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1. 发明专利

JP2004179678A Method of manufacturing resistor 有权
标题翻译：制造电阻的方法
公开(公告)号：JP2004179678A
公开(公告)日：2004-06-24
申请号：JP2004044286
申请日：2004-02-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HASHIMOTO MASATO , MORIMOTO YOSHIRO , FUKUOKA AKIO , MINAFUJI HIROTADA , SAIKAWA HIROYUKI
IPC分类号： H01C17/06
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resistor, in which classification based on the dimension of a piece-like substrate becomes unnecessary and a conventional process of exchanging a mask according to the dimension rank of the piece-like substrate can be eliminated, and at the same time an inexpensive and minute resistor can be obtained easily. SOLUTION: A mask 28 is set on a back surface of a sheet-like insulating substrate 21 in the state that a plurality of slit-like first divided portions 27 are formed. In the state that the mask 28 is set, pairs of side surface electrode layers 30 are formed on the back surface of the insulating substrate 21 and the inner surface of a plurality of the slit-like first divided portions 27, by sputter technique. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种制造电阻器的方法，其中基于片状衬底的尺寸的分类是不必要的，并且传统的根据片状尺寸等级替换掩模的方法可以消除基板，同时可以容易地获得廉价的微小电阻器。解决方案：在形成多个狭缝状的第一分割部分27的状态下，将掩模28设置在片状绝缘基板21的背面上。在设置掩模28的状态下，通过溅射技术在绝缘基板21的背面和多个狭缝状的第一分割部分27的内表面上形成一对侧面电极层30。版权所有（C）2004，JPO

2. 发明专利

JP2004146859A Method of manufacturing resistor 审中-公开
公开(公告)号：JP2004146859A
公开(公告)日：2004-05-20
申请号：JP2004044289
申请日：2004-02-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HASHIMOTO MASATO , MORIMOTO YOSHIRO , FUKUOKA AKIO , MINAFUJI HIROTADA , SAIKAWA HIROYUKI
IPC分类号： H01C17/06
摘要： PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a singulated substrate can be eliminated, because the dimensional classification of the singulated substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured easily. SOLUTION: This method includes a step of forming a plurality of slit-like first split sections 28 in a sheet-like substrate 21 for dividing the substrate 21 into a plurality of strip-like substrates by separating a plurality of pairs of upper-surface electrode layers 22, and a step of forming side-face electrode layers 29 on the rear surface of the insulating substrate 21 in which the first split sections 28 are formed and the internal surfaces of the first split sections 28 by sputtering. This method also includes a step of patterning the side-face electrode layers 29 by peeling a resist layer 27 formed on the rear surface of the insulating substrate 21 from the substrate 21. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2004146857A Method of manufacturing resistor 有权
公开(公告)号：JP2004146857A
公开(公告)日：2004-05-20
申请号：JP2004044287
申请日：2004-02-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HASHIMOTO MASATO , MORIMOTO YOSHIRO , FUKUOKA AKIO , MINAFUJI HIROTADA , SAIKAWA HIROYUKI
IPC分类号： H01C17/06
摘要： PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a single-board substrate can be eliminated, because the dimensional classification of single-board substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured. SOLUTION: A metallic film 28 is formed on the whole rear surface of a sheet-like insulating substrate 21 in which a plurality of first slit-like split sections 27 is formed and, at the same time, a plurality of pairs of side-face electrode layers 29 is formed on the internal surfaces of the first slit-like split sections 27. Thereafter, a plurality of pairs of rear electrode layers are formed by removing the unnecessary portion of the metallic film 28 formed on the whole rear surface of the substrate 21 with a laser. COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2008091846A Lead wire for capacitor, its manufacturing method, and capacitor using lead wire 有权
标题翻译：用于电容器的引线，其制造方法和使用引线的电容器
公开(公告)号：JP2008091846A
公开(公告)日：2008-04-17
申请号：JP2006319852
申请日：2006-11-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMANE JUNJI , KURIMOTO HIROSHI , HARAZONO KOHEI , HASU MICHIO , SAITO TAKANAO , SAIKAWA HIROYUKI
IPC分类号： H01G9/008 , H01G4/228 , H01G9/00 , H01G9/004 , H01G9/012
CPC分类号： H01G9/008 , H01G9/10 , H01G9/151 , Y10T29/417
摘要： PROBLEM TO BE SOLVED: To improve reliability as a capacitor by suppressing the formation of burrs and projections at the joint part between an aluminum wire round bar and an external terminal in a lead wire used for a capacitor. SOLUTION: In a lead wire for a capacitor, a metal cap 3 with the higher melting point than that of aluminum is inserted in the end part of an aluminum wire round bar 2, and the metal cap 3 is heated to join the aluminum wire round bar 2 with the metal cap 3. After that, the external terminal 4 and the metal cap 3 are welded. The metal cap 3 has a curved face with the outer periphery that becomes smaller toward the end part 3a from the opening part 3b, and has such a constitution that the opening part 3b is provided with a stepped part 13 that is engaged in a through hole 12 to insert the lead wire 1 through a sealing body 11 and engages the stepped part 13 in the through hole 12. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过抑制在用于电容器的引线中的铝线圆棒和外部端子之间的接合部分处的毛刺和突起的形成来提高作为电容器的可靠性。解决方案：在电容器用引线中，在铝线圆棒2的端部插入熔点高于铝的金属盖3，将金属盖3加热，铝合金圆棒2与金属盖3.之后，外部端子4和金属盖3被焊接。金属盖3具有从开口部3b朝向端部3a变小的外周的弯曲面，并且具有这样的构造：开口部3b设置有台阶部13，该台阶部13与通孔 12，通过密封体11插入引线1并与通孔12中的阶梯部分13接合。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2002270401A RESISTOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002270401A
公开(公告)日：2002-09-20
申请号：JP2001072205
申请日：2001-03-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUKAWA TOSHIKI , FUKUOKA AKIO , HASHIMOTO MASATO , SAIKAWA HIROYUKI , NAKANISHI TSUTOMU
IPC分类号： H01C1/14 , H01C7/00 , H01C17/24
摘要： PROBLEM TO BE SOLVED: To provide a resistor which is capable of improving the electrical connection between top surface electrodes and edge face electrodes in reliability and adhesion between a first thin film and a second thin film in strength. SOLUTION: A pair of edge face electrodes 20 provided on the end edge of a board 11 is electrically connected to a pair to top surface electrodes 18, and formed into the shape of U together with a first end face electrode 21 formed into nearly the shape of L from back the substrate 11 and a second end face electrode 22 formed into nearly the shape of L from above the substrate 11. The electrodes are electrically connected together, and the edge face electrodes 21 and 22 are formed of first thin films 23 and 25 of Cr, Ti, Cr alloy, or Ti alloy and second thin films 24 and 26 of Cu alloy electrically connected to the thin films 23 and 25 respectively.

