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1. 发明专利

JP2000167767A WAFER POLISHING DEVICE AND MANUFACTURE OF WAFER BY USING IT 失效
公开(公告)号：JP2000167767A
公开(公告)日：2000-06-20
申请号：JP34753898
申请日：1998-12-07
申请人： MITSUBISHI MATERIALS CORP , SAIBEKKU NANO TECHNOL INC
发明人： KAJIWARA JIRO , KOMAZAKI MASAHITO
IPC分类号： B24B37/07 , B24B37/30 , B24B37/32 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To adjust the gap between a wafer hold head and polishing pad properly and polish a wafer uniflormly by providing a gap adjust mechanism which can adjust the distance size between the wafer hold head and polishing pad. SOLUTION: A wafer is sucked for the wafer sucking seat provided on a carrier, while the projection length from the second hit together part 22 of an adjust member is adjusted. Thereby, when an upperside instalation plate 19 is lowered by an elevator 18 and the lower surface of the first hit together part 24 is contacted with the gap adjust cap of a gap adjust mechanism 23, the lower surface of the wafer and the lower surface of a retainaer are just contacted with the polishing pad 16. Thus, when the wafer is contacted with the polishing pad, a diaphragm is not bent downward. Thereby, the uniformity of the polished surface of the wafer can be ensured favorably.

2. 发明专利

JP2000176827A WAFER LOADING DEVICE AND MANUFACTURE OF WAFER 失效
公开(公告)号：JP2000176827A
公开(公告)日：2000-06-27
申请号：JP35675398
申请日：1998-12-15
申请人： MITSUBISHI MATERIALS CORP , SAIBEKKU NANO TECHNOL INC
发明人： KAJIWARA JIRO , KOMAZAKI MASAHITO
IPC分类号： B24B37/00 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To easily and stably position a wafer and a wafer loading face of a polishing head when the wafer is loaded on the polishing head. SOLUTION: A loading device 1 is provided with a plane-viewed circular loading part 2 equipped with a base body part 17, a wafer supporting part 18, and a retainer ring engaging part 19. Then, the retainer ring engaging part 19, and the base body part 17 and the wafer supporting part 18, are respectively connected by a first energizing means 21 and a second energizing means 22. The wafer supporting part 18 is adapted to be floated on the retainer ring engaging part 19 and the base body part 17. Thus, when a wafer W is loaded, the wafer W is guided to the inner peripheral wall surface etc., of the retainer ring engaging part 19 by the floating effect to be positioned, and thereby the wafer W can be positively loaded on the polishing head.

3. 发明专利

JP2000052230A TRUING DEVICE FOR WAFER POLISHING PAD 失效
公开(公告)号：JP2000052230A
公开(公告)日：2000-02-22
申请号：JP21837198
申请日：1998-07-31
申请人： MITSUBISHI MATERIALS CORP , SAIBEKKU NANO TECHNOL INC
发明人： KAJIWARA JIRO , KOMAZAKI MASAHITO , SANO HITOAKI , FUJIMOTO KENJI , ADACHI HITOSHI
IPC分类号： B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a truing device for a wafer polishing pad capable of stably truing a polishing pad by abutting a truing grinding wheel in parallel to the polishing pad. SOLUTION: A truing device 1 is provided with a truing grinding wheel part 2 having an abrasive grain layer 2a and a grinding wheel part supporting mechanism 5 for tiltably, turnably supporting the truing grinding wheel part 2. The truing grinding wheel part 2 is rotated by friction against a polishing pad 31 evolved by the rotation of the polishing pad 31. An abutting angle between the truing grinding wheel part 2 and the polishing pad 31 is controlled by an abutting angle controlling means having an arm rocking mechanism 7 and a rotating speed detecting means 9. The result stably trues the polishing pad 31.

