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1. 发明专利

JP2012191613A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2012191613A
公开(公告)日：2012-10-04
申请号：JP2012046251
申请日：2012-03-02
申请人： Ibiden Co Ltd , Ibiden Usa R&D Inc , Ritsumeikan , イビデンユーエスエイアールアンドディーインコーポレイテッド , イビデン株式会社 , 学校法人立命館
发明人： MAEDA TADAHIKO , ITO MASATAKA , WANG DONGDONG , WAKAZONO YOSHITSUGU , MANO YASUHIKO
IPC分类号： H01Q9/38 , H01Q1/38
CPC分类号： H01Q1/36 , H01Q1/38 , H01Q9/28 , H01Q9/38 , H01Q11/08
摘要： PROBLEM TO BE SOLVED: To provide an antenna device which is small and realizes broadband performance.SOLUTION: An antenna element is formed by arranging multiple upper surface F-side conductor cells 22F, 42F, through holes 52, and multiple lower surface S-side conductor cells 22S, 42S so as to form a crank-shaped cross section. Thus, the size of the device is reduced compared to a device where an antenna element is disposed only on its upper surface. Further, arranging the antenna element so as to form the crank-shaped cross section realizes broadband performance.
摘要翻译：要解决的问题：提供一种体积小且实现宽带性能的天线装置。解决方案：通过布置多个上表面F侧导体单元22F，42F，通孔52和多个下表面S侧导体单元22S，42S来形成天线元件，以形成曲柄形横截面。因此，与天线元件仅设置在其上表面上的装置相比，装置的尺寸减小。此外，布置天线元件以形成曲柄形横截面实现宽带性能。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2014032978A Inductor component, manufacturing method of inductor component, and wiring board 审中-公开
标题翻译：电感元件，电感元器件制造方法及接线板
公开(公告)号：JP2014032978A
公开(公告)日：2014-02-20
申请号：JP2012170672
申请日：2012-07-31
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： YOSHIKAWA KAZUHIRO , MANO YASUHIKO
IPC分类号： H01F17/00 , H01F37/00 , H01F41/04 , H05K1/16 , H05K3/46
CPC分类号： H01F5/003 , H01F5/00 , H01F17/0013 , H01F41/32 , H01F2017/0066 , H05K1/165 , H05K1/185 , H05K2201/083 , H05K2201/09672 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To secure the connection reliability of a via conductor which connects upper and lower inductor patterns while securing desired electric characteristics in an inductor component.SOLUTION: A magnetic material layer 213a for covering a first portion and a resin layer 214 for covering both the first portion and a second portion of a first inductor pattern 212a are formed on the first inductor pattern 212a. Via conductors 218a, 221a are formed in via holes provided at the resin layer 214. The via conductor 218a is formed on a first output pad 223a, and the via conductor 221a is formed on a first input pad 222a. On the resin layer 214, a second inductor pattern 212b and a lamination pad 220a are formed. The lamination pad 220a is electrically connected with the first input pad 222a by the via conductor 221a.
摘要翻译：要解决的问题：确保连接上，下电感器图形的通孔导体的连接可靠性，同时确保电感器部件中所需的电特性。解决方案：用于覆盖第一部分的磁性材料层213a和用于覆盖的树脂层214 第一电感器图案212a的第一部分和第二部分都形成在第一电感器图案212a上。通孔导体218a，221a形成在设置在树脂层214的通孔中。通孔导体218a形成在第一输出焊盘223a上，通孔导体221a形成在第一输入焊盘222a上。在树脂层214上形成第二电感器图案212b和层压垫220a。叠层垫220a由通孔导体221a与第一输入焊盘222a电连接。

