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1. 发明专利

JP2000052230A TRUING DEVICE FOR WAFER POLISHING PAD 失效
公开(公告)号：JP2000052230A
公开(公告)日：2000-02-22
申请号：JP21837198
申请日：1998-07-31
申请人： MITSUBISHI MATERIALS CORP , SAIBEKKU NANO TECHNOL INC
发明人： KAJIWARA JIRO , KOMAZAKI MASAHITO , SANO HITOAKI , FUJIMOTO KENJI , ADACHI HITOSHI
IPC分类号： B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a truing device for a wafer polishing pad capable of stably truing a polishing pad by abutting a truing grinding wheel in parallel to the polishing pad. SOLUTION: A truing device 1 is provided with a truing grinding wheel part 2 having an abrasive grain layer 2a and a grinding wheel part supporting mechanism 5 for tiltably, turnably supporting the truing grinding wheel part 2. The truing grinding wheel part 2 is rotated by friction against a polishing pad 31 evolved by the rotation of the polishing pad 31. An abutting angle between the truing grinding wheel part 2 and the polishing pad 31 is controlled by an abutting angle controlling means having an arm rocking mechanism 7 and a rotating speed detecting means 9. The result stably trues the polishing pad 31.

2. 发明专利

JPH1190802A METHOD AND DEVICE FOR POLISHING CHAMFERED FACE OF WAFER 失效
公开(公告)号：JPH1190802A
公开(公告)日：1999-04-06
申请号：JP24904997
申请日：1997-09-12
申请人： MITSUBISHI MATERIALS CORP
发明人： YANOO AKIHITO , ADACHI HITOSHI , HIGUCHI AKIRA
IPC分类号： B24B9/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method capable of satisfactorily polishing the whole inner peripheries of the notched sections of a wafer and a device thereof of simple structure and a low cost. SOLUTION: This polishing device is equipped with wafer retaining structure 5 to retain a wafer W chamfered at its outer circumference and notched sections, in a given position, a notched section polishing wheel 24 installed as to intersect the wafer W and rotated on an axis, energizing mechanism 28 to energize and press the notched section polishing wheel 24 against the notched sections of the wafer W with an almost constant pressure, and reciprocating mechanism to move the notched section polishing wheel 24 and the energizing mechanism 28 back and forth in the direction as to intersect the face of the wafer W at right angles. By reciprocating the notched section polishing wheel 24 across the wafer face at right angles while pressing the wheel 24 against the inner face of the notched sections with a constant pressure, the notched section polishing wheel 24 advances or retreats in the diametral direction of the wafer W following the contour of the inner face of the notched section.

3. 发明专利

JPH09249487A UPPER SHAFT SUPPORT STRUCTURE FOR SINGLE CRYSTAL PULLING-UP APPARATUS 失效
公开(公告)号：JPH09249487A
公开(公告)日：1997-09-22
申请号：JP5812296
申请日：1996-03-14
申请人： MITSUBISHI MATERIALS CORP
发明人： HIGUCHI AKIRA , ADACHI HITOSHI
IPC分类号： B66D1/12 , C30B15/20 , C30B15/30 , C30B29/06
摘要： PROBLEM TO BE SOLVED: To ensure a wire for suspending a single crystal not to shake based on a simple scheme. SOLUTION: This system is equipped with a wire 13 to pull a semiconductor single crystal from the semiconductor melt in a crucible held in an airtight vessel 2c, a housing 9 to hold a winder 14 for the wire 13, and a support mechanism 35 to revolvably support the housing 9 on the upper end of the airtight vessel 2c. The support mechanism 35, which is integrally mounted on the upper end of the airtight vessel 2c, is made up of a 1st ring member 25 with the upper surface representing spherical support face 25a, a 2nd ring member 28 having spherical support face 28a being in uniform contact with the face 25a, and a rotary hollow shaft member 26 revolvably mounted on the 2nd ring member and integrally linking the housing 9 on the upper end. The center of curvature of both the spherical support faces 25a, 28a each coincide with the winding contact point P of the wire 13 by the winder 14.

