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1. 发明专利

JPH11207248A COATING METHOD 失效
公开(公告)号：JPH11207248A
公开(公告)日：1999-08-03
申请号：JP938598
申请日：1998-01-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI TOSHIYUKI , SUZAWA SHINICHI , AOTO MINEYASU , FUJIWARA TAKASHI , ICHIIE TOSHIFUMI
IPC分类号： B05D1/28 , B05C1/08 , B05D1/32
摘要： PROBLEM TO BE SOLVED: To prevent thickness distribution in a width direction of a single striped coating film from becoming extremely thick on an edge part and prevent a trouble wherein a small amount of a coating liquid is transferred to a non- coating striped part and other troubles from occurring even if problems of thickness distribution are solved. SOLUTION: A coating object matter wherein thickness distribution in a width direction of a single striped coating film is prevented from becoming extremely thick on an edge part as compared with a center part and even a small amount of coating liquid is prevented from being transferred on a striped non-coating part is obtained by bringing a coating object matter 1 and a gravure roll 6 into contact with each other by interposing a required number of masks 8 having required dimensions between the coating object matter 1 and the gravure roll 6. When a continuous coating object matter is wound on a tubular cylindrical core, extreme partial rise due to coating thickness difference is avoided so that deterioration of dimensional accuracy and damage of the coating object matter due to elongation induced at a rising part can be eliminated.

2. 发明专利

JPH03246914A CHIP CAPACITOR 失效
公开(公告)号：JPH03246914A
公开(公告)日：1991-11-05
申请号：JP4487390
申请日：1990-02-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KATO KENJI , SUGIURA NORIYUKI , YAMAMURA SHIGENARI , AOTO MINEYASU
IPC分类号： H01G4/252 , C09D5/24 , H05K1/18
摘要： PURPOSE:To improve half contact state due to decrease of wettability and open state due to element floating, and realize high density mounting, by spreading conductive paint of less thickness than 150mum on the right and the left electrode parts which contact a mounting substrate. CONSTITUTION:On both end surfaces of a capacitor element having dielectrics and metal layers or metal foils for electrodes, metal material is sprayed, and electrode leading-out parts whose thickness is larger than or equal to 0.1mm are formed, thereby forming electrode parts 1. Solder-plated layers 4 are formed on the outermost layers of the parts 1, and conductive paint 3 is spread in thickness smaller than 150mum, at least on the lower surface part of the right and the left electrodes, thereby constituting a chip capacitor. By making the thickness of the paint 3 smaller than 150mum, the conductive material is diffused into the solder-plated layer 4 and cream solder of the capacitor electrodes, and mutual fusing is promoted. Hence half contact state due to decrease of wettability and open state due to element floating can be improved, sure soldering is enabled, and high density mounting is realized.

3. 发明专利

JPS62172709A CAPACITOR 失效
公开(公告)号：JPS62172709A
公开(公告)日：1987-07-29
申请号：JP1510286
申请日：1986-01-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMURA SHIGENARI , SUGIURA NORIYUKI , NISHIKAWA KOREYASU , AOTO MINEYASU
IPC分类号： H01G4/18

4. 发明专利

JPH05121267A METALLIZED FILM FOR CAPACITOR USE 失效
公开(公告)号：JPH05121267A
公开(公告)日：1993-05-18
申请号：JP27743991
申请日：1991-10-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUNANAGARE NOBUKI , IWAOKA KAZUO , AOTO MINEYASU
IPC分类号： H01G4/012 , H01G4/015 , H01G4/18
摘要： PURPOSE:To provide a title film which improves moisture resistance and prevents a decrease in electrostatic capacitance of a capacitor due to electrode corrosion with regard to this, film used for electronic and electric apparatus. CONSTITUTION:This film comprises an electrode of a Ni-Al double layer structure by overlaying a dielectric film 13 with Ni 11 to a thickness of 50-100Angstrom by vacuum deposition and then with Al 112 to a thickness of 250-450Angstrom .

5. 发明专利

JPH0458164B2 失效
公开(公告)号：JPH0458164B2
公开(公告)日：1992-09-16
申请号：JP23520687
申请日：1987-09-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIWAKI MASASHI , KAJIMA TAKAFUMI , AOTO MINEYASU , WATANABE HISAYOSHI , KUWATA KENJI , ISHIDA KENJI , KUME NOBUYUKI , SUGIURA NORYUKI
IPC分类号： H01G4/224 , H01G4/18 , H01G4/228 , H01G4/30