3. 发明专利

JP2014027212A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014027212A
公开(公告)日：2014-02-06
申请号：JP2012168485
申请日：2012-07-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MORITA HARUHIKO , KATO SHINOBU , MANO YASUHIKO , KUROKAWA SATOSHI
IPC分类号： H05K3/46
CPC分类号： H05K1/0306 , H05K1/0219 , H05K1/024 , H05K3/4673 , H05K2201/0191
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board capable of transmitting a high-frequency signal with low loss, and a printed wiring board capable of transmitting a low-frequency signal and a high-frequency signal with low loss.SOLUTION: The printed wiring board includes: a first build-up layer 500F formed of a first interlayer resin insulating layer 50G, a second interlayer resin insulating layer 50E, a first signal line 58E sandwiched between the first interlayer resin insulating layer 50G and the second interlayer resin insulating layer 50E, a first ground layer formed on a surface of the first interlayer resin insulating layer 50G, and a second ground layer formed on a surface of the second interlayer resin insulating layer 50E; and a second build-up layer 600F which is formed on the first build-up layer 500F and has an uppermost interlayer resin insulating layer and an uppermost conductor layer. The interlayer resin insulating layers of the first and second build-up layers are different in thickness or material.
摘要翻译：要解决的问题：提供能够以低损耗传输高频信号的印刷线路板以及能够以低损耗传输低频信号和高频信号的印刷线路板。解决方案：印刷布线板包括：由第一层间树脂绝缘层50G，第二层间树脂绝缘层50E，夹在第一层间树脂绝缘层50G和第二层间树脂绝缘层之间的第一信号线58E形成的第一堆积层500F 50E是形成在第一层间树脂绝缘层50G的表面上的第一接地层和形成在第二层间树脂绝缘层50E的表面上的第二接地层; 以及第二堆积层600F，其形成在第一堆积层500F上并具有最上层的层间树脂绝缘层和最上层的导体层。第一和第二堆积层的层间树脂绝缘层的厚度或材料不同。

4. 发明专利

JP2014022551A Printed wiring board and manufacturing method for printed wiring board 审中-公开
标题翻译：印刷布线板和印刷线路板的制造方法
公开(公告)号：JP2014022551A
公开(公告)日：2014-02-03
申请号：JP2012159571
申请日：2012-07-18
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , KARIYA TAKASHI
IPC分类号： H05K3/46 , H05K1/16
CPC分类号： H05K1/165 , H05K1/0233 , H05K1/186 , H05K3/0032 , H05K3/30 , H05K3/4676 , H05K3/4697 , H05K2201/0209 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating an inductor component having a desired inductor value and electrical characteristics.SOLUTION: In an opening 50E formed in a lower build-up layer 50S, an inductor component 110 of lamination structure, laminating a coil layer and a resin insulation layer, is housed. The resin insulation layer is formed of a material different from that of the insulation layer constituting the build-up layer. Since the number of coil layers can be increased by making the resin insulation layer thinner than the insulation layer thereby increasing the number of layers, an inductor component obtaining desired inductance value, Q value can be housed in a printed wiring board.
摘要翻译：要解决的问题：提供一种包含具有期望的电感值和电特性的电感器部件的印刷线路板。解决方案：在形成在下层叠层50S的开口50E中，层叠结构的电感器部件110，线圈层和树脂绝缘层。树脂绝缘层由与构成层的绝缘层不同的材料形成。由于通过使树脂绝缘层比绝缘层薄，从而增加层的数量可以增加线圈层的数量，可以将获得所需电感值Q值的电感器部件容纳在印刷线路板中。

