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    • 3. 发明专利
    • JPH05243085A
    • 1993-09-21
    • JP4082192
    • 1992-02-27
    • MATSUSHITA ELECTRIC IND CO LTD
    • KIYONO KIMINORIWATANABE HISAYOSHIKUME NOBUYUKI
    • H01G4/18H01G4/24
    • PURPOSE:To realize mass production of high quality capacitor dielectric films which are designed to save resources and attain low cost by forming a thin film dielectric layer of specific ultraviolet hardening resin at least on one side of a two-sided metallic film. CONSTITUTION:An aluminum metals 2 and 3-deposited metallic film is adopted for both surfaces of a base film. After ultraviolet hardening resin is directly applied to a portion on its one side 2, ultraviolet rays are emitted under the low concentration of oxygen, thereby forming a dielectric layer 4. In a like manner, the ultraviolet hardening resin is also applied to the rear side 3 and hardened, thereby forming a dielectric layer 5. The ultraviolet hardening resin has the structure as represented in the following equation and there are two ways to use either a compound whose number of methylene group between acrylic acid groups exceeds 7 but fails to exceed 12 or a compound which has a saturated fat group ring-shaped hydrocarbon skeleton in its main chains and an ester atomic group having an acryloyl group in two side chains individually or use both the compounds.
    • 7. 发明专利
    • MANUFACTURE OF LAMINATED CAPACITOR
    • JPH04152615A
    • 1992-05-26
    • JP28006390
    • 1990-10-17
    • MATSUSHITA ELECTRIC IND CO LTD
    • WATANABE HISAYOSHITERANISHI KAZUYOKUME NOBUYUKI
    • H01G4/18H01G4/30
    • PURPOSE:To enhance the adhesive strength between a laminated body and an electrode lead-out layer, and to obtain the title laminated capacitor having excellent configuration and characteristics by a method wherein an organic metal layer of monomolecular layer is formed at least on the surface of the laminated body, and an electrode lead-out layer is formed thereon. CONSTITUTION:Coating material, which is formed by diluting titanium alcohol using alcohol, is applied on the opposing two surfaces where metal electrode layers 2, consisting of paired capacitor elements composed of a rectangular parallelepiped laminated body formed by laminating a metal electrode layer 2 composed of a plurality of dielectric layers 1, consisting of thermoplastic or thermosetting resin, and aluminum vacuum-deposited film. An organic metal layer 3 of at least monomolecular layer or several molecular layers are formed by drying the above-mentioned cooling material. By forming the electrode lead-out layer 4, consisting of a nickel layer and the like on the above-mentioned organic metal layer 3 using a sputtering method, the adhesive strength between the laminated body and the electrode lead-out layer can be improved. Also, as the organic metal layer 3 is very thin, sufficient electric continuity can be obtained by tunnel effect, and a laminated film chip capacitor, having excellent electric characteristics and mountability, can be obtained.
    • 9. 发明专利
    • FILM CHIP CAPACITOR
    • JPH03209807A
    • 1991-09-12
    • JP500690
    • 1990-01-12
    • MATSUSHITA ELECTRIC IND CO LTD
    • TERANISHI KAZUYOWATANABE HISAYOSHIKONDO TOSHIFUMIKUME NOBUYUKI
    • H01G4/18
    • PURPOSE:To maintain the capacitance of a film-chip capacitor and to make it small in size by a method wherein edge faces are provided by scraping off the four corners where an electrode lead-out face and the outermost face of a protective layer are brought into contact, and a metallized contact layer is formed by flame-sprayed metal on the edge face and the electrode lead-out face on the surface formed by the outermost surface of the protective layer. CONSTITUTION:The title capacitor has the edge faces formed by shaving off the four corners where the electrode lead-out surfaces 14 and 15 of the laminated body, consisting of the protective layers 12 and 13 superposed on an element layer 11 and its upper and lower sides, and the outermost layer surfaces of protective layers 12 and 13 are brought into contact with one another, metal is flame-sprayed on the above-mentioned edge faces and the electrode lead-out surfaces 14 and 15 within the surface formed by the outermost layer surfaces of the protective films 12 and 13, and metallized contact layers 16 and 17 are formed. Accordingly, the soldering area when a film-chip capacitor is mounted can be increased remarkably, and soldering strength can be maintained sufficiently even when the thickness of the metallized contact layers 16 and 17 is reduced to the minimum in which the metallized contact layers 16 and 17 and the vapor-deposited electrode of the element layer 11 can be electrically connected. As a result, the capacitance of the film-chip capacitor can be maintained, and the film-chip capacitor can also be made small in size.