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1. 发明专利

JP2007258319A Electronic component mounting device, and method therefor 有权
标题翻译：电子元件安装装置及其方法
公开(公告)号：JP2007258319A
公开(公告)日：2007-10-04
申请号：JP2006078447
申请日：2006-03-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHINO TAKASHI , SHINOZAKI TADASHI , EGUCHI TOMOFUMI , YAMAUCHI NAOKI , HIDAKA MASAO , NAKAZONO TORU
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H05K13/0478 , H01L21/67144 , H01L24/29 , H01L24/83 , H01L24/97 , H01L2224/83192 , H01L2224/8385 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2224/83
摘要： PROBLEM TO BE SOLVED: To provide electronic component mounting device and method which can enhance productivity by reducing the frequency of a work required when the type of the component is switched. SOLUTION: The component mounting work for takes out the chips of component types A, B and C from a component feeder by means of a single mounting head, and mounts them on two sheets of substrate held on first and second lanes. If such a state as the component mounting operation of a subsequent substrate can be performed before completing the mounting process of a preceding substrate is brought about in the process performing the component mounting operation of the preceding substrate among a plurality of substrates, following substrate mounting process is started at that timing for the objective chip of the component mounting operation onto the preceding substrate as a mounting start component, thus continuing the not-yet-completed preceding substrate mounting process. Consequently, the frequency of a work required can be reduced when the type of component is switched. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件安装装置和方法，其可以通过减小当切换部件的类型所需的工作频率时提高生产率。
解决方案：组件安装工作，通过单个安装头从组件进料器中取出组件类型A，B和C的芯片，并将其安装在保持在第一和第二通道上的两块基板上。在进行多个基板中的前述基板的部件安装动作的处理中，在完成前一基板的安装处理之前，可以进行如下的后续基板的部件安装动作的状态，随后的基板安装工序在该定时将元件安装操作的目标芯片作为安装起动部件开始，从而继续尚未完成的先前的基板安装工艺。因此，当切换组件的类型时，可以减少所需工作的频率。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JPH06163642A METHOD OF JUDGING WHETHER STICKING CONDITION OF CONDUCTIVE FILM IS GOOD OR BAD 失效
公开(公告)号：JPH06163642A
公开(公告)日：1994-06-10
申请号：JP30670892
申请日：1992-11-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： H01L21/60 , H01L21/00
摘要： PURPOSE:To provide a method of automatically judging whether the sticking condition of the conductive film stuck to an electrode for bonding a driver to this electrode of a display panel is good or bad. CONSTITUTION:It is judged whether the sticking condition of a conductive film is good or bad from the matching rate being operated by observing the anisotropic conductive film stuck to the electrode 2 of a display panel 1 being the object of inspection with a camera 12, and taking in its image data, and collating the this image data with the reference pattern registered in a memory. By the height of matching rate, it can be judged automatically whether the sticking condition of a conductive film 7 is good or bad.

3. 发明专利

JPH02234491A DECISION OF SUCCESS OR FAILURE IN PRELIMINARY TEST IN REFLOWING 失效
公开(公告)号：JPH02234491A
公开(公告)日：1990-09-17
申请号：JP5546589
申请日：1989-03-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： B23K1/00 , H05K3/34
摘要： PURPOSE:To simply and accurately assure the decision of success or failure in a preliminary test in reflowing by displaying a measured substrate temperature change curve and a band-shaped success/failure decision curve having an allowable width. CONSTITUTION:Temperature sensitive sensors 5a-5c attached to the center and opposite sides of a substrate 3 by an adhesive tape are connected to a computer 12 via an A/D converter 11. Additionally, the computer 12 includes a printer 13 as a display device connected hereto, on a recording paper 14 of which a temperature change curve measured by the temperature sensitive sensors 5a-5c are recorded. The substrate 3 is carried in a heating chamber 1, and a resulting temperature change is graphically displayed and a band-shaped success/-failure decision curve N is displaced. A worker decides success or failure based upon differences between the temperature curves a-c and the curve N. Hereby, decision of success/failure in a preliminary test in reflowing is assured.

4. 发明专利

JP2001083904A ADHERING DEVICE AND METHOD OF CONDUCTIVE FILM 失效
公开(公告)号：JP2001083904A
公开(公告)日：2001-03-30
申请号：JP2000216948
申请日：2000-07-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO , SAKAI HIROAKI
IPC分类号： G01N21/84 , G02F1/13 , G02F1/1345 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide adhering device and method of a conductive film that can speedily and adequately perform an inspection of an adhering state of the conductive film adhered to a display panel. SOLUTION: This device comprises a positioning means for positioning a display panel 1, a conductive film supplying means for supplying a conductive film in a state in which a separator 101 is adhered to it, an adhering means for adhering the conductive film supplied by the conductive film supplying means to the display panel 1, a separating means for separating the separator 101 from the conductive film adhered to the display panel 1, and an inspecting means for determining suitability of the adhering state of the conductive film. At least a separation starting position of the separator 101 of the conductive film adhered to the display panel 1 is optically observed to inspect the suitability of the adhering state of the conductive film.

5. 发明专利

JP2001083477A DEVICE AND METHOD FOR STICKING CONDUCTIVE FILM 失效
公开(公告)号：JP2001083477A
公开(公告)日：2001-03-30
申请号：JP2000216949
申请日：2000-07-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO , SAKAI HIROAKI
IPC分类号： G02F1/13 , G02F1/1345 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for sticking a conductive film capable of automatically and adequately inspecting the sticking condition of the conductive film stuck to a display panel in a short time. SOLUTION: After the position of the display panel 1 on a holder 8 is recognized by a camera 60, the conductive film on which a separator 101 is stuck is supplied to the panel 1, and the film is stuck by a press-contacting head 44. Next, the separator 101 on the conductive film is peeled by an adhesive tape, a user can observe the conductive film by the camera 60, and decides whether or not the sticking condition is good.