5. 发明专利

JP2013161939A Sheet material, manufacturing method of sheet material, inductor component, wiring board, and magnetic material 审中-公开
标题翻译：薄片材料，材料制造方法，电感元件，接线板和磁性材料
公开(公告)号：JP2013161939A
公开(公告)日：2013-08-19
申请号：JP2012022568
申请日：2012-02-03
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , KARIYA TAKASHI
IPC分类号： H01F1/22 , B22F1/00 , B22F3/00 , H01F1/28 , H01F27/255 , H01F41/02
摘要： PROBLEM TO BE SOLVED: To secure electric reliability of a conductor pattern when the conductor pattern is formed on a magnetic material layer.SOLUTION: A sheet material 220a is formed by forming a resin layer 223a on a surface of a magnetic material layer 222a and forming a metal foil 224a on the resin layer 223a. The magnetic material layer 222a has a first insulation material 225 and magnetic material particles 226. The resin layer 223a is formed by a second insulation material. The magnetic material layer 222a contains the magnetic material particles 226 thereby allowing irregularities 226a formed according to shapes of the magnetic material particles 226 to easily occur on a surface of the magnetic material layer 222a. A conductor pattern may be formed on a smooth surface of the resin layer 223a by burying the irregularities 226a with the resin layer 223a formed on the surface of the magnetic material layer 222a. Electric reliability of the conductor pattern is secured with the structure.
摘要翻译：要解决的问题：当在磁性材料层上形成导体图形时，确保导体图案的电可靠性。解决方案：片材220a通过在磁性材料层222a的表面上形成树脂层223a并形成树脂层223a上的金属箔224a。磁性材料层222a具有第一绝缘材料225和磁性材料粒子226.树脂层223a由第二绝缘材料形成。磁性材料层222a包含磁性材料颗粒226，从而允许根据磁性材料颗粒226的形状形成的凹凸226a容易发生在磁性材料层222a的表面上。可以通过将凹凸226a与形成在磁性材料层222a的表面上的树脂层223a嵌套在树脂层223a的平滑表面上形成导体图案。导体图案的电可靠性用结构确保。

6. 发明专利

JP2014165362A Printed-wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014165362A
公开(公告)日：2014-09-08
申请号：JP2013035689
申请日：2013-02-26
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H05K3/46 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can supply stable electric power to IC chips.SOLUTION: A printed wiring board is formed by a first printed wiring board having a first electric circuit and a second printed wiring board having a second electric circuit. A solenoid coil is formed by the first and second electric circuits.
摘要翻译：要解决的问题：提供一种能够向IC芯片提供稳定电力的印刷线路板。解决方案：印刷电路板由具有第一电路的第一印刷线路板和具有第二电路的第二印刷线路板形成电路。螺线管线圈由第一和第二电路形成。

7. 发明专利

JP2014007339A Inductor component, method of manufacturing the same, and printed wiring board 审中-公开
标题翻译：电感元件及其制造方法和印刷电路板
公开(公告)号：JP2014007339A
公开(公告)日：2014-01-16
申请号：JP2012143230
申请日：2012-06-26
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H01F17/04 , H01F17/00 , H01F41/04
CPC分类号： H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can obtain a desired inductance amount with a thin inductor component.SOLUTION: In resin insulation layers 150A, 150C, 150E which are sandwiched by an inductor pattern, a penetration hole 170 is formed concentrically with the inductor pattern, and a cylindrical first magnetic body layer 172 is filled in the penetration hole. A second magnetic body layer 174 is covered on an inductor pattern 158G on the resin insulation layer 150E. Permeability is increased by arranging the cylindrical first magnetic body layer 172 to the center part of the inductor pattern and providing the second magnetic body layer 174 to the outside of the inductor pattern 158G. Thereby, a desired inductance amount can be obtained with a thin inductor component having a small number of layers.
摘要翻译：要解决的问题：提供一种能够用薄的电感器部件获得所需电感量的印刷线路板。解决方案：在由电感器图案夹着的树脂绝缘层150A，150C，150E中，同心地形成穿透孔170 具有电感图案，并且圆柱形的第一磁性体层172填充在穿透孔中。第二磁性体层174覆盖在树脂绝缘层150E上的电感器图案158G上。通过将圆柱形第一磁性体层172布置到电感器图案的中心部分并将第二磁性体层174提供给电感器图案158G的外部来增加渗透性。由此，可以通过具有少量层的薄电感器部件来获得期望的电感量。

