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1. 发明专利

JP2006086252A Resistance value measuring device of film resistor 审中-公开
标题翻译：电阻电阻值测量装置
公开(公告)号：JP2006086252A
公开(公告)日：2006-03-30
申请号：JP2004267925
申请日：2004-09-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IMANAKA SEIJI , TAKAHASHI MASAHARU
IPC分类号： H01C17/22 , G01R27/02
摘要： PROBLEM TO BE SOLVED: To provide a measuring device which is capable of measuring the resistance value of a film resistor accurately through a four-contact structure consisting of electrodes which serve as a tapered chuck which pinches an electrode contact probe equipped with a whirl stop mechanism and the electrodes while the resistance value of the film resistor is corrected. SOLUTION: The resistance value measuring device measuring the resistance value of the film resistor is composed of the chuck 1 which has a function of serving as a contact, pinching the film resistor 18; the electrode contact probe 3 electrically insulated from the chuck 1 with an insulating sleeve 2; a whirl stop holder 4 and a whirl stop block 5 which are both used to rotate the electrode contact probe 3 and the chuck 1, synchronizing them with each other; and an irregularly-pitched spring 6 which firmly fastens the whirl stop block 5 to an electrode pin 7, making the electrode contact probe 3 bear against the film resistor 18. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够通过由用作锥形卡盘的电极组成的四触点结构来精确地测量薄膜电阻器的电阻值的测量装置，该电容器夹着具有旋转停止机构和电极，同时修正膜电阻器的电阻值。＆lt; P＆gt;解决方案：测量薄膜电阻器的电阻值的电阻值测量装置由具有作为接触功能的卡盘1夹持薄膜电阻18组成; 电极接触探针3与卡盘1与绝缘套管2电绝缘; 用于旋转电极接触探针3和卡盘1的旋转止动支架4和旋转止动块5，使它们彼此同步; 以及将旋转止动块5牢固地固定到电极针7上的不规则偏心的弹簧6，使得电极接触探针3抵靠薄膜电阻器18.版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2003188058A METHOD FOR FORMING ELECTRODE OF ELECTRONIC PART 审中-公开
公开(公告)号：JP2003188058A
公开(公告)日：2003-07-04
申请号：JP2001385813
申请日：2001-12-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAHASHI MASAHARU , ANDO YOSHINORI , IMANAKA SEIJI , MINAFUJI HIROTADA , NAKAJIMA HIDEO
IPC分类号： H01G13/00 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method for forming an electrode of electronic part without a drop of the operability of equipment due to replacement because of the absence of wearing parts, which enables the formation of a plurality of terminal electrodes necessary for multiple electronic parts whose tops, bottoms, and front and rear surfaces can be formed with accuracy and high productivity. SOLUTION: The electrode is formed of a cylinder 6 which has a plurality of lines of projections 7 at prescribed intervals on its outer surface and a scrapping board 30 composed of a layer of two boards 3, 4 parallel to the shaft of the cylinder 6 having grooves 5 which are slightly wider than the projections 7, by making the projections 7 applied with a material for electrode 16 on the surface abut an top and bottom edges 19 and 21 of an element 1 pinched and held by arms 2 of a holder 17. Then the projections 7 are rotated to form electrodes 20 and 22 on top and bottom surfaces, respectively. Electrodes 23 on the side surface are made by making the projections abut on the side surface of the element in the same manner. COPYRIGHT: (C)2003,JPO

3. 发明专利

JP2002299109A METHOD OF MANUFACTURING ELECTRONIC CHIP COMPONENT 失效
公开(公告)号：JP2002299109A
公开(公告)日：2002-10-11
申请号：JP2001104111
申请日：2001-04-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMANAKA SEIJI , ANDO YOSHINORI , TAKAHASHI MASAHARU , MINAFUJI HIROTADA
IPC分类号： H01C17/06 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method by which electronic chip component that can be separated easily from each other at a room temperature after dicing, will not be contaminated by a fixing agent, and can be cut into pieces with high dimensional accuracy can be manufactured. SOLUTION: A ceramic substrate 1a slit in one direction and carrying electronic chip components is fixed to one surface of a fixing base 5 with a solvent vaporized type cellulose based fixing agent 6 and the chip parts are divided into individual chip components 7, by slitting the substrates 1a in the other direction. Thereafter, the individual chip components 7 are cut off from the substrates 1a by dissolving the fixing agent 6 with a degloss composed of a mixture prepared, by mixing an alcohol-based solvent and an ester-based solvent at a prescribed formulating ratio.