4. 发明专利

JPH0814018A VALVE ACTUATOR AND ENGINE USING IT 失效
公开(公告)号：JPH0814018A
公开(公告)日：1996-01-16
申请号：JP15003194
申请日：1994-06-30
申请人： MITSUBISHI MATERIALS CORP
发明人： KANEKAWA KINJI , KOMAZAKI MASAHITO , OKAWA TAKANORI
IPC分类号： F01L1/46 , F01L9/04 , F16K31/04
摘要： PURPOSE:To regulate opening of a valve continuously and stably and simplify fail-safe at failure and the structure of an intake tube, etc. CONSTITUTION:A valve actuator comprises a shaft 22 which is arranged along the opening/closing direction of a valve 21 and has one end for attaching a valve body 21a of a valve 21 and a drive means 23 for reciprocating it in its longitudinal direction, and the drive means 23 is provided with a motor 26 and a linear movement means 27 for reciprocating the rotor 25 in the axial C direction. Screw parts 22a, 36a for shifting rotary action of the rotor 25 to reciprocating action of the shaft 22 by mutual screwing are provided in the shaft 22 and the rotor 25, a guide means 37 which suppresses its rotation and supports so as to linearly move in the axis C direction is provided in the shaft 22, and the linear movement means 27 is formed from a temperature sensing material which can be expanded/contracted according to temperature change so that the valve body 21a is operated in a fail-safe side.

5. 发明专利

JPH06225514A POWER TRANSMISSION APPARATUS 失效
公开(公告)号：JPH06225514A
公开(公告)日：1994-08-12
申请号：JP851893
申请日：1993-01-21
申请人： MITSUBISHI MATERIALS CORP
发明人： KOMAZAKI MASAHITO , OKAWA TAKANORI , IKUTA KOJI , ORITA SHOICHI
IPC分类号： F16H37/00 , F16H49/00 , H02K49/00
摘要： PURPOSE:To provide a power transmission apparatus wherein the torque range of its compliance is made wide, its response property is increased, its constitution is simple when the torque of its compliance is changed, its energy is saved and its durability is excellent. CONSTITUTION:The title transmission apparatus is provided with a driving magnetic gear 2 in which different magnetic poles have been magnetized alternately at definite intervals in a driving direction and with a follower magnetic gear 4 to which a movable part 3 is attached and in which different magnetic poles have been magnetized alternately at the same interval as the magnetization interval of the driving gear 2. The magnetic gear 2 and the magnetic gear 4 are moved so as to be relatively brought close to each other and separated from each other by a piezoelectric-element actuator 9 and their compliance can be made variable.

6. 发明专利

JP2000343422A WAFER POLISHING DEVICE AND MANUFACTURE OF WAFER 失效
公开(公告)号：JP2000343422A
公开(公告)日：2000-12-12
申请号：JP15880299
申请日：1999-06-04
申请人： MITSUBISHI MATERIALS CORP
发明人： HOSOKI KANJI , SHIBATANI HIROSHI , IIZUKA KAZUO , KOMAZAKI MASAHITO
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of polishing a wafer stably and its manufacturing method. SOLUTION: A wafer holding head 1 is provided with a head main body 2, a diaphragm 5 stretched in the head main body 2, a carrier 6 which is fixed on the diaphragm 5, is provided so as to displace in the direction of axial line of the head together with the diaphragm 5, and holds one face of a wafer W, a retainer ring 7 which is concentrically arranged at outer periphery of the carrier 6, is fixed on the diaphragm 5, and is provided so as to displace in the direction of axial line of the head together with the diaphragm 5, and a thin plate 20 like a circular ring fixed on an upper face of the diaphragm 5. The twist acting on the diaphragm 5 when the wafer W is polished is suppressed by the thin plate 20 so that the wafer W is stably polished.

7. 发明专利

JP2000225557A WAFER POLISHING HEAD, WAFER POLISHING DEVICE, AND MANUFACTURE OF WAFER 失效
公开(公告)号：JP2000225557A
公开(公告)日：2000-08-15
申请号：JP2938999
申请日：1999-02-05
申请人： MITSUBISHI MATERIALS CORP
发明人： HOSOKI KANJI , SHIBATANI HIROSHI , KOMAZAKI MASAHITO , SANO HITOAKI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To enhance the uniformity in polishing of a wafer surface by preventing a polishing pad from undulate deformation. SOLUTION: A wafer polishing head H is equipped with a head body 1 consisting of a top plate 1a and circumferential wall 1b, a diaphragm 2 installed stretching inside the head body 1, a carrier 3 to displace a wafer W in association with deformation of the diaphragm 2, a retaier ring 4 fixed to the udersurface of the diaphragm 2 and arranged displaceably in compliance with the deformation of the diaphragm, and a pressure adjusting mechanism 5 to deform the diaphragm 2 in the head axial direction L, wherein between the head body 1 and diaphragm 2, a spacer is removably interposed in such a way as constituting a flange. This reduces the pressure acting on a polishing pad P through the retainer ring and prevents the polishing pad P from undulate deformation.