4. 发明专利

JP2000052240A WAFER POLISHING DEVICE 失效
公开(公告)号：JP2000052240A
公开(公告)日：2000-02-22
申请号：JP21837398
申请日：1998-07-31
申请人： MITSUBISHI MATERIALS CORP
发明人： KAJIWARA JIRO , SHIBATANI HIROSHI , HOSOKI KANJI , FUJIMOTO KENJI , ADACHI HITOSHI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To easily work out a countermeasure on the occurrence of a polishing failure by easily locating a head used for polishing a manufactured wafer in question. SOLUTION: In the wafer polishing device, a head rotary mechanism is provided with wafer-holding heads 29 at positions facing the surface of a platen and run in parallel with a polishing pad, and arranged at spaced intervals around the revolving shaft of a carousel 34. The head rotary mechanism is provided with a rotary position detecting means 49 for detecting the positions of the wafer-holding heads 29 relative to the revolving shaft of the carousel 34.

5. 发明专利

JPH09249483A CONTINUOUS CHARGING TYPE APPARATUS FOR PULLING UP SINGLE CRYSTAL 失效
公开(公告)号：JPH09249483A
公开(公告)日：1997-09-22
申请号：JP5812396
申请日：1996-03-14
申请人： MITSUBISHI MATERIALS CORP
发明人： MUNEZANE KENJI , ADACHI HITOSHI
IPC分类号： C30B15/02
摘要： PROBLEM TO BE SOLVED: To prevent a raw material for a single crystal from being bitten in by a sealing member and thereby prevent the airtightness from deteriorating due to the sealing member. SOLUTION: This continuous charging type apparatus for pulling up a single crystal comprises a raw material feeder 1 for continuously feeding a raw material for growing the single crystal and a raw material feeding pipe 2 for leading the raw material for the single crystal fed from the material feeder 1 to a crucible installed in an airtight vessel. The continuous charging type apparatus is further equipped with the first gate valve 8 capable of shutting off or opening the raw material feeding pipe in a state shereof keeping the airtightness from the airtight vessel in the course of the raw material feeding pipe 2 and the second gate valve 15, located on the raw material feeding side from the first gate valve 8 and capable of shutting off or opening the raw material feeding pipe 2.

6. 发明专利

JPH05245562A 失效
公开(公告)号：JPH05245562A
公开(公告)日：1993-09-24
申请号：JP4733492
申请日：1992-03-04
申请人： MITSUBISHI MATERIALS CORP
发明人： ADACHI HITOSHI
IPC分类号： B21D19/00 , B21D22/28 , B21D51/26
摘要： PURPOSE:To provide a device for contracting/expanding of a diameter of a can having simpler structure and lower cost than the one provided currently on a manufacturing line. CONSTITUTION:The device is provided with a diameter contracting device 1 for applying the drawing work at multi-steps to the opening end of a can C successively, a diameter expanding device 3 for applying the flanging work to the opening end of the can C discharged from the diameter contracting device 1 and a carrier passage 2 provided between the diameter contracting device 1 and the diameter expanding device 3. In the diameter contracting device 1, plural diameter contracting dies are arranged along the carrying direction of the can C, and by advancing the diameter contracting dies at the same time, the opening end of the can C is made to gradually contract the diameter. In the diameter expanding device 3, by advancing the diameter expanding die while linking with the carrying movement of the can C, the diameter of the opening end of the can C is expanded.

7. 发明专利

JP2000052239A WAFER POLISHING DEVICE 失效
公开(公告)号：JP2000052239A
公开(公告)日：2000-02-22
申请号：JP21837298
申请日：1998-07-31
申请人： MITSUBISHI MATERIALS CORP
发明人： KAJIWARA JIRO , HOSOKI KANJI , IIZUKA KAZUO , FUJIMOTO KENJI , ADACHI HITOSHI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To sufficiently assure a space required for tool operation above a head body; and to easily rotates and operates a tool without projecting a locking part for holding a carrier to above the head body. SOLUTION: A locking part 60 locking and unlocking with and from a carrier 38 is constituted not to project from the upper surface of a head body 32 at the engaging position and the removing position relative to the carrier 38. The result projects no locking part 60 for holding the carrier 38 to above the head body 32, sufficiently assuring a space required for tool operation above the head body 32.