8. 发明专利

JP2014154712A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014154712A
公开(公告)日：2014-08-25
申请号：JP2013023430
申请日：2013-02-08
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H05K3/46 , H01F17/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus mounting substrate having high inductance.SOLUTION: In a printed wiring board, an inductor component is mounted on a rear face of the printed wiring board just below an IC chip mounting part. A distance between the printed wiring board and the inductor component is 150 μm and over.
摘要翻译：要解决的问题：提供具有高电感的电子设备安装基板。解决方案：在印刷线路板中，电感器部件安装在紧靠IC芯片安装部分的印刷电路板的背面上。印刷电路板和电感器部件之间的距离为150μm以上。

9. 发明专利

JP2014116465A Inductor component, manufacturing method therefor and printed wiring board 审中-公开
标题翻译：电感元件及其制造方法及印刷电路板
公开(公告)号：JP2014116465A
公开(公告)日：2014-06-26
申请号：JP2012269660
申请日：2012-12-10
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , YANO TOSHIMASA , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F41/02 , H01F41/046 , H01F2017/002 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide an inductor component in which desired inductance characteristics (inductance, Q value) can be ensured while scarcely inhibiting the electrical characteristics of surrounding conductors.SOLUTION: An inductor component 10 includes a core material 20 having a first surface F, a second surface S on the opposite side, and a through hole 22, a first conductor pattern 58F formed on the first surface of the core material, a second conductor pattern 58S formed on the second surface of the core material, and a through hole conductor provided inside of the through hole for connecting the first conductor pattern and second conductor pattern. An inductor 59 consisting of the first conductor pattern 58F, the second conductor pattern 58S and the through hole conductor 36 is also included, and a magnetic material layer is provided, at least partially, on the outer periphery of the inductor in the core material.
摘要翻译：要解决的问题：提供一种电感器部件，其中可以确保期望的电感特性（电感Q值），同时几乎不抑制周围导体的电特性。电感器部件10包括芯材20，芯材20具有第一表面F ，相对侧的第二表面S和形成在芯材的第一表面上的通孔22，形成在第一表面上的第一导体图案58F，形成在芯材的第二表面上的第二导体图案58S，以及通孔导体设置在通孔的内部，用于连接第一导体图案和第二导体图案。还包括由第一导体图案58F，第二导体图案58S和通孔导体36组成的电感器59，并且至少部分地在芯材中的电感器的外周设置有磁性材料层。

10. 发明专利

JP2013080846A Wiring board and manufacturing method thereof 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2013080846A
公开(公告)日：2013-05-02
申请号：JP2011220540
申请日：2011-10-04
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： CHIN TOSHIMASU , MANO YASUHIKO , KATO SHINOBU
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a wiring board and a manufacturing method of the wiring board capable of securing inductor performance even when the number of layers of the wiring board is small.SOLUTION: A wiring board 10 comprises a core member 11 having a first insulating layer 20 including a first surface F, a second surface S on the side opposite to the first surface F, and a through hole 20a, a first conductor pattern 21A formed on the first surface F of the first insulating layer 20, a second conductor pattern 22A formed on the second surface S of the first insulating layer 20, and a connection conductor 30 formed inside the through hole 20a and connecting the first conductor pattern 21A and the second conductor pattern 22A. The first conductor pattern 21A and the second conductor pattern 22A are spirally formed and thicker than the first insulating layer 20, thereby compactly configuring an inductor 40 having large inductance.
摘要翻译：要解决的问题：为了提供即使当布线板的层数很小时也能够确保电感器性能的布线板和布线板的制造方法。解决方案：布线板10包括具有包括第一表面F的第一绝缘层20，与第一表面F相对的第二表面S的芯体11和通孔20a，第一导体图案 21A形成在第一绝缘层20的第一表面F上，形成在第一绝缘层20的第二表面S上的第二导体图案22A和形成在通孔20a内部并连接第一导体图案21A的连接导体30 和第二导体图案22A。第一导体图案21A和第二导体图案22A螺旋地形成并且比第一绝缘层20厚，从而紧凑地构造具有大电感的电感器40。版权所有（C）2013，JPO＆INPIT

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