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1. 发明专利

JP2005303274A Flexible substrate, multilayer flexible substrate, and manufacturing method therefor 有权
标题翻译：柔性基板，多层柔性基板及其制造方法
公开(公告)号：JP2005303274A
公开(公告)日：2005-10-27
申请号：JP2005071297
申请日：2005-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMASHITA YOSHIHISA , FUJII TOSHIO , NAKATANI SEIICHI , ICHIYANAGI TAKASHI , TOMEKAWA SATORU , YABE HIROKI
IPC分类号： H05K1/16 , H05K1/02 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a high-density, thin flexible substrate that is excellent in terms of the flexing life. SOLUTION: A method of manufacturing a flexible substrate comprises: a process (a) of forming an insulating resin layer on the front face of a film and the rear face opposite to the front face, wherein each insulating resin layer is thicker than the film; a process (b) of forming a through hole in the film and the insulating resin layers; a process (c) of filling the through hole with a conductive resin composition; and a process (d) of embedding a wiring pattern into each of the insulating resin layers in such a manner that the wiring pattern is electrically connected to the conductive resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供在弯曲寿命方面优异的高密度，薄的柔性基材。解决方案：制造柔性基板的方法包括：在膜的正面和与正面相反的背面形成绝缘树脂层的方法（a），其中每个绝缘树脂层比这个电影; 在所述膜和所述绝缘树脂层中形成贯通孔的工序（b）用导电树脂组合物填充所述通孔的工序（c）; 以及以布线图案与导电性树脂组合物电连接的方式将布线图案嵌入到各绝缘树脂层中的工序（d）。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007324255A Resist film forming method and apparatus thereof 审中-公开
标题翻译：电阻膜形成方法及其装置
公开(公告)号：JP2007324255A
公开(公告)日：2007-12-13
申请号：JP2006150898
申请日：2006-05-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMASHITA YOSHIHISA , ICHIYANAGI TAKASHI , NAKATANI SEIICHI
IPC分类号： H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a resist film forming method for enabling fine wiring formation at a low cost and in a resource saving manner.
SOLUTION: A supporting substrate 11 is prepared having a photocatalyst film 12 formed thereon; part of the photocatalyst film is irradiated with light 14 to make the light irradiated region thereof hydrophilic, so that a hydrophilic region 15 of a predetermined pattern is formed on the surface of the photocatalyst film 12; and a resist is applied on the photocatalyst film 12, and the resist on a water-repellent region 15a is selectively gathered onto the hydrophilic region 15 to form a resist film 16 of the predetermined pattern. Further, the resist film 16 on the supporting substrate 11 is brought into intimate contact with a resist film transferred substrate 27, and the resist film 16 is transferred to the substrate 27 by removing the supporting substrate 11. The hydrophilic region 15 is restored to the water-repellent region, and the supporting substrate 11 is repetitively reused.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以低成本和资源节约的方式形成精细布线的抗蚀剂膜形成方法。
解决方案：制备其上形成有光催化膜12的支撑基板11; 用光14照射部分光催化剂膜，使光照射区域亲水，使得在光催化膜12的表面上形成有规定图案的亲水区域15，在光催化膜12上涂布抗蚀剂，将斥水区域15a上的抗蚀剂选择性地聚集到亲水区域15上，形成预定图案的抗蚀剂膜16。此外，支撑基板11上的抗蚀剂膜16与抗蚀膜转移基板27紧密接触，并且通过去除支撑基板11将抗蚀剂膜16转移到基板27.亲水区域15恢复到防水区域和支撑基板11重复使用。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007294746A Semiconductor package and manufacturing method therefor 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：JP2007294746A
公开(公告)日：2007-11-08
申请号：JP2006122320
申请日：2006-04-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ICHIYANAGI TAKASHI , YAMASHITA YOSHIHISA , NAKATANI SEIICHI
IPC分类号： H01L21/3205 , H01L23/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/24 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which realizes a compact and thin-type structure, allowing the wiring length to be possibly reduced between semiconductor elements, and to provide a method of manufacturing a semiconductor package, having a high packing efficiency of the semiconductor elements using a simple process.