6. 发明专利

JPS6477905A CAPACITOR 失效
公开(公告)号：JPS6477905A
公开(公告)日：1989-03-23
申请号：JP23519887
申请日：1987-09-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMURA SHIGENARI , AOTO MINEYASU , SUNANAGARE NOBUKI , KOJIMA JUNJI , OTA SATORU , KUWATA KENJI , ISHIDA KENJI
IPC分类号： H01G4/18 , H01G4/30
摘要： PURPOSE:To miniaturize a capacitor while improving heat-insulating properties by disposing a sheathing member onto the cut surface of a film capacitor element having protective layers to the upper and lower sections of a capacitance section and laminating films, in which polyphenylene oxide is formed onto one surfaces of polyphenylene sulfide PPS films, in the protective layers. CONSTITUTION:Protective layers 9, 10 are shaped to the upper and lower sections of a capacitance section in which double side evaporated and double- side coated films are laminated. The protective layers 9, 10 are constituted by laminating films in which resin films 12 composed of PPO are formed onto one surfaces of resin films 11 such as PPS films. Thermo-setting sheets called prepreg sheets in which epoxy resin layers 8b are shaped onto polyimide films 8a are stuck onto two surfaces as the cut surfaces of a discrete unit capacitor, and heated and cured and a sheathing member 8 is formed, thus acquiring a laminated film chip capacitor. The sheathing member 8 covers the whole end face of a capacitance section, and has width in an extent that it is arranged extending over the whole regions or partial regions of the end faces of the protective layers 9, 10.

7. 发明专利

JPS63249317A MANUFACTURE OF METALLIZED FILM CAPACITOR 失效
公开(公告)号：JPS63249317A
公开(公告)日：1988-10-17
申请号：JP8324687
申请日：1987-04-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： AOTO MINEYASU , ISHIDA KENJI , KIKUCHI MINORU , TACHIHARA HISAAKI , INOUE NOBUKI , OSHIMA KUNIO
IPC分类号： H01G4/18

8. 发明专利

JPH05121268A METALLIZED FILM FOR CAPACITOR USE 失效
公开(公告)号：JPH05121268A
公开(公告)日：1993-05-18
申请号：JP27744091
申请日：1991-10-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUNANAGARE NOBUKI , IWAOKA KAZUO , AOTO MINEYASU
IPC分类号： H01G4/012 , H01G4/015 , H01G4/18
摘要： PURPOSE:To provide a title film which improves moisture resistance and prevents a decrease in electrostatic capacitance of a capacitor due to electrode corrosion with regard to this film used for electronic and electric apparatus. CONSTITUTION:This film comprises an electrode of a Ni-Al-Ni treble layer structure by overlaying a dielectric film 14 with Ni 11 to a thickness of 500-100Angstrom by vacuum deposition, then with Al 112 to a thickness of 200-350Angstrom , and further with Ni 13 to a thickness of 50-100Angstrom .

9. 发明专利

JPH04262515A MANUFACTURE OF METALLIZED FILM FOR CAPACITOR USE 失效
公开(公告)号：JPH04262515A
公开(公告)日：1992-09-17
申请号：JP2315891
申请日：1991-02-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUNANAGARE NOBUKI , AOTO MINEYASU , IWAOKA KAZUO , IIJIMA YASUO
IPC分类号： C11D7/30 , C09D169/00 , C09D171/00 , C09D171/12 , H01G4/18
摘要： PURPOSE:To obtain a high-accuracy margin shape and to efficiently manufacture a metallized film by a method wherein a dielectric film is coated with a paint, a vapor deposition operation is then performed and the film is then cleaned by using a gasifying solvent regarding the formation method of a margin part (a non-metallized part) at the metallized film, for capacitor use, of a metallized film capacitor which is used for electronic apparatuses and electric apparatuses. CONSTITUTION:A dielectric film 1 is coated with an organic paint such as polycarbonate 2 or the like to be a required margin shape by using a printing method. After that, an aluminum layer 3 is formed by a vapor deposition method; after that, it is cleaned by using a solvent such as dichloromethane or the like; the polycarbonate layer and, at the same time, the aluminum layer in margin parts are removed. Thereby, the margin parts 4 are formed.

10. 发明专利

JPH03104204A CHIP TYPE ELECTRONIC COMPONENT 失效
公开(公告)号：JPH03104204A
公开(公告)日：1991-05-01
申请号：JP24373689
申请日：1989-09-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： AOTO MINEYASU , SUGIURA NORIYUKI , TERADA TERUHISA , YAMAMURA SHIGENARI , KOBAYASHI NOBUO , OMURA TORU , TASAKA AKIHIRO
IPC分类号： H01G4/252 , H05K1/18 , H05K3/34
摘要： PURPOSE:To effectively mount in a high density by coating at least lower surfaces of right and left electrodes in contact with a mounting board with conductive paint, and forming parts of electrodes. CONSTITUTION:A capacitor element 2 having conductors, metal layers or metal foils to become electrodes is provided, a metal material is thermal sprayed to both end faces of the element to form electrode leads as electrode parts 1, and plating layers 4 are formed on the outermost layers of the parts 1. Further, at least lower surface part of both the right and left electrodes in contact with a mounting board are coated with conductive paint 3 as a chip capacitor. The paint 3 is softened at the time of mounting in a high density, and a conductive material in the paint is diffused into the layers 4 and cream solder to accelerate fusion to each other.

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