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1. 发明专利

JPH06283863A MANUFACTURE OF MULTILAYER CIRCUIT BOARD 失效
公开(公告)号：JPH06283863A
公开(公告)日：1994-10-07
申请号：JP7155193
申请日：1993-03-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： HAMAGUCHI TSUNEO , TANAKA TOKUJI , OBARA MASANOBU , TSUKAO RYUSAKU
IPC分类号： H05K3/46
摘要： PURPOSE:To simplify steps and to mount at a high density by continuously conducting the steps of burying a viahole and forming an upper layer conductor on an insulator by electro-plating. CONSTITUTION:The method for manufacturing a multilayer circuit board comprises the steps of forming a lower layer conductor 2 on a base board 1, forming an insulator 3 on the conductor 2, forming a metal film 9 on a surface of the insulator 3, patterning a resist, and opening a viahole 6 by etching. Further, the method comprises the steps of patterning the resist 10, burying a conductor in the viahole 6 by electrically plating with the layer 2 as an electrode, and depositing an upper layer conductor 5 on the film 9.

2. 发明专利

JPS62150899A FORMATION OF INSULATING LAYER OF CIRCUIT BOARD 失效
公开(公告)号：JPS62150899A
公开(公告)日：1987-07-04
申请号：JP29413285
申请日：1985-12-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： ENDO ATSUSHI , TSUKAO RYUSAKU , TAKASAGO HAYATO
IPC分类号： H05K3/28

3. 发明专利

JPS61194794A MANUFACTURE OF HYBRID INTEGRATED CIRCUIT BOARD 失效
公开(公告)号：JPS61194794A
公开(公告)日：1986-08-29
申请号：JP3478985
申请日：1985-02-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TSUKAO RYUSAKU , TAKASAGO HAYATO
IPC分类号： H01L21/48 , H01L21/70 , H01L27/01 , H05K1/16 , H05K3/18

4. 发明专利

JPH10145045A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH10145045A
公开(公告)日：1998-05-29
申请号：JP29650396
申请日：1996-11-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： MURAI JUNICHI , FUJITA MINORU , TANAKA TOKUJI , TSUKAO RYUSAKU
IPC分类号： H05K3/38 , H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent undercuts by forming a second insulation layer contacted to second conductor circuits on a first insulation layer contacted to first conductor circuits so that the photosetting depth of the first insulation layer is greater than that of the second one and roughening rate of the second insulation layer is higher than that of the first one. SOLUTION: On the top surface of an inner layer printed wiring board 6 inner layer circuit conductors 7a of first conductor circuits and hardened dry film resist 8b to be a first insulation layer are formed. On the resist 8b a photosensitive insulative resin 11 is applied as a second insulation layer and hardened to form an insulation resin 11a. Vias 13 composed of vias 10, 12 are formed, a conductor layer 14 is formed as a second conductor circuit. The resins are selected so that the photostatting depth of the dry film resist 8b is greater than that of insulative resin 11 and roughening rate of the resin 11 is higher than that of the resist 8b.

5. 发明专利

JPH0367355B2 失效
公开(公告)号：JPH0367355B2
公开(公告)日：1991-10-22
申请号：JP9349784
申请日：1984-05-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： ENDO ATSUSHI , TSUKAO RYUSAKU , TAKASAGO HAYATO
IPC分类号： H05K3/28

6. 发明专利

JPH031822B2 失效
公开(公告)号：JPH031822B2
公开(公告)日：1991-01-11
申请号：JP23476784
申请日：1984-11-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： MAEJIMA TARO , ENDO ATSUSHI , HIROSE ETSUKO , TABUCHI TAKESHI , TSUKAO RYUSAKU
IPC分类号： H01L21/027 , G03F7/20 , G03F7/26 , H01L21/30 , H01L21/3205

7. 发明专利

JPS61111533A Pattern formation for photosensitive resin 失效
标题翻译：光敏树脂图案形成
公开(公告)号：JPS61111533A
公开(公告)日：1986-05-29
申请号：JP23476784
申请日：1984-11-05
申请人： Mitsubishi Electric Corp
发明人： MAEJIMA TARO , ENDO ATSUSHI , HIROSE ETSUKO , TABUCHI TAKESHI , TSUKAO RYUSAKU
IPC分类号： H01L21/027 , G03F7/20 , G03F7/26 , H01L21/30 , H01L21/3205
CPC分类号： H01L21/30
摘要： PURPOSE:To obtain tapered patterns of photosensitive resin of little swelling at the pattern outline section by a method wherein the amount of photo irradiation to the outline section of a required pattern is made larger with distances from the boundary of the required pattern so as to vary the solubility of the outline section of the required pattern. CONSTITUTION:A photosensitive resin layer applied on a substrate by spin coating is irradiated with light in the required pattern. At this time, the first photo irradiation is carried out with a photo mask 3 at a proper position of the required pattern, the second photo irradiation with a photo mask 4 at a position slightly shifted to right, and the third photo irradiation with a photo mask 5 slightly shifted to left. Therefore, the amount of photo irradiation, forming the boundary of a pattern size (a), increases in the order of outline sections (b), (c) located farther from the boundary up to the maximum at a region (d).
摘要翻译：目的：通过一种方法获得在图案轮廓部分具有很小溶胀的感光性树脂的锥形图案，其中使所需图案的轮廓部分的光照射量随着所需图案的边界的距离变大，从而变化所需图案的轮廓部分的溶解度。构成：通过旋涂涂布在基板上的感光性树脂层用所需图案的光照射。此时，第一光照照射是在所需图案的正确位置处的光掩模3进行的，在轻微向右偏移的位置处的光掩模4进行第二次光照射，并且用照片进行第三次照射面具5轻微向左移动。因此，形成图案尺寸（a）的边界的光照射量按区域（d）的距离越远离边界的轮廓部分（b），（c）的顺序增加。

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