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1. 发明专利

JPH06163759A SEMICONDUCTOR-ELEMENT MOUNTED DEVICE 失效
公开(公告)号：JPH06163759A
公开(公告)日：1994-06-10
申请号：JP31469492
申请日：1992-11-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： SHIMA MUTSUHIRO , OONAWA TOSHIO , MIFUKU HIDEFUMI , TAKADA MITSUYUKI
IPC分类号： H01L23/34
摘要： PURPOSE:To obtain a semiconductor-element mounted device wherein a signal can be input to, and output from, a semiconductor element accurately and at high speed by a method wherein the distance between a lead and a cooling member is adjusted and their mutual electromagnetic coupling is made proper. CONSTITUTION:A cooling member 10 is installed so as to be close to electric connection leads 4, it is connected to a node whose potential is stable, e.g. to a grounding layer, and the distance between the cooling member 10 and the leads 4 is adjusted so as to be a value corresponding to, e.g. the diameter of each lead 4. Their mutual electromagnetic coupling is set to be nearly the same degree as the electromagnetic coupling between the leads 4 and a circuit board 5, a reflecting noise due to the mismatching of a characteristic impedance between the leads 4 and the circuit board 5 is reduced, a surface area can be made large as compared with a cooling member in conventional cases, and the cooling effect of a semiconductor element 1 is enhanced. Consequently, the electromagnetic coupling between circuit boards can be reduced, and, as a result, a signal can be input to, and output from, the semiconductor element.

2. 发明专利

JPH0596388A LASER BEAM MACHINE 失效
公开(公告)号：JPH0596388A
公开(公告)日：1993-04-20
申请号：JP25806491
申请日：1991-10-04
申请人： MITSUBISHI ELECTRIC CORP
发明人： OONAWA TOSHIO , MIFUKU HIDEFUMI , TAKADA MITSUYUKI
IPC分类号： B23K26/00 , B23K26/03 , H01S3/00 , H01S3/101
摘要： PURPOSE:To provide the laser beam machine of the simple composition, the inexpensive price and the high a precision for the material to be machined of multi layers structure. CONSTITUTION:A laser oscillator 1A emitting a main pulse laser beam, a light beam dividing unit 11 which divides the main pulse laser beam to a 1st pulse laser beam and a 2nd pulse laser beam, a light beam by-path route 15 which is supplied with the 2nd pulse laser beam and delays the 2nd pulse laser beam against the 1st pulse laser beam, and measuring means 3, 9, 16 which measures the strength of the 2nd pulse laser beam reflected from the material to be machined 4 which is irradiated with the 2nd pulse laser beam after being irradiated with the 1st pulse laser beam are provided.

3. 发明专利

JPH0437188A WIRING STRUCTURE 失效
公开(公告)号：JPH0437188A
公开(公告)日：1992-02-07
申请号：JP14499890
申请日：1990-06-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： MIYAKE KURUMI , MIFUKU HIDEFUMI , TAKADA MITSUYUKI , MORIHIRO YOSHIYUKI
IPC分类号： C23C18/28 , C23C18/52 , C23C18/54 , H05K1/09 , H05K1/16 , H05K3/18
摘要： PURPOSE:To prevent the surface of porous glass from being modified by forming an insert layer separated from specific electroless plating between the porous glass and an electric conductor. CONSTITUTION:There are formed on a board 1 a thick film resistor 5, porous glass 2 having a mesh structure, and a resist layer 6. Thereafter, the board is immersed in a pH9.5 or below electroless plating solution, e.g. a neutral or acidic electroless Ni plating solution to form an insert layer 3 on the porous glass 2. Thereafter, it is immersed in a pH12-13 electroless plating solution to form an electric conductor 4 mainly comprising copper.

4. 发明专利

JPH0256987A MOUNTING METHOD OF HYBRID INTEGRATED CIRCUIT 失效
公开(公告)号：JPH0256987A
公开(公告)日：1990-02-26
申请号：JP30284888
申请日：1988-11-29
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TAKASAGO HAYATO , MORIHIRO YOSHIYUKI
IPC分类号： H05K13/04 , H01L21/98 , H05K1/03 , H05K3/00 , H05K3/46
摘要： PURPOSE:To simplify and automate a part mounting process by dividing a substrate at every circuit pattern, respectively mounting parts, cutting a film and separating hybrid integrated circuits. CONSTITUTION:A plurality of hydbrid integrated circuit patterns are formed onto an alumina ceramic substrate 1, and trenches 2 are shaped to the boundaries of these patterns. Varnish 4 is applied onto a polyimide film 3, the alumina ceramic substrate 1 is placed onto the film 3, varnish 4 is heated and cured, and the film 3 and the substrate 1 are bonded. Pressure is applied from the polyimide film 3 side, broken-out surfaces 5 are made to reach up to the rear of the substrate, the film 3 is divided into separate hybrid integrated circuit substrate without being cut, and parts 6 are loaded onto each of the substrates, and heated and joined. The polyimide film 3 and a polyimide resin 10 are cut through the irradiation of a CO2 laser, thus acquiring separate hydbrid integrated circuit 11. Accordingly, a part mounting process is simplified.

5. 发明专利

JPH01257380A JOSEPHSON DEVICE 失效
公开(公告)号：JPH01257380A
公开(公告)日：1989-10-13
申请号：JP8657088
申请日：1988-04-07
申请人： MITSUBISHI ELECTRIC CORP
发明人： MIFUKU HIDEFUMI , TAKADA MITSUYUKI , TAKASAGO HAYATO
IPC分类号： H01L39/24
摘要： PURPOSE:To obtain a Josephson device which has stable superconducting characteristics with a simple process by a method wherein a high energy beam is applied to a part of a compound superconductor to form a weak coupling. CONSTITUTION:An Nd:YAG laser beam transverselly scans the film 3 to form a part 5 which is converted from a superconducting part into a normal conducting part and a part 6 which remains as a superconducting part. The part 6 which maintains superconducting characteristics provides a weak coupling between the superconductors of both the sides of it and the device functions as a Josephson device which exhibits a Josephson effect. With this constitution, the Josephson device which has the required superconducting characteristics can be obtained with a simple process.

