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1. 发明专利

JP2004087574A Aligning apparatus and aligning method employing imaging means 有权
公开(公告)号：JP2004087574A
公开(公告)日：2004-03-18
申请号：JP2002243266
申请日：2002-08-23
申请人： Ibiden Co Ltd , Mitsubishi Electric Corp , イビデン株式会社 , 三菱電機株式会社
发明人： ITO TADASHI , SASAMORI SATOSHI , SUGIMOTO AKIRA , IWAI YASUHIKO , ENOMOTO AKIRA , KARIYA TAKASHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an aligning apparatus whereby a reference position of a camera for alignment can simply be set.
SOLUTION: In the aligning apparatus provided with a lower table 21 for supporting a lower board 41 to produce a multilayer board; a board carrying table 23 placed opposite to the lower table 21 and supporting an upper board 42 adhered to the lower board 41; and the camera 27 for imaging the lower table 21 and the board carrying table 23 from a direction nearly perpendicular to the lower table 21 and the board carrying table 23, the lower table 21 has reticule marks 32a to 32d whereby the camera 27 detects a calibration amount of a camera coordinate system with respect to a reference coordinate system corresponding to the lower table 21, and the board carrying table 23 has reticule marks 31a to 31d whereby the camera 27 detects a calibration amount of a coordinate system of a fine alignment drive mechanism 22 with respect to the camera coordinate system.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2002314249A METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE 失效
公开(公告)号：JP2002314249A
公开(公告)日：2002-10-25
申请号：JP2001112476
申请日：2001-04-11
申请人： MITSUBISHI ELECTRIC CORP , IBIDEN CO LTD
发明人： SASAMORI SATOSHI , MIZUNO MASANORI , ITO TADASHI , KASUGA YOSHIO , OKAMURA MASAMITSU , YAMAMOTO KAZUYUKI , ENOMOTO AKIRA , KARIYA TAKASHI
IPC分类号： G06T1/00 , G06T7/60 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a method for manufacturing a multilayer substrate in which positioning can be performed easily with high precision by use of visual lights. SOLUTION: Holes e1 to e4 which are drilled larger than first marks a1 to a4 are provided opposite to a sheet-like substrate P1 provided with the first marks a1 to a4. In a state that a sheet-like substrate P2 provided with second marks b1 to b4 away from the holes e1 to e4 at predetermined distances is positioned at the first marks a1 to a4, visual lights are applied to the first and second marks a1 to a4 and b1 to b4 from a light source 66, while the first and second marks a1 to a4 and b1 to b4 are imaged by a camera 66. After that, the first and second marks a1 to a4 and b1 to b4 are subjected to an imaging process based on the image pickup information by a calculation means to acquire positions of the first and second marks a1 to a4 and b1 to b4.

3. 发明专利

JP2002217552A METHOD AND DEVICE FOR MANUFACTURING OF MULTILAYER SUBSTRATE 失效
公开(公告)号：JP2002217552A
公开(公告)日：2002-08-02
申请号：JP2001014420
申请日：2001-01-23
申请人： MITSUBISHI ELECTRIC CORP , IBIDEN CO LTD
发明人： ITO TADASHI , MIZUNO MASANORI , SUGIMOTO AKIRA , KASUGA YOSHIO , YAMAMOTO KAZUYUKI , ENOMOTO AKIRA , KARIYA TAKASHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a manufacturing device of a multilayer substrate which readily enables highly precise positioning. SOLUTION: A first mark of a substrate P1 is obtained by a camera 32 and a position of a first mark is obtained by image processing, and rough positioning is carried out by moving a suction plate 23, so that the position is at the predetermined position. Then, the substrate P1 is made free of the suction plate 23, and the substrate P1 is sucked to a suction plate 84 and moved to be disposed opposite to a suction plate 72. Then, the substrate P1 of the suction plate 84 is made free, and the substrate P1 is sucked by means of the suction plate 72. Thereafter, a first mark is imaged by a camera 62 and is subjected to image processing. After a positioned is obtained and stored in a storage part, rough positioning is carried out as mentioned above, by using the substrate P2 having a second mark. Then, a second mark is imaged by the camera 62 and is subjected to image processing, a positioned is obtained, and precise positioning of the substrate P1 is carried out by moving the suction plate 72, so that a second mark coincides with a position stored in a storage part.

