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1. 发明专利

JP2011016176A Method for drilling printed circuit board and processing machine for the printed circuit board 有权
标题翻译：印刷电路板钻孔方法及印刷电路板加工机
公开(公告)号：JP2011016176A
公开(公告)日：2011-01-27
申请号：JP2009161013
申请日：2009-07-07
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： TAKAHASHI HIROKI , KOSHIZUKA HISAHIRO , NAGASAWA KATSUHIRO , KUMAGAI TOKUSHIGE , WATANABE KAZUO
IPC分类号： B23B39/24 , B23B41/00 , B23B47/18 , B23Q17/12
摘要： PROBLEM TO BE SOLVED: To provide a method for drilling a printed circuit board while enabling high-speed and high-accuracy processing by reducing the vibration of a device which occurs due to the driving reaction of a drill when drilling, and to provide a processing machine for the printed circuit board.SOLUTION: The method for drilling the printed circuit board includes relatively positioning a table 3 on which the printed circuit board P is placed, and the drill 7 in a horizontal XY-direction, and then moving the drill 7 relative to the printed circuit board P in a Z-direction perpendicular to the XY-direction when drilling the printed circuit board P. Drills 7a-7f are sectioned into two A and B tool groups. After a predetermined time delay Δt passes from starting the movement of the drills 7a, 7c, 7e in the tool group A relative to the printed circuit board P, the drills 7b, 7d, 7f in the tool group B are moved relative to the printed circuit board P in the same operation pattern as the operation pattern of the drills in the tool group A.
摘要翻译：要解决的问题：提供一种钻孔印刷电路板的方法，同时通过减少钻孔时由于钻头的驱动反应而发生的装置的振动，从而实现高速和高精度加工，并提供加工用于印刷电路板的机器。解决方案：用于钻印印刷电路板的方法包括相对定位放置印刷电路板P的工作台3和钻头7在水平XY方向上，然后移动钻头7 相对于印刷电路板P在垂直于XY方向的Z方向上钻孔印刷电路板P.钻孔7a-7f被分成两个A和B工具组。在从刀具组A中的钻头7a，7c，7e的相对于印刷电路板P的移动开始经过预定的时间延迟Δt之后，工具组B中的钻头7b，7d，7f相对于印刷电路板电路板P与工具组A中的钻头的操作模式相同的操作模式。

2. 发明专利

JP2007245331A Printed board machining device and drilling method therefor 有权
标题翻译：印刷机加工设备及其钻孔方法
公开(公告)号：JP2007245331A
公开(公告)日：2007-09-27
申请号：JP2007032253
申请日：2007-02-13
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： WATANABE KAZUO , KUMAGAI TOKUSHIGE , NAGASAWA KATSUHIRO , YAMASHITA TAKAHIKO , KAMATA HIROYUKI , KOSHIZUKA HISAHIRO , SUGAWARA HIROYUKI , MIYASAKA TORU
IPC分类号： B26F1/16 , B23B39/24
CPC分类号： H05K3/0047 , B23B39/161 , B23B39/18 , H05K3/0008 , H05K3/0097
摘要： PROBLEM TO BE SOLVED: To provide a printed board machining device which can improve the machining accuracy thereof without enlarging the device entire body, and to provide a drilling method for the printed board machining device.
SOLUTION: The printed board machining device M carries out drilling by positioning axes of drills 4a, 4b rotatably held by spindles 5a, 5b driven by X-axis driving sections 3a, 3b and Y-axis driving sections 7a, 7b, to machining locations, and thereafter penetrating the drills 4a, 4b into printed boards 1a, 1b, by Z-axis driving sections 6a, 6b, respectively. Herein drilling operation is carried out by moving mutually adjacent X axes in opposite directions and mutually adjacent Y axes in opposite directions.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不扩大装置整体的情况下提高其加工精度的印刷电路板加工装置，并为印刷电路板加工装置提供钻孔方法。解决方案：印刷板加工装置M通过将由X轴驱动部分3a，3b和Y轴驱动部分7a，7b驱动的主轴5a，5b可旋转地保持的钻头4a，4b的轴定位进行钻孔，以加工位置，然后分别通过Z轴驱动部分6a，6b将钻头4a，4b穿入印刷电路板1a，1b。这里，通过沿相反方向移动相互相邻的X轴并且沿相反方向相互相邻的Y轴来进行钻孔操作。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2011230199A Drilling control method, program, and drilling machine 有权
标题翻译：钻井控制方法，程序和钻孔机
公开(公告)号：JP2011230199A
公开(公告)日：2011-11-17
申请号：JP2010099852
申请日：2010-04-23
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： TAKAHASHI HIROKI , KOSHIZUKA HISAHIRO , NAGASAWA KATSUHIRO , SUZUKI NOBUHIKO , WATANABE KAZUO
IPC分类号： B23B39/08
摘要： PROBLEM TO BE SOLVED: To perform highly accurate working with a small positioning error and high throughput.SOLUTION: When performing correction of positioning to a next working hole, a current position and moving amounts of a table and a slide plate to the target value of the next working hole are checked (P02). On the basis of the moving amounts of both of them, time Tx that a table position command reaches the target value and time Ty that the position command of the slide plate reaches the target value are calculated. Then, the time Tx that the table position command reaches the target value is compared with the time Ty that the position command of the slide plate reaches the target value and, on the basis of the comparison, the positioning start time of the slide plate or the table is delayed (P05 and P06). Positioning end times of both of them are set to be the same time, correction amounts are calculated from the moving amounts of the table and the sliding plate, and the correction amounts are deducted from the position commands of the table and the sliding plate (P07). On the basis of the delayed positioning start time and the corrected command values, positioning is performed to carry out drilling (P08).
摘要翻译：要解决的问题：以小的定位误差和高产量进行高精度的加工。
解决方案：当对下一个工作孔进行定位校正时，检查工作台和滑板的当前位置和移动量与下一个工作孔的目标值（P02）。基于它们的移动量，计算表位置命令达到目标值的时间Tx和滑板的位置命令达到目标值的时间Ty。然后，将表位置指令达到目标值的时间Tx与滑板的位置指令达到目标值的时间Ty进行比较，并且基于比较，将滑板的定位开始时间或该表被延迟（P05和P06）。两者的定位结束时间被设定为同一时刻，根据台面和滑板的移动量计算校正量，并且从表和滑板的位置指令（P07）中扣除校正量）。基于延迟定位开始时间和校正指令值，进行定位以进行钻孔（P08）。版权所有（C）2012，JPO＆INPIT

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