6. 发明专利

JP2002151302A RESISTOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002151302A
公开(公告)日：2002-05-24
申请号：JP2001072242
申请日：2001-03-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUKAWA TOSHIKI , FUKUOKA AKIO , HASHIMOTO MASATO , SAIKAWA HIROYUKI , NAKANISHI TSUTOMU
IPC分类号： H01C1/14 , H01C7/00 , H01C17/06 , H01C17/24
摘要： PROBLEM TO BE SOLVED: To provide a resistor which can improve reliability of electrical connection between an upper electrode and a side electrode. SOLUTION: A pair of upper electrodes 12, formed on the main surface of a substrate 11, have a multilayered structure which is comprised of a first upper electrode layer 14, a second upper electrode layer 15 overlapping at least partly the first upper electrode layer 14, and a contact layer 16 overlapping the first upper electrode layer 14 and the second upper electrode layer 15.

7. 发明专利

JP2001274002A RESISTOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001274002A
公开(公告)日：2001-10-05
申请号：JP2000045507
申请日：2000-02-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HASHIMOTO MASATO , MORIMOTO YOSHIRO , FUKUOKA AKIO , MINAFUJI HIROTADA , SAIKAWA HIROYUKI
IPC分类号： H01C17/06 , H01C7/00
摘要： PROBLEM TO BE SOLVED: To unnecessitate dimensional classification of chip-type substrates, eliminate a conventional step for changing a mask according to the dimensional ranking of the chip-type substrate, and to provide an inexpensive and fine resistor. SOLUTION: This resistor is comprised of a chip-type substrate 11 that a sheet-like insulation substrate is divided by a first slitted dividing part and a second dividing part orthogonal to the first dividing part, an upper electrode layer 12 formed on the substrate 11, a resistance layer 13 which is formed overlapping partly the upper electrode layer 12, protective layers 14 and 16 which is formed covering the resistance layer 13, a side electrode layer 17 formed on the side surface of the substrate 11 so that it may be electrically connected with the upper electrode layer 12, and a solder layer 18 covering the side electrode layer 17.

