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1. 发明专利

JP2003045756A Solid electrolytic capacitor and manufacturing method therefor 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：JP2003045756A
公开(公告)日：2003-02-14
申请号：JP2001229189
申请日：2001-07-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWAHARA KAZUYA , TASEI MASATOSHI , YABUSHITA MASAHIRO , TAKE YUKIHIRO , TADANOBU KAZUO
IPC分类号： H01G9/08 , H01G9/00 , H01G9/004 , H01G9/012 , H01G9/04 , H01G9/26
摘要： PROBLEM TO BE SOLVED: To realize a solid-state electrolytic capacitor which realizes low price by facilitating assembly with a simple constitution and is superior in ESR characteristics and enables thinning, and to provide its manufacturing method by solving to problems of many constituents being large in number, complicated in assembling and cost increase.
SOLUTION: The capacitor is constituted of an anode comb terminal 3, connected to an anode part 1a of a capacitor element laminate 2 and a cathode comb terminal 4, which is disposed between laminations of the cathode part 1b and is provided with a connection part 4b by bending and raising, which connects each cathode part 1b integrally each in a side surface of a capacitor element 1. Thereby, it is possible to reduce the number of components using a simple constitution, improve assembly operability, greatly improve ESR characteristics by reducing the cathode lead-out distance, since the cathode is led out of a side surface of the cathode 1b of the capacitor element 1, and to realize thinning, since conductive adhesive is not interposed between laminations.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了实现通过简单的结构便于组装实现低价格的固态电解电容器，并且具有优异的ESR特性并能够减薄，并且通过解决许多成分大的问题来提供其制造方法数量，组装复杂和成本增加。解决方案：电容器由连接到电容器元件层压体2的阳极部分1a和阴极梳状端子4的阳极梳状端子3构成，阴极梳状端子4设置在阴极部分1b的叠层之间并且设置有连接部分4b 通过弯曲和提升，其将每个阴极部分1b整体地连接在电容器元件1的侧表面中。由此，可以使用简单的构造减少部件的数量，提高组装操作性，通过减少阴极引出距离，由于阴极从电容器元件1的阴极1b的侧表面引出，并且为了实现变薄，因为导电粘合剂不夹在叠片之间。

2. 发明专利

JPH07155852A DRAWING METHOD FOR HOOP MATERIAL 失效
公开(公告)号：JPH07155852A
公开(公告)日：1995-06-20
申请号：JP30400693
申请日：1993-12-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKANO SHINJI , KUBOKI YASUO , HINO SEIJI , TASEI MASATOSHI
IPC分类号： B21D22/20 , B30B13/00
摘要： PURPOSE:To enable the drawing of a hoop material, which is highly efficient in the use of material, by performing drawing for a desired shape in the center of a part enclosed with external and internal lance workings in four sides and thereby eliminating a bridge between pitches. CONSTITUTION:An external lance working A is performed on a continuously fed hoop material 10 in the direction perpendicular to the feeding direction at prescribed intervals; then, a pair of opposite internal lance workings B in the direction parallel to the feeding direction of the hoop material 10 are performed between the external lance working parts 1a which are worked at the prescribed intervals in the close proximity to the respective external lance working parts 1a; and internal lance working parts 2a are formed. In other words, the external lance working part 1a for which the external lance working A is performed in the initial process is used as the external lance working part 1a of the adjacent internal lance working in common; and therefore, a bridge is not generated between the working parts. Consequently, pitches between the respective working parts are reduced, loss is eliminated, and the efficiency in the use of materials is improved.

3. 发明专利

JPH06218767A RESIN MOLDING MOLD FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH06218767A
公开(公告)日：1994-08-09
申请号：JP1229293
申请日：1993-01-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIMURA TAKASHI , TONO HIROAKI , TASEI MASATOSHI , NAKADA TAKUMI
IPC分类号： B29C45/26 , B29L31/34
摘要： PURPOSE:To provide a resin molding mold for electronic components, capable of obtaining a product inexpensively, by a method wherein conventional troubles in the resin molding mold for obtaining electronic components, in which the necessity of a main runner, a sub runner and a gate as well as bad area productivity and bad yield of materials are included CONSTITUTION:The title mold is constituted so that molten resin is poured into a component molding section 15, formed so that a plurality of electronic component products sections are formed so as to be connected to each other, through a gate 14 to mold a continuous directly connected electronic components whereby a plurality of times of electronic components can be obtained by using the same main runner 12, sub runner 13 and gate 14 while area productivity as well as the yield of materials can be improved.