8. 发明专利

JPH08295309A NITROGEN FILLING SEAMING APPARATUS 失效
公开(公告)号：JPH08295309A
公开(公告)日：1996-11-12
申请号：JP9723395
申请日：1995-04-21
申请人： MITSUBISHI MATERIALS CORP
发明人： TASHIRO KATSUNORI , NOMURA TOSHIHIDE , ADACHI HITOSHI
IPC分类号： B65B31/02
摘要： PURPOSE: To provide a nitrogen filling seaming apparatus capable of continuously and automatically performing seaming to enhance production efficiency, low in cost and reducing the consumption amt. of nitrogen. CONSTITUTION: A can feed conveyor 3 is driven in the direction shown by an arrow A to feed a plurality of cans 4 in parallel in the direction shown by the arrow A. A known seamer 1 having a turret 1a or a seaming roller 1b is provided on the way of the route of the can feed conveyor 3. This seamer 1 seams the cans 4 covered with can lids 5 fed on the can feed conveyor 3 successively and continuously and mounted, for example, on the stand 13 arranged on the floor 18 of a factory. The seamer 1 is provided in a first gas filled chamber 15 filled with nitrogen gas under required pressure and the stand 14 loaded with a can lid feeder 2 is arranged on the floor 18 in parallel to the seamer 1. The can lid feeder 14 covers the cans fed on the can feed conveyor 3 in the direction shown by the arrow A with can lids 5 successively.

9. 发明专利

JPH0875672A SURFACE INSPECTING APPARATUS FOR CAN 失效
公开(公告)号：JPH0875672A
公开(公告)日：1996-03-22
申请号：JP21023294
申请日：1994-09-02
申请人： MITSUBISHI MATERIALS CORP
发明人： ADACHI HITOSHI , KIMURA TETSUYA , HAMA KAZUHIRO , KATANO TOMOKAZU
IPC分类号： G01B11/30 , G01N21/90
摘要： PURPOSE: To provide a surface inspecting apparatus for a can by which the high-speed inspection can be performed. CONSTITUTION: A turret index mechanism 1 has a plurality of turning pockets 5. A holder 7 holds the bottom part of a can in each turning pocket 5. A rotating mechanism rotates the can with the axial line of the can itself as the center by rotating the holder 7 located at an inspecting point. A plurality of line cameras 12, which inspect the outer surface of the rotating can, are provided at the respective regions, which are obtained by dividing the outer surface of the rotating cans arranged at the inspecting point in the direction of the axial line of the can. These parts are provided.

10. 发明专利

JP2000024910A GRINDING METHOD AND DEVICE FOR WAFER AND MANUFACTURING OF WAFER BY USING IT 失效
公开(公告)号：JP2000024910A
公开(公告)日：2000-01-25
申请号：JP18950198
申请日：1998-07-03
申请人： MITSUBISHI MATERIALS CORP
发明人： KAJIWARA JIRO , FUJIMOTO KENJI , ADACHI HITOSHI
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To surely grind a wafer under the same grinding condition by sending a dummy wafer to each wafer retaining head. SOLUTION: A head loading module 16 receives a wafer W and a dummy wafer W' adsorbed and conveyed by a convey robot 14 on its loading part 161 at a point of a rotatable arm 160 in the delivery position A from the convey robot 14. A grinding part 17 for grinding the surfaces of the wafer W and the dummy wafer W' is mounted in adjacent to the head loading module 16. The grinding part 17 comprises a rotatable platen 170 comprising a grinding pad on its upper surface, a rotatable carousel at an upper part of the platen 170, and a plurality of heads rotatably mounted at a lower outer edge part of the carousel at specific intervals. The wafer W and the dummy wafer W' of the loading part 161 of the head loading module 16 are pressed to a lower surface part of the head.

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