4. 发明专利

JP2006253275A Sputtering apparatus 审中-公开
标题翻译：溅射装置
公开(公告)号：JP2006253275A
公开(公告)日：2006-09-21
申请号：JP2005065255
申请日：2005-03-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SHIBUYA KIYOSHI , HIRATA SHINJI , NAKANO MITSUHIKO , IMANAKA SEIJI
IPC分类号： H01L21/31 , C23C14/34
摘要： PROBLEM TO BE SOLVED: To provide a sputtering apparatus provided with anti-deposition plates for particularly preventing deposition of an insulator or the like to the wall surface of a vacuum vessel for ensuring formation of the film of a desired composition without inclusion of a foreign matter, and maintaining productivity by preventing change in the condition of plasma by aging.
SOLUTION: The anti-deposition plates are formed of a metal material in duplication under the non-contact conditions. A DC negative potential is impressed to the external anti-deposition plate among the duplicated anti-deposition plates.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有防沉积板的溅射装置，用于特别防止绝缘体等沉积到真空容器的壁表面上，以确保形成所需组合物的膜而不包括异物，通过防止老化等离子体状态的变化来维持生产率。解决方案：在非接触条件下，抗沉积板由金属材料复制形成。在重复的抗沉积板中的外部抗沉积板上施加DC负电位。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JPH08119325A CARRIER BODY FOR CHIP PART 失效
公开(公告)号：JPH08119325A
公开(公告)日：1996-05-14
申请号：JP26357994
申请日：1994-10-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INOUE TORU , YAMADA KENJI , HARAZONO KOHEI , TSUMURA TAKESHI , IKEDA KIMIHIKO , IMANAKA SEIJI , YAMAMOTO MITSUNORI
IPC分类号： B65D73/02 , H05K13/02
摘要： PURPOSE: To provide a carrier body for a chip part which is inexpensive and has a high reliability, regarding a carrier body for a chip part which is used when chip parts are held and carried to respective manufacturing processes. CONSTITUTION: A carrier body for chip part is constituted by providing holding parts 2 being constituted of slits on a band-form base 1 with a specified interval. When a chip part 4 is inserted in the holding part 2, tongue pieces 2a pinch the side surfaces of the chip part 4, and the chip part 4 can be carried while being assuredly held.

6. 发明专利

JP2002198272A APPARATUS FOR FORMING PROTECTIVE FILM FOR SQUARE TIP COMPONENT 失效
公开(公告)号：JP2002198272A
公开(公告)日：2002-07-12
申请号：JP2000391942
申请日：2000-12-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMANAKA SEIJI , ANDO YOSHINORI , TAKAHASHI MASAHARU
IPC分类号： B05D1/28 , B05C1/02 , B05C9/14 , B05C13/02 , B05D3/00 , B05D7/00 , H01C17/02 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide an apparatus capable of forming many protective films at one time for square tip components at a low equipment cost and a low running cost. SOLUTION: The apparatus comprises conveyer pallets for feeding and holding a constitution body 11 for forming two or more electronic components at a feeder, an applicator composed of applying rollers 24, 22 which apply protective film pastes 15, 20 at specified thicknesses to their outer side walls and contact opposite two faces of the body 11 and other faces than the two faces to transfer the pastes 15, 20, a drying furnace for drying and hardening the pastes 15, 20 applied to the constitution bodies 11, 21 held with the pallets 12, an inverter for inverting the body 11 by 90 deg., and an ejector for ejecting the body having a formed protective film thereon.

7. 发明专利

JPH09298107A GROOVING DEVICE FOR FILM RESISTOR 失效
公开(公告)号：JPH09298107A
公开(公告)日：1997-11-18
申请号：JP11343796
申请日：1996-05-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMANAKA SEIJI , HARAZONO KOHEI , MINAFUJI HIROTADA , TAKAHASHI MASAHARU , SAIKAWA HIROYUKI
IPC分类号： H01C17/245
摘要： PROBLEM TO BE SOLVED: To perform a stable grooving work on in the width of a groove and the depth of the groove by a method wherein an arbitrary force is added to a cutter by a pressing mechanism using a solenoid and the like and an adjusting spring and an adjusting bolt for an arbitrary time from the time of start of a grooving in addition to the own weight of a cutter head part. SOLUTION: The solenoid and the like of a pressing mechanism 6, which applies a arbitrary force other than the own weight of a cutter head part 19 to a cutter 21, is energized to rotate clockwise a cutter arm 3 on a pivot 18 via a pressing point 15, an adjusting point 14 and an adjusting spring 7, that is, a prescribed force is added to the surface of the cylindrical part of a film resistor 20 and the cutter 21 is pressed to start a grooving. After that, the energization of the solenoid and the like of the mechanism 6 is stopped, the clockwise rotation of the arm 3 is released to reduce the forces, which are applied to the cutter, to only the own weight of the part 29 and a spiral groove is cut in a film on the surface of the cylindrical part 4 of the resistor 20. Thereby, the width of the groove and the depth of the groove can be stably subjected to grooving work.