SOLUTION: The semiconductor module includes a semiconductor device (101) having the front surface, i.e., a circuit forming surface (101A) of semiconductor elements (101), and electrical insulating layers (103a, 103b) on the backside. The semiconductor device (101) comprises wiring patterns (104a, 104b) on the element insulating layers (103a, 103b); via-holes (105) piercing the electrical insulating layer 103a at the semiconductor element surface side for electrically connecting electrode terminals (102) of the semiconductor elements (101), to the wiring pattern (104a) at the front surface; and through-holes (106) piercing the electric insulating layer (103b) at the semiconductor elements front surface and backside and the semiconductor elements (101), for electrically connecting the wiring pattern (104a, 104b) at the semiconductor elements front surface and backside.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供实现紧凑型和薄型结构的半导体封装，允许半导体元件之间的布线长度可能减小，并且提供具有高封装的半导体封装的制造方法使用简单的工艺的半导体元件的效率。解决方案：半导体模块包括具有前表面的半导体器件（101），即半导体元件（101）的电路形成表面（101A）和背面的电绝缘层（103a，103b）。半导体器件（101）包括元件绝缘层（103a，103b）上的布线图案（104a，104b）。在半导体元件表面侧刺穿电绝缘层103a以将半导体元件（101）的电极端子（102）电连接到前表面的布线图案（104a）的通孔（105）以及在半导体元件前表面和背面刺穿电绝缘层（103b）的通孔（106）和半导体元件（101），用于将半导体元件前表面和背面的布线图案（104a，104b）电连接。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2006121008A Semiconductor component mounted structure and manufacturing method thereof 审中-公开
标题翻译：半导体元件安装结构及其制造方法
公开(公告)号：JP2006121008A
公开(公告)日：2006-05-11
申请号：JP2004309968
申请日：2004-10-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KITAE TAKASHI , KARASHIMA YASUHARU , ICHIYANAGI TAKASHI , NAKATANI SEIICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/1624 , H01L2224/81191
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor component mounted structure which is easy to manufacture, adaptive to narrow pitches, and improved in insulation reliability and connection reliability, and to provide a manufacturing method thereof.
SOLUTION: The mounting method of electrically connecting a semiconductor (101) to a substrate is disclosed including an insulating layer (1201) and wiring patterns (501 and 502). The method comprises a step of forming metal projections (200) in nearly identical shapes on the semiconductor (101), positioning and mounting the semiconductor (101) on the substrate, applying pressure to crush the metal projections (200), connecting the metal projections (200) to a wiring pattern (501) formed on the top surface of the substrate, and connecting the metal projections (200) to a wiring pattern (502) formed on the reverse surface of the substrate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种容易制造的半导体元件安装结构，适应于窄间距，并提高绝缘可靠性和连接可靠性，并提供其制造方法。公开了一种将半导体（101）电连接到基板的安装方法，其包括绝缘层（1201）和布线图案（501和502）。该方法包括在半导体（101）上形成几乎相同形状的金属突起（200）的步骤，将半导体（101）定位并安装在基板上，施加压力以压碎金属突起（200），将金属突起（200）连接到形成在基板的顶表面上的布线图案（501），并且将金属突起（200）连接到形成在基板的背面上的布线图案（502）。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005051204A Module for mounting electrical component and method for manufacturing the same 审中-公开
标题翻译：用于安装电气部件的模块及其制造方法
公开(公告)号：JP2005051204A
公开(公告)日：2005-02-24
申请号：JP2004169680
申请日：2004-06-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ICHIYANAGI TAKASHI , NAKATANI SEIICHI , ASAHI TOSHIYUKI , KOMATSU SHINGO , HIRANO KOICHI
IPC分类号： H05K3/28 , H01L21/60 , H05K1/18 , H05K3/10 , H05K3/20 , H05K3/32 , H05K3/34
