063A Component placement device, component placement setting calculation device, program, and component placement setting calculation method 有权
标题翻译：组件放置设备，组件放置设置计算设备，程序和组件放置设置计算方法
公开(公告)号：JP2010074063A
公开(公告)日：2010-04-02
申请号：JP2008242654
申请日：2008-09-22
申请人： Hitachi High-Tech Instruments Co Ltd , 株式会社日立ハイテクインスツルメンツ
发明人： CHIDA TAKAFUMI , NAKANO TAKAHIRO , IZUMIHARA KOICHI , TSUJIMOTO YOSHIYUKI
IPC分类号： H05K13/04
CPC分类号： H05K13/0478 , Y10T29/53174
摘要： PROBLEM TO BE SOLVED: To provide a technology for avoiding the occurrence of interference among a plurality of placement heads when the plurality of placement heads simultaneously access a circuit board and a pallet which is arranged in one direction with respect to the circuit board. SOLUTION: When a component placement part 150 having the plurality of placement heads simultaneously pick up components from a pallet 160 and simultaneously place the components on a circuit board, a controller 140 specifies a pair of component groups to be picked up simultaneously from the pallet 160 by the multiple placement heads and places the components on the circuit board so that an area where the plurality of placement heads move in an overlapping manner can be minimized, and the placement heads pick up the components included in the specified pair of component groups, respectively, and place the components on the circuit board. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种技术，用于当多个放置头同时访问电路板和相对于电路板在一个方向上布置的托盘时，避免多个放置头之间的干扰的发生。解决方案：当具有多个放置头的部件放置部分150同时从托盘160拾取部件并同时将部件放置在电路板上时，控制器140指定一对组件组，以从托盘160通过多个放置头并将部件放置在电路板上，使得多个放置头以重叠的方式移动的区域可以最小化，并且放置头拾取包括在指定的一对部件中的部件组，并将组件放置在电路板上。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2007234723A Mounting method and device of electronic component, and manufacturing process of semiconductor device 审中-公开
标题翻译：电子元件的安装方法和装置，以及半导体器件的制造工艺
公开(公告)号：JP2007234723A
公开(公告)日：2007-09-13
申请号：JP2006051888
申请日：2006-02-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KANEHARA MASAHIKO
IPC分类号： H05K13/04 , H05K13/02
CPC分类号： H05K13/0408 , H01L24/75 , H01L24/95 , H01L2924/13055 , H05K13/0478 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of an electronic component in which the time required for mounting a plurality of electronic components at predetermined positions on a circuit board can be shortened. SOLUTION: All or a part of a plurality of semiconductor elements 12 mounted on the surface of a circuit board are contained in the containing holes 18 at a containing section 17 where the semiconductor elements 12 can be previously contained in the same arrangement as the mounting position for the circuit board while overlapping in the vertical direction. The semiconductor elements 12 contained in the containing holes 18 are taken out from the containing holes 18 while suction holding a set of semiconductor elements 12 at a time by means of a transfer tool 19 at an arrangement interval equal to the mounting arrangement interval on the circuit board. After each semiconductor element 12 is transferred to a predetermined position of the circuit board, suction holding of each semiconductor element 12 by the transfer tool 19 is released and each semiconductor element 12 is arranged at the mounting position on the circuit board. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件的安装方法，其中可以缩短在电路板上的预定位置安装多个电子部件所需的时间。解决方案：安装在电路板的表面上的多个半导体元件12的全部或一部分被容纳在容纳部分17中，容纳部分17可以预先包含半导体元件12，其中可以预先包含半导体元件12，电路板的垂直方向重叠的安装位置。包含在容纳孔18中的半导体元件12从容纳孔18中取出，同时通过转印工具19一次保持一组半导体元件12，其间隔等于电路上的安装布置间隔板。在每个半导体元件12被转移到电路板的预定位置之后，通过转印工具19释放每个半导体元件12的吸引力，并且将每个半导体元件12布置在电路板上的安装位置。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2015157348A 保持ヘッド、搬送装置、搬送方法、実装装置、実装方法、及び電子機器审中-公开
标题翻译：保持头，送料装置，进料方法，实施装置，实施方法和电子装置
公开(公告)号：JP2015157348A
公开(公告)日：2015-09-03
申请号：JP2014161313
申请日：2014-08-07
申请人：ソニー株式会社
发明人：馬場彰一 , 深澤宣雄
IPC分类号： H05K13/04 , H01L33/00 , H01S5/02 , B25J15/06
CPC分类号： H05K1/18 , H05K13/021 , H05K13/0452 , H05K13/0478 , Y10T29/49131 , Y10T29/49133 , Y10T29/49139 , Y10T29/5313 , Y10T29/53174 , Y10T29/53191 , Y10T29/53252 , Y10T29/53265
摘要：【課題】搬送回数を低減させることが可能な簡易な構成でなる保持ヘッド、搬送装置、搬送方法、これを用いた実装装置、実装方法、及び電子機器を提供する。【解決手段】保持ヘッド部150は、保持部152と、支持部153とを具備する。前記保持部152は、第1の方向に延在し、2次元状に配置された複数の対象物のうち前記第1の方向に連続して並ぶ複数の対象物からなる対象物群をそれぞれ保持可能な、前記第1の方向と異なる第2の方向に所定の間隔で並ぶ複数の保持体151を含む。前記支持部153は、前記保持部152を支持する。【選択図】図4
摘要翻译：要解决的问题：提供一种具有简单结构并能够减少进给次数的保持头，进给装置和进给方法，并且提供实施装置，实施方法和使用它们的电子设备。解决方案：保持头部分150包括保持器部分152和支撑部分153.保持器部分152包括多个保持器151，该保持器151沿第一方向延伸，并且沿与第二方向不同的第二方向排列所述第一方向以预定间距，其中所述多个保持器中的每一个能够保持包括在二维布置的所述多个对象中的沿所述第一方向串联布置的多个对象的对象组。支撑部153支撑保持器部。