8. 发明专利

JP2006336085A Sputtering system 审中-公开
标题翻译：喷射系统
公开(公告)号：JP2006336085A
公开(公告)日：2006-12-14
申请号：JP2005163928
申请日：2005-06-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IMANAKA SEIJI , NAKANO MITSUHIKO , HIRATA SHINJI
IPC分类号： C23C14/34 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a sputtering system capable of stabilizing crystal grains by repeating film deposition and annealing, and simultaneously depositing a plurality of films by a configuration having a turntable capable of setting a plurality of wafers. SOLUTION: The sputtering system comprises the turntable 3 capable of placing the plurality of wafers 5 inside a vacuum tank 1 composed of a vacuum chamber 6a and a vacuum base 6b, heaters 2 of the same number as that of the wafers 5 placed on the turntable 3, a plurality of targets 12, an inner deposition preventive plate 8 to surround the targets 12 on the circumference, and an outer deposition preventive plate 9 to surround its outer circumference. The film deposition by the sputtering and the anneal are repeated for each wafer 5 by turning the turntable 3 by the predetermined angle, and the plurality of wafers can be simultaneously treated. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过重复膜沉积和退火来稳定晶粒的溅射系统，并且通过具有能够设置多个晶片的转台的构造同时沉积多个膜。解决方案：溅射系统包括能够将多个晶片5放置在由真空室6a和真空基座6b构成的真空容器1内的转盘3，与设置的晶片5相同数量的加热器2 在转盘3上设置有多个靶12，围绕圆周的靶12的内部防沉积板8和围绕其外周的外部防止沉积板9。通过使转盘3转动预定角度，通过溅射和退火对每个晶片5重复进行膜沉积，并且可以同时处理多个晶片。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006321575A DEVICE AND METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开
公开(公告)号：JP2006321575A
公开(公告)日：2006-11-30
申请号：JP2005143779
申请日：2005-05-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKASE MICHIHIKO , IMANAKA SEIJI , WATANABE TOSHIYUKI
IPC分类号： B65G49/06 , G02F1/13 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a substrate conveying and holding device and a method therefor capable of reducing the deflection to generate stresses in an enlarged substrate, and preventing any breakage of the substrate by suppressing any change of a deflected state of the substrate, and reliably conveying and holding the substrate. SOLUTION: The substrate conveying and holding device comprises a conveying and holding means 3 to hold a rectangular and thin film-shaped substrate 1 and convey it to the predetermined position, and a substrate holding means 2 to hold the substrate 1. The substrate conveying and holding means 3 changes the substrate 1 in a predetermined deflected shape. The substrate holding means 2 has inner angular parts 21a, 21b, 21c, 21d to hold and fix four corner parts which are diagonally located on the substrate 1 to each other, and the diagonal distance of the inner angular parts 21a, 21b, 21c, 21d is set to be shorter than the diagonal length of the substrate 1. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2004014935A Correcting method of resistance value of metal plate resistor and apparatus therefor 有权
标题翻译：金属电阻器的电阻值校正方法及其设备
公开(公告)号：JP2004014935A
公开(公告)日：2004-01-15
申请号：JP2002168760
申请日：2002-06-10
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IMANAKA SEIJI , TAKAHASHI MASAHARU , MINAFUJI HIROTADA
IPC分类号： H01C17/22
摘要： PROBLEM TO BE SOLVED: To provide a resistance value correcting method for a metal plate resistor, which suppresses the generation of burrs in the correction of a resistance value, change of the resistance value due to heat generation or the like and permits inexpensive high speed/high accuracy correction of resistance value, and an apparatus therefor. SOLUTION: The correcting apparatus is constituted of a probe 11, abutted against an electrode 11 to measure the resistance value of a resistor consisting of a metal plate 12 and correct the value to an objective resistance value in the metal plate resistor arranged between the electrodes while employing the metal plate 12 as a resistance body, a disc type grinding stone 1 for working a groove on the metal plate 12, a driving motor 5 for turning the disc type grinding stone 1, another motor 6 for driving the rotation of a ball screw 9 to feed the grinding stone 1, and an instantaneous correcting and stopping mechanism, which releases the disc type grinding stone 1 from the metal plate 12 to stop the working of the groove and which is constituted of an attracting body 3 as well as an attracting plate 7, which are constituted of an electromagnet, a rotary supporting shaft 2, a spring 4 and the like. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种金属板电阻器的电阻值校正方法，其抑制电阻值校正中的毛刺的产生，由于发热等导致的电阻值的变化，并且允许廉价电阻值的高速/高精度校正及其装置。解决方案：校正装置由与电极11抵接的探针11构成，以测量由金属板12组成的电阻器的电阻值，并将该值修正为布置在金属板电阻器之间的金属板电阻器中的目标电阻值使用金属板12作为电阻体的电极，用于在金属板12上加工槽的盘式研磨石1，用于转动盘式磨石1的驱动电动机5，用于驱动盘式研磨石1的旋转的另一个电动机6 用于进给研磨石1的滚珠丝杠9和将金属板12上的盘式研磨石1从停止凹槽的工作并由吸引体3构成的瞬时校正停止机构作为由电磁体，旋转支撑轴2，弹簧4等构成的吸引板7。版权所有（C）2004，JPO

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