8. 发明专利

JPH0217614A ELECTRODE-TREATMENT OF CHIP COMPONENT 失效
公开(公告)号：JPH0217614A
公开(公告)日：1990-01-22
申请号：JP16824588
申请日：1988-07-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUJIMOTO YUKIO , SHINDO YASUHIRO , SAIKAWA HIROYUKI
IPC分类号： H01C17/28 , H01G13/00
摘要： PURPOSE:To reduce the surface area of a component by cooling a low-melting point metal film when it merely passes the surface of a high-frequency induction coil by performing high-frequency heating and fluxing of a low-melting point metal film at the outermost layer of an electrode of chip component retaining the low-melting point metal film at the outermost layer, having the high-melting point metal film as a ground layer at a power supply by high-frequency induction treating. CONSTITUTION:When producing a chip component 7 such as a chip resistor which is one type of electronic components, a high-frequency induction coil 17 is wound in spiral, a cylindrical gap part 18 is provided, and the component 7 can pass through it. A current of 2kW max. with a high frequency of 13 to 15MHz is allowed to flow through this coil 17 and the component 7 is closed within a state where an air of 10l/min flows at the central part. With this component 7 as a polygonal chip resistor, the lowermost layer of the construction of the electrode part is Ag-Pd, the middle layer is Ni, and the outermost layer is a low-melting point metal plating film having an electrical plating with a specified thickness. Then, by closing the component 7 within the coil 17 for approximately 10 seconds and performing treating, the surface is turned into a fluxing smoothing state by high-frequency induction heating.

9. 发明专利

JPS6129121B2 失效
公开(公告)号：JPS6129121B2
公开(公告)日：1986-07-04
申请号：JP2900279
申请日：1979-03-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ARAI TOSHIO , CHIKABA NOBUKI , SAKAI KAZUYUKI , SAIKAWA HIROYUKI
IPC分类号： G01R31/18 , B07C5/344 , B07C5/36 , G01R31/00 , H01C17/00

10. 发明专利

JP2008053744A Resistor and its manufacturing method 有权
标题翻译：电阻及其制造方法
公开(公告)号：JP2008053744A
公开(公告)日：2008-03-06
申请号：JP2007261752
申请日：2007-10-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MATSUKAWA TOSHIKI , FUKUOKA AKIO , HASHIMOTO MASATO , SAIKAWA HIROYUKI , NAKANISHI TSUTOMU
IPC分类号： H01C17/06 , H01C1/14 , H01C7/00
摘要： PROBLEM TO BE SOLVED: To provide a resistor of which an end face electrode can be easily and reliably formed by means of thin-film technology and which has high reliability of an electrical connection between the end face electrode and an upper surface electrode. SOLUTION: The resistor comprises: a substrate 11; upper surface electrodes 12, 13, 18 and a resistor body 14 which are formed on one of main sides of the substrate 11 and electrically connected to one another; and an end face electrode 20 which is formed on an end face of the substrate 11 and electrically connected to the upper surface electrodes 12, 13, 18; where: the end face electrode 20 is composed of a first end face electrode 21 and a second end face electrode 22; the first end face electrode 21 is made of a metal thin film, and formed from the other main side of the substrate 11; and the second end face electrode 22 is made of a metal thin film, formed from the one main side of the substrate 11, and electrically connected to the first end face electrode 21. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种电阻器，其端面电极可以通过薄膜技术容易且可靠地形成，并且在端面电极和上表面电极之间具有高可靠性的电连接。电阻器包括：基板11; 上表面电极12,13,18和电阻体14，其形成在基板11的一个主侧面上并彼此电连接; 以及端面电极20，其形成在基板11的端面上并电连接到上表面电极12,13,18; 其中：端面电极20由第一端面电极21和第二端面电极22构成; 第一端面电极21由金属薄膜制成，并由基板11的另一主面形成; 第二端面电极22由基板11的一个主面形成的金属薄膜构成，与第一端面电极21电连接。（C）2008，JPO＆INPIT

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