9. 发明专利

JP4811073B2 Electronic component mounting apparatus and an electronic component mounting method 有权
公开(公告)号：JP4811073B2
公开(公告)日：2011-11-09
申请号：JP2006078447
申请日：2006-03-22
申请人：パナソニック株式会社
发明人：徹中園 , 崇内野 , 直樹山内 , 雅夫日高 , 倫史江口 , 唯志篠崎
IPC分类号： H01L21/52 , H01L21/60 , H05K13/04
CPC分类号： H05K13/0478 , H01L21/67144 , H01L24/29 , H01L24/83 , H01L24/97 , H01L2224/83192 , H01L2224/8385 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2224/83
摘要： A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity. In component mount operation for taking chips of component types A, B, and C out of a component supply portion by means of a single mount head and mounting the chips on two substrates held by a first lane and a second lane, when a subsequently-carried-in subsequent substrate has come to be able to undergo component mount operation before completion of processing pertaining to a preceding substrate mount process in which component mount operation is carried out on a previously-carried-in preceding substrate among a plurality of substrates, processing pertaining to a subsequent substrate mount process is started by taking, as mount start components, chips already serving as targets of component mount operation for the preceding substrate at this timing, and processing pertaining to the preceding substrate mount process during which mounting is not yet completed is continually carried out. Thereby, the frequency of operation required with switching of a component type, such as replacement of a nozzle, can be reduced.

10. 发明专利

JP2009135259A Transport device and transport method of segmented electronic component 有权
标题翻译： SEGMENTED电子元件的运输设备和运输方法
公开(公告)号：JP2009135259A
公开(公告)日：2009-06-18
申请号：JP2007309905
申请日：2007-11-30
申请人： Towa Corp , Towa株式会社
发明人： IWATA YASUHIRO , YAMAJI SHUZO , NAKAJIMA SHINYA , KASHIWAMURA JUNKO
IPC分类号： H01L21/677 , B25J15/06 , H01L21/50 , H05K13/02
CPC分类号： H05K13/0478
摘要： PROBLEM TO BE SOLVED: To efficiently transport segmented electronic components arranged on a stage in a lattice-like form onto a table to be arranged in a zigzag form, and to efficiently transport the electronic components from the upper surface of the table. SOLUTION: On the table TA of this transport device of segmented electronic components, a first housing part S1 for housing the electronic components P located at positions corresponding to one color of a checkered pattern within the plurality of electronic components P therein, a second housing part S2 for housing the electronic components P located at positions corresponding to the other color of the checkered pattern are arranged adjacently to each other. The table TA is provided with a transport mechanism transporting the electronic components P for one line (five) along the X-direction within the plurality of electronic components P housed in the zigzag form at pitches 2p by collectively sucking them. A plurality of suction mechanisms each sucking the electronic components P for one line are arranged at the pitches 2p in the transport mechanism. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：将布置在格子状的平台上的分段电子部件有效地传送到以锯齿形布置的台面上，并且有效地将电子部件从台面的上表面传送。解决方案：在该分段电子部件的传送装置的台TA上，设置有用于容纳位于与多个电子部件P内的方格图案的一种颜色相对应的位置的电子部件P的第一壳体部S1，用于容纳位于与方格图案的其他颜色相对应的位置的电子部件P的第二壳体部分S2彼此相邻地布置。台TA具有传送机构，其通过集中吸附它们以间距2p以间距2p将多个电子部件P沿着X方向一行（五个）传送。在输送机构的间距2p处配置有分别吸引一行的电子部件P的多个吸引机构。版权所有（C）2009，JPO＆INPIT

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