4. 发明专利

JPH0191414A MANUFACTURE OF FUSE-CONTAINING CHIP CAPACITOR 失效
公开(公告)号：JPH0191414A
公开(公告)日：1989-04-11
申请号：JP13520887
申请日：1987-05-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MASUDA YOJI , SHIMADA HIROSHI , OBA TAKESHI , TASEI MASATOSHI
IPC分类号： H01G9/012 , H01G9/00 , H01G9/12
摘要： PURPOSE:To improve the blown fuse capacities by a method wherein, after connecting a fuse member, a cathode of a capacitor element and a part of anode outer terminal are connected and then an anode lead of the capacitor element and the anode outer terminal are connected and later a part of anode outer terminal is isolated from the anode terminal to be formed. CONSTITUTION:A fuse member 7 is carried across between a part of a cathode terminal 9 and an anode outer terminal 8 to be welded through the intermediary of a paste type tin-lead alloy brazing material. Next, the cathode outer terminal 9 side is coated with specified amount of insulating welding agent 3 which is ultraviolet setting type for fixing a capacitor element 1 while the part 5 side of anode outer terminal 8 is coated with specified amount of conductive bonding agent 6 for connecting cathode using a dispenser. Successively, the capacitor element 1 provided with an insulating layer 2 is mounted on a part of cathode to be fixed by ultraviolet ray irradiation. Later, after finishing the welding of tantalum lead 4 and the setting of conductive bonding agent 6, the part 5 of anode outer terminal 8 is cut off and isolated from the anode outer terminal 8 to be coated with an exterior resin 10. Through these procedures, the dispersion of blown fuse capacities can be restrained from occurring.

5. 发明专利

JP2006190929A Solid electrolytic capacitor and its manufacturing method 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：JP2006190929A
公开(公告)日：2006-07-20
申请号：JP2005140918
申请日：2005-05-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TASEI MASATOSHI , YABUSHITA MASAHIRO , KAWAHITO KAZUO , KURANUKI KENJI
IPC分类号： H01G9/012 , H01G9/00 , H01G9/14
摘要： PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor in which low ESL can be attained by solving a matter that ESL characteristics are inferior because of a long lead-out distance from a capacitor element to a terminal thereby simplifying a structure, and to provide its manufacturing method.
SOLUTION: A capacitor element 1 is stacked and bonded to an anode frame 8 and a cathode frame 9 and then bonded to an anode terminal 10 and a cathode terminal 11 thus manufacturing a solid electrolytic capacitor coated with coating resin 12. Bonding faces 10a are formed at both ends of the anode terminal 10 of the solid electrolytic capacitor, a bonding face 11a is formed by raising the central portion of the cathode terminal 11 entirely, shielding portions 10b and 11b are provided to extend upward from an end where the cathode terminal 11 approaches the lower surfaces 15, 14 of the anode terminal 10 closely, and then the bonding faces 10a, 11a and the shielding portions 10b, 11b are coated with the coating resin 12. By such an arrangement, excellent ESR characteristics and ESL characteristics are attained, and reliability is enhanced by reducing moisture intruding through the coating resin 12.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种固体电解电容器，其通过解决由于从电容器元件到端子的长的引出距离而使ESL特性较差的物质可以获得低ESL，从而简化了结构，并提供其制造方法。解决方案：电容器元件1堆叠并结合到阳极框架8和阴极框架9上，然后结合到阳极端子10和阴极端子11，从而制造涂覆有涂层树脂12的固体电解电容器。接合面 10a形成在固体电解电容器的阳极端子10的两端，通过使阴极端子11的中心部分整体上升而形成接合面11a，遮蔽部分10b和11b从阴极端子11紧密接近阳极端子10的下表面15,14，然后用涂覆树脂12涂覆接合面10a，11a和屏蔽部分10b，11b。通过这种布置，优异的ESR特性和ESL 通过减少通过涂层树脂12侵入的水分来提高可靠性。版权所有：（C）2006，JPO＆NCIPI

6. 发明专利

JPH06244063A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH06244063A
公开(公告)日：1994-09-02
申请号：JP2506893
申请日：1993-02-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UENISHI KENJI , TASEI MASATOSHI , NISHIYAMA SUMIO , HASEGAWA NOBUO
IPC分类号： C23C18/16 , C23C18/18 , H01G2/10 , H01G4/224 , H01G9/00 , H01G9/004 , H01G9/08 , H01G13/00 , H01G9/05 , H01G9/24
摘要： PURPOSE:To provide an electronic component which is capable of smoothly automatic transportation even in automatic transportation using a parts feeder. CONSTITUTION:External electrode terminals 29a, 29b of an electronic component body 20 are formed into a hexagon, in which projections 33a, 33b are formed respectively on upper and lower tapered planes 32a, 32b of front and back surfaces of the electronic component body 20 between the external electrode terminals 29a, 29b, and these projections 33a, 33b are provided with a taper 34b respectively and their cross-sectional shape becomes wider toward a parting line between upper and lower dies composing a molding die from between the external electrode terminals 29a, 29b on the upper and lower surfaces and becomes the widest on that line. These crosssection are formed on a flat plane 36, which enables smoothly automatic transportation as a result.