4. 发明专利

JP2003092474A CALIBRATION METHOD FOR ALIGNING APPARATUS 审中-公开
公开(公告)号：JP2003092474A
公开(公告)日：2003-03-28
申请号：JP2001284097
申请日：2001-09-18
申请人： MITSUBISHI ELECTRIC CORP , IBIDEN CO LTD
发明人： SASAMORI SATOSHI , ITO TADASHI , SUGIMOTO AKIRA , MIZUNO MASANORI , ENOMOTO AKIRA , KARIYA TAKASHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a calibration method for an aligning apparatus which is capable of executing calibration easily and at a low cost. SOLUTION: In the calibration method for an aligning apparatus consisting of an upper table 5 having first reference marks, a lower table 6 having second reference marks, a plurality of upper cameras capable of photographing the tables 5 and 6, and lower cameras 13 capable of photographing the table 6, the following steps are successively executed: a first calibration step of calculating a calibration amount of a first photographing coordinate for a refence coordinate on the basis of photographing results of the first reference marks by the cameras 12, a second calibration step of calculating a calibration amount of a second photographing coordinate for the first photographing coordinate on the basis of photographing results of the second reference marks by the cameras 12 and 13, and a third calibration step of calculating a calibration amount of the second photographing coordinate for the second photographing coordinate on the basis of the photographing results of the second reference marks by the cameras 13.

5. 发明专利

JP2014127634A Method of manufacturing wiring board 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：JP2014127634A
公开(公告)日：2014-07-07
申请号：JP2012284690
申请日：2012-12-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： CHIN TOSHIMASU , KARIYA TAKASHI
IPC分类号： H05K3/46 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which can inspect a conductor pattern of a wiring board in a state in which the wiring board is supported by a support plate.SOLUTION: A wiring board 20 includes a test wiring pad 36 which is connected to a connection pattern 34 connected to a pad 60P arranged below an interlayer resin insulation layer 50 of the outermost layer on the second surface side of the wiring board 20. Because a test wiring pad 158T connected to the pad 60P is provided on an interlayer resin insulation layer 150 of the outermost layer on the exposed first surface side, the inspection of the conductor pattern can be performed in a state in which the wiring board 20 is supported by a support plate 30 which cannot bring an inspection probe into contact with the pad 60P for external connection of the wiring board.
摘要翻译：要解决的问题：提供一种制造布线板的方法，该布线板可以在布线板由支撑板支撑的状态下检查布线板的导体图案。解决方案：布线板20包括测试布线垫 36连接到连接到布线板20的第二表面侧上的最外层的层间树脂绝缘层50下方的焊盘60P的连接图案34.因为连接到焊盘60P的测试布线焊盘158T 在暴露的第一表面侧的最外层的层间树脂绝缘层150上，导体图案的检查可以在布线板20由不能使检查探针进入的支撑板30支撑的状态下进行与焊盘60P接触，用于布线板的外部连接。