CPC分类号： H01L2924/181 , Y02P70/613 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To attain high precision mounting of an electronic part, to prevent short circuiting between wiring patterns, and to improve heat release performance. SOLUTION: A structure is provided wherein the surface mounting electrical part 104 having a terminal electrode 104a is mounted on an electrically insulating substrate 101. A recess 101a is provided on a surface of the substrate 101. The wiring pattern 102 to be connected to the electrical part 104 is provided at the recess 101a. The electrical part 104 is mounted on the substrate 101 with the terminal electrode 104a of the electrical part 104 being faced to the recess 101a and with a part mounting surface being entirely in contact with the surface of the substrate 101. Thus, the terminal electrode 104a is electrically connected to the wiring pattern 102. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了实现电子部件的高精度安装，防止布线图案之间的短路，并提高散热性能。解决方案：提供了一种结构，其中具有端子电极104a的表面安装电气部件104安装在电绝缘基板101上。凹部101a设置在基板101的表面上。要连接的布线图案102 在电气部件104上设置有凹部101a。电气部件104安装在基板101上，电气部件104的端子电极104a面对凹部101a，部件安装面完全与基板101的表面接触。因此，端子电极104a 电连接到布线图案102.版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2006156930A Flexible board having inter-layer junction, and manufacturing method therefor 审中-公开
标题翻译：具有层间结合的柔性板及其制造方法
公开(公告)号：JP2006156930A
公开(公告)日：2006-06-15
申请号：JP2005071306
申请日：2005-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMASHITA YOSHIHISA , YABE HIROKI , ICHIYANAGI TAKASHI , NAKATANI SEIICHI , TOMEKAWA SATORU , FUJII TOSHIO , KARASHIMA YASUHARU
IPC分类号： H05K3/40 , H01L23/12 , H05K3/10 , H05K3/20 , H05K3/22 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a flexible board the method of which does not include processes of through-hole formation and conductive paste filling. SOLUTION: The manufacturing method for the flexible board includes a step of (a) providing a sheet base material which has a film, insulating resin layers formed on the front surface of the film and the back surface opposite to the front surface, respectively, and wiring patterns embedded respectively in the insulating layers; and a step of (b) jointing a part of the wiring pattern in the front surface to a part of the wiring pattern in the back surface, by pushing a part of either of the wiring patterns in the front and back surfaces into the interior of the sheet base material. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种柔性板的制造方法，其方法不包括通孔形成和导电浆料填充的过程。解决方案：柔性板的制造方法包括以下步骤：（a）提供具有膜的片状基材，形成在膜的前表面上的绝缘树脂层和与前表面相对的后表面，分别嵌入绝缘层中的布线图案; 以及（b）将前表面中的布线图案的一部分连接到背面的布线图案的一部分的步骤，通过将前表面和后表面中的任一布线图案的一部分推入到片材基材。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006040870A Connection member and mount assembly, and production method of the same 审中-公开
标题翻译：连接构件和安装组件及其制造方法
公开(公告)号：JP2006040870A
公开(公告)日：2006-02-09
申请号：JP2005037978
申请日：2005-02-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ASAHI TOSHIYUKI , KARASHIMA YASUHARU , ICHIYANAGI TAKASHI , NAKATANI SEIICHI , NISHIYAMA TOSAKU , HIRANO KOICHI , SHIBATA OSAMU , NAKAYAMA TAKESHI , SAITO YOSHIYUKI
IPC分类号： H01R11/00 , H01L23/12 , H01L25/10 , H01L25/11 , H01L25/18 , H01R43/00 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/36 , H05K3/40
CPC分类号： H01L2224/73204 , H01L2224/81101
摘要： PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects these surfaces; and at least one wire 20 which extends from the upper surface to the lower surface through the side surface. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以在没有通孔形成步骤的情况下制造的连接构件。连接构件100包括：绝缘基板10，其具有上表面10a，与上表面10a相对的下表面10b和连接这些表面的侧表面10c; 以及至少一根导线20，其通过侧面从上表面延伸到下表面。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005234557A Optical transmission line substrate and its manufacturing method, substrate with built-in optical transmission line and its manufacturing method, and data processor 审中-公开
标题翻译：光传输线路基板及其制造方法，具有内置光传输线的基板及其制造方法和数据处理器
公开(公告)号：JP2005234557A
公开(公告)日：2005-09-02
申请号：JP2005014743