6. 发明专利

JPH07141021A OPERATION CONTROLLER 失效
公开(公告)号：JPH07141021A
公开(公告)日：1995-06-02
申请号：JP28657793
申请日：1993-11-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： H05K13/04 , G05B23/02
摘要： PURPOSE:To prevent a working rate from being lowered by an operation check by comparing the operation time of each operation with reference time and specifying an operation defect position. CONSTITUTION:When an operation time measuring operation is selected, the value of a timing counter 5 at the time of operation start, namely, operation start time is recorded in a RAM 2, a substrate recognizing operation is performed by a recognition means as one of mechanism groups 3 and as soon as this operation is completed, the end time is recorded. Next, a CPU 6 accesses the RAM 2, calculates the operation time by subtracting the operation start time from the operation end time, compares this operation time with the previously stored reference time, decides normality when the operation time is less than the reference time or decides abnormality in the other case, displays the operation defect position on a CRT 8 and prints it by a printer 8. Thus, the operator or the engineer can easily recognize the operation defect position.

7. 发明专利

JPH0764104A STICKING DEVICE AND STICKING METHOD FOR CONDUCTIVE FILM 失效
公开(公告)号：JPH0764104A
公开(公告)日：1995-03-10
申请号：JP21283393
申请日：1993-08-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO , SAKAI HIROAKI
IPC分类号： G02F1/1345 , H01L21/60
摘要： PURPOSE:To automatically execute a series of processing from positioning of display panels to inspection of sticking states by providing the sticking device with a peeling means for peeling separators from conductive films stuck to the display panels and an inspecting means for deciding the normal/defective condition of the sticking states of the conductive films. CONSTITUTION:The positioning marks disposed at two points in the angle parts of the display panels are first recognized by a camera 60 to check the position of the display panel. The sticking means B is then driven to successively stick the separators and conductive films to sticking positions by a sticking action. The peeling means C is then driven and the separators are peeled by the peeling action. The peeled separators are stuck to a tacky adhesive tape and are recovered on a take-up reel. Inspection is made as to the peeling states of the separators and the sticking states of the conductive films. The inspection is ended unless there are defective points. Retry is executed if there are the defective points. Namely, the sticking device is provided with the sticking means B for sticking the display panels, the peeling means C for peeling the separators from the conductive films stuck to the display panels and the inspecting means for deciding the normal/defective condition of the sticking state of the conductive films.

8. 发明专利

JPH06163643A CONDUCTIVE FILM STICKING DEVICE 失效
公开(公告)号：JPH06163643A
公开(公告)日：1994-06-10
申请号：JP30670792
申请日：1992-11-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： H01L21/60
摘要： PURPOSE:To stick a conductive film for bonding a driver to an electrode of a display panel such as a liquid crystal panel, etc., efficiently. CONSTITUTION:A conductive film sticking device is composed of a drawing-out means 71, which draws out a conductive film 7 along the bottom of a suction head 54 for sucking a conductive film 7, a cutting means, which cuts this conductive film 7 provided on the lead path of the conductive film 7, and a vertically shifting means 52, which makes the suction head 54 perform the vertical movement to a display panel 10. Hereby, a plurality of conductive films 7 can be stuck at the same time to the display panel 10, so the work efficiency is improved remarkably, and besides the length of the conductive film 7 can be changed freely, according to the kinds of display panels 10.

9. 发明专利

JPH05299829A 失效
公开(公告)号：JPH05299829A
公开(公告)日：1993-11-12
申请号：JP10081992
申请日：1992-04-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： B23K1/012 , H05K3/34
摘要： PURPOSE:To provide a reflow equipment in which soldering parts or a chip is protected against excessive reheating. CONSTITUTION:An upper hot air route A for blowing hot air to the top surface of a substrate S is disposed at the upper part of a heating chamber 1 while a lower hot air route B for blowing hot air to the bottom surface of the substrate S is disposed at the lower part of the heating chamber 1. Means 9, 12 for switching the routes A, B and blowing hot air selectively to the top surface or the bottom surface of the substrate S are also provided. This constitution prevents a soldering part H1 on the under side of the substrate S from being reheated and fused, at the time of second reflow, to cause falling of a chip P1 down from the soldering part H1 thus avoiding thermal breakdown of the chip P1.

10. 发明专利

JP2000091387A EQUIPMENT AND METHOD FOR THERMOCOMPRESSION BONDING 失效
公开(公告)号：JP2000091387A
公开(公告)日：2000-03-31
申请号：JP25653198
申请日：1998-09-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIDAKA MASAO
IPC分类号： H01L21/60 , G05D23/00 , H01L21/52 , H01L21/603
摘要： PROBLEM TO BE SOLVED: To provide an equipment and a method for thermocompression bonding which can shorten tact time by making an efficient heating control. SOLUTION: A method for thermocompression bonding having an electronic component is pressed against a work to be subjected to thermocompression bonding, while being heated by a thermocompression bonding head constituted of a heater 4 and a thermocouple 5 for detecting the heating temperature of the heater 4. The heater 4 is controlled by a temperature control section 22, based on the temperature detection result by the thermocouple 5. When a fixed contact 6 and a movable contact 7 for connecting and disconnecting a circuit for electrically connecting the temperature control section 22 to the thermocouple 5 and the heater 4 are in a disconnected state, the thermocouple 4 holds the temperature value detected, immediately before it is disconnected from the temperature control section 22 and inputs the value to the temperature control section 22. Thereby, the temperature control can be conducted continuously without interruption. Thus, heating control can be conducted efficiently without having to discontinue temperature control.

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