6. 发明专利

JP2012186440A Inductor component, printed circuit board incorporating the component, and manufacturing method of the inductor component 审中-公开
标题翻译：电感元器件，印制电路板组件，以及电感元器件的制造方法
公开(公告)号：JP2012186440A
公开(公告)日：2012-09-27
申请号：JP2011239304
申请日：2011-10-31
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , KATO SHINOBU , KARIYA TAKASHI
IPC分类号： H05K3/46
CPC分类号： H05K3/4602 , H01F17/0033 , H01F2017/004 , H01L2224/16227 , H01L2924/15311 , H05K1/185 , H05K3/0032 , H05K2201/1003 , H05K2203/1469 , H05K2203/1572 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating an inductor component.SOLUTION: An inductor component is formed by alternately laminating coil layers and resin insulation layers. The inductor component is incorporated in a core substrate of the printed wiring board.
摘要翻译：要解决的问题：提供一种包含电感器部件的印刷线路板。解决方案：通过交替层叠线圈层和树脂绝缘层形成电感器部件。电感器部件结合在印刷线路板的芯基板中。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2010157690A Board for mounting electronic component thereon, and method of manufacturing the same 审中-公开
标题翻译：用于安装电子元件的板及其制造方法
公开(公告)号：JP2010157690A
公开(公告)日：2010-07-15
申请号：JP2009261724
申请日：2009-11-17
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： KARIYA TAKASHI , KOMATSU DAIKI
IPC分类号： H01L23/12 , H01L23/32 , H05K3/46
CPC分类号： H05K1/162 , H01L21/486 , H01L23/145 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/108 , H05K3/4682 , H05K3/4688 , H05K2201/0175 , H05K2201/0179 , H05K2201/09436 , H05K2201/09509 , H05K2201/09527 , H05K2201/096 , Y10T29/4916 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a board for mounting an electronic component thereon which is high in mounting reliability. SOLUTION: This board for mounting an electronic component includes: an organic insulation layer 30 formed on a first surface of a support layer 40; first conductor circuits 31 formed on a second surface in contact with the first surface of the support layer 40 within surfaces of the organic insulation layer 30, or in the inside on the second surface side of the organic insulation layer 30; an inorganic insulation layer 20 formed on the first surface located on the side opposite to the second surface in the organic insulation layer 30; second conductor circuits 21 formed in the inorganic insulation layer 20; pads 22 for mounting the electronic component thereon; via conductors 32 formed inside the organic insulation layer 30 for electrically connecting the second conductor circuits 21 to the first conductor circuits 31; a conductor formed on the second surface side located on the side opposite to the first surface in the support layer 40; and conductor posts 41 formed in the support layer 40 for electrically connecting the first conductor circuits 31 to the conductor. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在其上安装高安装可靠性的电子部件的板。解决方案：用于安装电子部件的该板包括：形成在支撑层40的第一表面上的有机绝缘层30; 第一导体电路31形成在与有机绝缘层30的表面内的支撑层40的第一表面或有机绝缘层30的第二表面侧的内侧接触的第二表面上; 形成在位于有机绝缘层30中与第二表面相对的一侧的第一表面上的无机绝缘层20; 形成在无机绝缘层20中的第二导体电路21; 垫22，用于在其上安装电子部件; 形成在有机绝缘层30内部的通孔导体32，用于将第二导体电路21电连接到第一导体电路31; 形成在位于支撑层40中的与第一表面相对的一侧的第二表面侧上的导体; 以及形成在支撑层40中的导体柱41，用于将第一导体电路31电连接到导体。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009188401A Printed circuit board with built-in capacitor 审中-公开
标题翻译：具有内置电容器的印刷电路板
公开(公告)号：JP2009188401A
公开(公告)日：2009-08-20
申请号：JP2009015019
申请日：2009-01-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YAMASHITA TAKASHIGE , TSUCHIYA YOSHITAKE , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01G4/38 , H05K1/16
CPC分类号： H05K1/162 , H05K3/0044 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09763 , H05K2201/09845 , H05K2203/025 , H05K2203/1476
摘要： PROBLEM TO BE SOLVED: To provide a novel printed circuit board with built-in capacitor capable of solving several problems about the conventional printed circuit boards with built-in capacitor. SOLUTION: In the printed circuit board with built-in capacitor, the capacitor has a dielectric, one electrode with a relatively smaller area in comparison with that of the dielectric, and another electrode with the relatively larger area in comparison with that of the dielectric. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有内置电容器的新型印刷电路板，其能够解决有关具有内置电容器的常规印刷电路板的若干问题。
解决方案：在具有内置电容器的印刷电路板中，电容器具有电介质，一个电极与电介质相比具有相对较小的面积，另一个电极的面积相对较大电介质。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2007201508A Multilayer printed wiring board 审中-公开
标题翻译：多层印刷接线板
公开(公告)号：JP2007201508A
公开(公告)日：2007-08-09
申请号：JP2007121218
申请日：2007-05-01
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： ASAI MOTOO , KARIYA TAKASHI , SHIMADA KENICHI , SEGAWA HIROSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which electric connection with an inner layer circuit in a core substrate can sufficiently be secured through a through-hole, even if the core substrate is made into multiple layers, and which is advantageous to high density of the through hole. SOLUTION: In the multilayer printed wiring board, a built-up wiring layer is formed where an interlayer resin insulating layer and a conductor layer are alternately laminated on the multilayer core substrate having a conductor layer in an inner layer, and the conductor layers are connected in a via hole. A plurality of the conductor layers formed on the multilayer core substrate by an etching processing in a state where a nonelectrolytic plating film and an electrolytic plating film are given, are installed. The through-hole is formed in the multilayer core substrate. The through-hole is filled with a fill, and an exposure face of the fill from the through-hole is covered with a part of a plurality of the conductor layers. The via hole is connected to the conductor layer covering the exposure face. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使将芯基板制成多层，也可以通过贯通孔提供与核心基板中的内层电路的电连接能够充分固定的多层印刷电路板，以及这对于通孔的高密度是有利的。解决方案：在多层印刷线路板中，形成叠层布线层，其中层间树脂绝缘层和导体层交替层叠在具有内层中的导体层的多层芯基板上，导体层连接在通孔中。通过在非电解电镀膜和电解电镀膜的状态下通过蚀刻处理在多层芯基板上形成的多个导体层被安装。通孔形成在多层芯基板中。通孔填充有填充物，并且来自通孔的填充物的曝光面被多个导体层的一部分覆盖。通孔连接到覆盖曝光面的导体层。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2004265956A Multilayer printed wiring board 有权
公开(公告)号：JP2004265956A
公开(公告)日：2004-09-24
申请号：JP2003049253
申请日：2003-02-26
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： KARIYA TAKASHI , TSUDA AKIYOSHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2924/01005 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which wiring density can be increased in wire bonding. SOLUTION: A bonding pad 36p is connected directly with a via hole 18 not through a via hole land. Since a via hole land having a diameter larger than the line width of the bonding pad is not used, wiring density can be increased. COPYRIGHT: (C)2004,JPO&NCIPI

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