7. 发明专利

JPH0684722A MANUFACTURE OF TAB TERMINAL FOR CAPACITOR 失效
公开(公告)号：JPH0684722A
公开(公告)日：1994-03-25
申请号：JP23554892
申请日：1992-09-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TASEI MASATOSHI , IWAKIRI TAKASHI
IPC分类号： H01G9/008 , H01G9/04 , H01G13/00
摘要： PURPOSE:To reduce the material loss of an aluminum member. CONSTITUTION:A pair of side face restricting members 16a and 16b are arranged on both sides of a round bar-like aluminum member 10 in a facing state at an interval which is slightly larger than the width of a pair of rolling roller 15a and 15b. By partially rolling the upper and lower surfaces of the member 10 with the rollers 15a and 15b in such a state, a flat section 13 is formed. Because of the members 16a and 16b, the lateral expansion of the member 10 can be controlled to the interval between the members 16a and 16b.

8. 发明专利

JPH0381097A POWDER MOLDING MACHINE 失效
公开(公告)号：JPH0381097A
公开(公告)日：1991-04-05
申请号：JP21643889
申请日：1989-08-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MAEDA MINORU , SUGIMOTO HIDEKI , TASEI MASATOSHI
IPC分类号： B30B11/00 , B22F3/02 , B22F3/035 , B28B3/02 , B29B9/08
摘要： PURPOSE:To fill a die with fine diameter powder by giving vertical vibration to a punch compacting powder with which the die is filled. CONSTITUTION:In a device wherein after the die 2 is filled with powder A, it is measured evenly by a feeder 4 and the powder is compacted by the fall of an upper punch 3 and the rise of a lower punch 1, fine vertical vibration is given by a driving shaft 11 to a cam mechanism composing the lower part of a lower punch shaft 9 of a cam 8 and a cam follower 7 in order to improve the accuracy of the fill of the evenly measured powder. Thus, the fill of the fine diameter powder is improved and variance in weight can be reduced among the molded pieces.

9. 发明专利

JP2007214168A Chip type solid electrolytic capacitor 审中-公开
标题翻译：芯片型固体电解电容器
公开(公告)号：JP2007214168A
公开(公告)日：2007-08-23
申请号：JP2006029367
申请日：2006-02-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KURANUKI KENJI , TASEI MASATOSHI , KONDO KATSUHIRO , KOBASHI MIKIO , YOSHINO TAKESHI
IPC分类号： H01G9/004 , H01G9/14 , H01G9/15
摘要： PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor to be used for various electronic equipment, which can realize low ESL by solving the problem that a long lead-out distance from a capacitor element to a terminal causes high ESL.
SOLUTION: The capacitor includes a capacitor element 1 in which a conductive polymer is used for a solid electrolyte, a positive terminal 9 and a negative terminal 10 each having a top surface connected to the capacitor element 1, and an insulative exterior resin 11 covering the capacitor element 1 while the bottom surfaces of the positive and negative terminals 9 and 10 are each exposed. Surface treatment having regularity is executed on junction surfaces between the terminals 9, 10 and the capacitor element 1 and its vicinity. With this configuration, the highly reliable chip type solid electrolytic capacitor excellent in solderbility and airtightness and having achieved low ESL can be provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于各种电子设备的芯片型固体电解电容器，其可以通过解决从电容器元件到端子的长的引出距离导致高ESL的问题而实现低ESL 。解决方案：电容器包括电容器元件1，其中导电聚合物用于固体电解质，正端子9和负极端子10，其各自具有连接到电容器元件1的顶表面，以及绝缘外部树脂覆盖电容器元件1，同时露出正极和负极端子9和10的底表面。在端子9,10和电容器元件1及其附近的接合面上执行具有规则性的表面处理。通过这样的结构，能够提供可靠性和气密性优异，成本低的ESL的高可靠性的芯片型固体电解电容器。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2000228339A MANUFACTURING METHOD OF SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING APPARATUS THEREOF 失效
公开(公告)号：JP2000228339A
公开(公告)日：2000-08-15
申请号：JP3095099
申请日：1999-02-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TASEI MASATOSHI , KURANUKI KENJI
IPC分类号： H01G9/00 , H01G9/012 , H01G9/15 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To manufacture a highly reliable product in a stable manner having high hermeticity. SOLUTION: In this manufacturing method, each bar 3 crossing a metallic lead frame 1, in a width direction is provided for every two elements between them. The metallic lead frame 1 formed into hoops connects the elements of a solid electrolytic capacitor. The elements are successively connected along the length of the frame. Sub runners 8 branching from main runners 7 are disposed on parts, where the bars 3 are not provided. With this arrangement, it is possible to obtain a solid electrolytic capacitor 10 having superior hermeticity, without applying excessive stress, when the runners 7 and 8 are separated from the metallic lead frame 1.

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