8. 发明专利

JPH084634A ACTUATOR FOR VALVE AND ENGINE USING THIS ACTUATOR 失效
公开(公告)号：JPH084634A
公开(公告)日：1996-01-09
申请号：JP13921994
申请日：1994-06-21
申请人： MITSUBISHI MATERIALS CORP
发明人： KANEKAWA KINJI , KOMAZAKI MASAHITO , OKAWA TAKANORI
IPC分类号： F02M69/32 , F16K31/04
摘要： PURPOSE:To provide an actuator for a valve capable of driving a valve into stepless and adjusting the valve into the suitable position in the disconnection of a motor coil. CONSTITUTION:A sleeve 105 as a rotary shaft of a motor 110 is rotatably provided so as to be freely moved in the shaft center direction, and an internal threaded hole 105a is formed inside the sleeve 105, and a shaft 106 is screwed into the internal threaded hole 105a so as to be moved into the shaft center CR direction, and a stopper-like valve 104 is formed on the end of the shaft 106 projecting from the opening end of the internal threaded hole 105a. Moreover, an opening/closing surface 104a is provided on the valve 104 in the shaft center CT direction, and a structure for stopping the rotation of the shaft 106 is provided between the shaft 106 and a case 111 of a motor 110, and a second helical spring 9 is provided for energizing the shaft 106 in the closing direction of the valve 104 in the shaft center CT direction.

9. 发明专利

JPH07250452A MOTOR APPARATUS 失效
公开(公告)号：JPH07250452A
公开(公告)日：1995-09-26
申请号：JP3937994
申请日：1994-03-10
申请人： MITSUBISHI MATERIALS CORP
发明人： KOMAZAKI MASAHITO , OKAWA TAKANORI , NAKAMURA TSUGUO
IPC分类号： H02K7/09
摘要： PURPOSE:To provide a compact motor apparatus, which has excellent durability, can perform high-speed rotation and can be used in special atmosphere. CONSTITUTION:In a motor apparatus, a rotor 311 provided on a rotating shaft 200 is rotated by a magnetic field, which is excited with a stator 312. A cylindrical magnet 271 is provided on the rotating shaft 200. A ring magnet 272 is provided so that the same pole surfaces face to each other with the slight interval being provided on the side of the tip part of the rotating shaft 200. The inner diameter of the ring magnet 272 is slightly larger than the outer diameter of the cylindrical magnet 271. The rotating shaft 200 is supported in the radial direction at the center of the ring magnet 272 by the mutual magnetic actions of the ring magnet 272 and the cylindrical magnet 271. A load is applied on the direction of the tip part of the rotating shaft 200 in the thrust direction. The tip part of the rotating shaft 200 is in contact with a stage 210 and supports the load in the thrust direction.

10. 发明专利

JPH07248022A BEARING DEVICE 失效
公开(公告)号：JPH07248022A
公开(公告)日：1995-09-26
申请号：JP3937894
申请日：1994-03-10
申请人： MITSUBISHI MATERIALS CORP
发明人： KOMAZAKI MASAHITO , OKAWA TAKANORI , NAKAMURA TSUGUO
IPC分类号： F16C32/00 , F16C32/04
摘要： PURPOSE:To provide a bearing device having less friction, abrasion, vibration and noise, and having a high durability, by providing a radial magnetic support part composed of cylindrical and ring-like magnets, and a thrustwise mechanical support part for supporting an end part of a rotary shaft. CONSTITUTION:In a bearing device 110, a magnetic field indicated by magnetic force lines 410 is generated by a ring-like magnet 22. A cylindrical magnet 221 is located in the magnetic field, having an S pole surface facing that of the ring-like magnet 222. A magnetic force 420 going into the ring-like magnet 222 along the magnetic force lines 410 acts upon the S pole surface of the cylindrical magnet 221. Meanwhile, a magnetic force 430 going away from the ring-like magnet 222 along the magnetic force lines 410 acts upon the N-pole surface of the cylindrical magnet 221. By the way, the magnetic field has its strength which is maximum in the ring-like magnet 222, and which decreases as it goes outward from the magnet 222, and accordingly, the magnetic force 420 is greater than that of the magnetic force 430. As a result, the force going into the ring-like magnet 222 acts upon the cylindrical magnet 221.

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