6. 发明专利

JPS6235553A MANUFACTURE OF SEMICONDUCTOR PLACING DEVICE 失效
公开(公告)号：JPS6235553A
公开(公告)日：1987-02-16
申请号：JP17446385
申请日：1985-08-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TAKASAGO HAYATO , YOSHIOKA TAKESHI , ONISHI YOICHIRO
IPC分类号： H01L27/01 , H05K3/46
摘要： PURPOSE:To reduce a mounting area and increase its density by forming a thick film resistor on a ceramic substrate of simultaneous baking type. CONSTITUTION:A conductor paste is printed on alumina green sheet of unbaked ceramic material, laminated, pressed to be formed in multilayers, and baked to obtain a multilayer alumina ceramic material 1 formed with the first conduc tor wiring pattern 20. Then, after an electroless nickel plating 21 and an electroless gold-plating 22 are formed on the pattern 20, silver-palladium thick film conductor paste is printed, and baked to obtain a silver-palladium thick film conductor 30. Then, ruthenium oxide thick film resistance paste is printed and baked at the position not contacted with the conductor 30 on the material 1 to obtain a thick film resistor 3. Subsequently, a paste which mainly contains palladium metal particles and glass powder is so printed and baked as to be superposed on the end of the resistor 3 and the periphery of the conductor 30 to obtain an activated layer 50 for electroless plating.

7. 发明专利

JPS61194794A MANUFACTURE OF HYBRID INTEGRATED CIRCUIT BOARD 失效
公开(公告)号：JPS61194794A
公开(公告)日：1986-08-29
申请号：JP3478985
申请日：1985-02-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TSUKAO RYUSAKU , TAKASAGO HAYATO
IPC分类号： H01L21/48 , H01L21/70 , H01L27/01 , H05K1/16 , H05K3/18

8. 发明专利

JPS6059764A MANUFACTURE OF HYBRID INTEGRATED CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS6059764A
公开(公告)日：1985-04-06
申请号：JP16970283
申请日：1983-09-13
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , MORIHIRO YOSHIYUKI , TAKASAGO HAYATO
IPC分类号： H01C17/06 , H01L27/01 , H05K1/16
摘要： PURPOSE:To eliminate the loss of the original characteristics of a cermet resistor by forming an activating tank for precipitating an electroless plating on an insulating heat resistant substrate, and forming a conductor layer at least by electroless plating on the tank. CONSTITUTION:Activated paste is printed and backed on an alumina ceramic substrate 1 to form an activated layer 2. Then, the substrate 1 is dipped in an electroless nickel plating bath, the first conductor layer 3 made of a nickel plating layer is formed only on the layer 2, and a gold plating layer 4 is formed by electroless plating or electric plating thereon. Subsequently, a resistor paste of oxidized luthenium is printed and backed in contact with the layers 3, 4 on the prescribed portion on the substrate 1 to form a cermet resistor 5. Since the layer 4 is formed on the layer 3, an oxidation can be prevented, the flowing resistances of the layers 3, 4 do not rise, and the solderability is not deteriorated, and a preferable ohmic contact can be also obtained between the layers 3, 4 and the resistor 5.

9. 发明专利

JPH0582930A METAL-BASE BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH0582930A
公开(公告)日：1993-04-02
申请号：JP24084391
申请日：1991-09-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： TANAKA TOKUJI , MORI MITSUMASA , TAKADA MITSUYUKI , MORIHIRO YOSHIYUKI
IPC分类号： H05K1/05 , H05K1/11 , H05K3/40 , H05K3/46
摘要： PURPOSE:To obtain a metal-base board which can form conductors with high density freely without undergoing restriction of throughholes. CONSTITUTION:A metal base layer 20 consists of a metal layer 1 and connection lands 2, which are electrically independent of each other. Both faces of the metal base layer 20 are provided with conductor layers 4 and an insulating layer 3, and the conductor layers 4 are electrically connected via connection lands 2.

10. 发明专利

JPH03208393A WIRING BOARD 失效
公开(公告)号：JPH03208393A
公开(公告)日：1991-09-11
申请号：JP287990
申请日：1990-01-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： MIFUKU HIDEFUMI , MORI MITSUMASA , MIYAKE KURUMI , TAKADA MITSUYUKI , MORIHIRO YOSHIYUKI
IPC分类号： H05K3/28 , H01B3/30 , H05K3/38
摘要： PURPOSE:To inhibit the reaction of copper to an organic matter, such as a polyimide or the like, and to contrive the improvement of the long-term reliability of a wiring board by a method wherein a specific insulator consisting of the organic matter is laminated on a specific electric conductor containing the copper as its main component. CONSTITUTION:An insulator 3, which consists of an organic matter containing at least one kind chosen from among copper, titanium, nickel, palladium and chrome by 5ppm or more in gross weight, is laminated on an electric conductor 2, which contains copper as its main component and contains at least one kind chosen from out of carbon and sulfur by 0.01% or more in gross weight. As the organic matter constituting the insulator 3, one having a low dielectric constant and having a high heat resistance is preferably and a polyimide or the like is included as an example of the organic matter. In such a way, at least one kind chosen from out of carbon and sulfur is contained in the conductor 2 containing copper as its main component. Accordingly, the reaction of the organic matter to the copper in a high-temperature process or the like is inhibited and the reliability of a wiring board can be improved.

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