申请日：2005-01-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KARASHIMA YASUHARU , NAKATANI SEIICHI , SUGAYA YASUHIRO , ASAHI TOSHIYUKI , ICHIYANAGI TAKASHI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of optical transmission line substrate, with which the optical transmission line substrate can be manufactured at a simpler manufacturing process, or the substrate does not need an aligning process or it can be manufactured at a reduced aligning processes. SOLUTION: The method for manufacturing the optical transmission line substrate includes: a first step in which a layer including an electrically conductive material is formed on a substrate 40; and a second step in which a wiring pattern 15 is formed, at least a part of which is for an electrical circuit and a part of which is for positional control of the optical transmission line, by patterning the layer that is formed on the substrate 40 and that includes the electrically conductive material. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供光传输线路基板的制造方法，可以在更简单的制造工艺中制造光传输线基板，或者基板不需要对准工艺，或者可以在减少对齐过程。光传输线基板的制造方法包括：在基板40上形成有包含导电材料的层的第一工序; 以及第二步骤，其中形成布线图案15，其中至少一部分用于电路，并且其一部分用于光传输线路的位置控制，通过对形成在基板40上的层进行图案化并且其包括导电材料。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2008147328A Flexible board, and its manufacturing method 审中-公开
标题翻译：柔性板及其制造方法
公开(公告)号：JP2008147328A
公开(公告)日：2008-06-26
申请号：JP2006331532
申请日：2006-12-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ICHIYANAGI TAKASHI , NAKATANI SEIICHI , YAMASHITA YOSHIHISA , MASUDA SHINOBU
IPC分类号： H05K3/34 , H05K1/11 , H05K3/22 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a flexible board which allows lands of a wiring pattern and vias to be surely connected. SOLUTION: The flexible board 100 comprises a substrate 10 having a flexibility, the vias 20 for electrically connecting the top face 16 and bottom face 18 of the substrate 10, and the lands 30 formed on the vias 20. Each land 30 has a shape which is longer in the longitudinal direction (in the MD direction) of the substrate 10 than in the transverse direction (in the TD direction) of the substrate 10. On the top face and bottom face of the substrate, a resin layer is formed. Each land is embedded in the resin layers. The vias connected to the respective lands are paste vias which are filled with a conductive paste. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种允许布线图案和通孔的焊盘确实连接的柔性板。解决方案：柔性板100包括具有柔性的基板10，用于电连接基板10的顶面16和底面18的通孔20和形成在通孔20上的凸台30.每个凸台30具有在基板10的长度方向（MD方向）上比基板10的横向（TD方向）长的形状。在基板的上表面和底面，树脂层为形成。每片土地都嵌在树脂层中。连接到各个焊盘的通孔是填充有导电浆料的糊状过孔。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008103691A Magnetic substance striped array sheet, rfid magnetic sheet, electromagnetic shield sheet, and manufacturing methods for them 有权
标题翻译：磁性物质条纹片，RFID磁性片，电磁屏蔽片及其制造方法
公开(公告)号：JP2008103691A
公开(公告)日：2008-05-01
申请号：JP2007222952
申请日：2007-08-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAKATANI SEIICHI , YAMASHITA YOSHIHISA , ICHIYANAGI TAKASHI , HIRANO KOICHI
IPC分类号： H05K9/00 , B32B7/02 , G06K19/07 , G09F9/00 , H01Q1/52 , H01Q17/00
摘要： PROBLEM TO BE SOLVED: To provide a magnetic substance striped array sheet which has a needlelike magnetic substance excellently arrayed in a predetermined striped pattern, and also has high magnetic permeability and is thin and rich in flexibility. SOLUTION: A water-repellent layer 12 is formed on a resin film 11, and a striped pattern region 14 is formed which is disposed in a surface region of the water-repellent layer and has hydrophilicity relatively to the water repellence that the water-repellent layer has. The needle like magnetic substance 15 is aligned and gathered in the striped pattern region to form a magnetic substance striped pattern 13. A plurality of mutually separated magnetic substance stripes form the magnetic substance striped pattern, and a plurality of magnetic substance striped array sheets are laminated having magnetic substance stripes of respective layers orthogonally to each other to constitute an RFID magnetic sheet. Thus, the lattice-shaped magnetic substance striped pattern is formed to constitute an electromagnetic shield sheet. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有良好排列成预定条纹图案的针状磁性物质的磁性体条纹阵列片，并且还具有高磁导率并且薄且富有弹性。解决方案：在树脂膜11上形成防水层12，并且形成条纹图案区域14，该条纹图案区域14设置在防水层的表面区域中并且具有相对于防水性的亲水性，防水层有。针状磁性物质15在条纹图案区域中排列并收集，形成磁性体条纹图案13.多个相互分离的磁性物质条纹形成磁性条纹图案，并且多个磁性物质条纹阵列片层叠具有彼此正交的各个层的磁性物质条纹，以构成RFID磁性片。因此，格子状磁性体条纹图案形成为构成电磁屏蔽片。版权所有（C）2008，JPO＆INPIT

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