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1. 发明专利

JP2014170945A Semiconductor module and joint material 有权
标题翻译：半导体模块和接头材料
公开(公告)号：JP2014170945A
公开(公告)日：2014-09-18
申请号：JP2014077543
申请日：2014-04-04
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： YAMAGUCHI TAKUTO , OKAMOTO MASAHIDE , IKEDA YASUSHI , KURODA HIROMITSU , KUROKI KAZUMA , HATA SHOHEI , ODA YUICHI
IPC分类号： H01L21/52 , B23K35/28 , H01L23/36
CPC分类号： H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To use a lead-free material for joining a semiconductor element and a frame or substrate or joining a metal plate and a metal plate, and to ensure high reliability.SOLUTION: As a joint material for a semiconductor element and a frame or substrate, a Zn-based metal layer 101 is sandwiched by Al-based metal layers 102a, 102b. Further, as a joint material, a laminate material in which the outsides of the Al-based metal layers 102a, 102b are sandwiched by X-based metal layers 103, 103b (X=Cu, Au, Ag, Sn). Thereby, even in a high oxygen concentration atmosphere, the X-based metal layer as a surface protects Zn and Al from oxidation until the joint material melts. Thus, wettability and bondability of the joint materials, as solder, can be maintained, and the high reliability of the joint parts can be ensured.
摘要翻译：要解决的问题：使用无铅材料来连接半导体元件和框架或基板或者接合金属板和金属板，并且确保高可靠性。解决方案：作为用于半导体元件和框架或衬底，Zn基金属层101被Al基金属层102a，102b夹持。此外，作为接合材料，其中Al基金属层102a，102b的外部被X基金属层103,103b（X = Cu，Au，Ag，Sn）夹持的层压材料。因此，即使在高氧浓度气氛中，作为表面的X基金属层也可以保护Zn和Al免于氧化，直到接合材料熔化。因此，可以保持作为焊料的接合材料的润湿性和粘合性，并且可以确保接合部件的高可靠性。

2. 发明专利

JP2005252030A Lead free solder material and manufacturing method of solder material 有权
标题翻译：无铅焊料的材料和制造方法
公开(公告)号：JP2005252030A
公开(公告)日：2005-09-15
申请号：JP2004061201
申请日：2004-03-04
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： OKAMOTO MASAHIDE , IKEDA YASUSHI , KAWAI TETSURO , INOUE RYOJI , TACHIKAWA KIYOSHI
IPC分类号： B23K35/14 , B23K35/26 , B23K35/40 , C22C13/00 , H01L21/52
CPC分类号： H01L24/29 , H01L24/27 , H01L24/73 , H01L24/743 , H01L2224/32225 , H01L2224/32245 , H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/92247 , H01L2924/01029 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/0105 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solder material for die mount connection which does not generate a flash at a reflow temperature of 240 to 260°C and does not cause solder peeling which affects connection reliability due to cracks in a temperature cycle in a practical use environment.
SOLUTION: The solder material has a Pb free metal 13 which does not melt with a base solder 12 which melts at a reflow temperature of 240 to 260°C, and the ratio of the Pb free metal 13 is 40 to 80 vol.%. The portion of the Pb free metal 13 exists in the base solder 12 like a floating island.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于芯片安装连接的焊料材料，其在240至260℃的回流温度下不产生闪光，并且不引起焊料剥离，这影响由于温度循环中的裂纹引起的连接可靠性在实际使用环境中。
解决方案：焊料材料具有无铅金属13，其不会与240-660℃的回流温度熔化的基底焊料12熔融，并且无铅金属13的比例为40至80体积％％。无铅金属13的部分像浮岛一样存在于基底焊料12中。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2013031864A Solder ball and semiconductor device using solder ball 审中-公开
标题翻译：焊球和半导体器件使用焊球
公开(公告)号：JP2013031864A
公开(公告)日：2013-02-14
申请号：JP2011168436
申请日：2011-08-01
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： FUJIWARA SHINICHI , CHIWATA NOBUHIKO , FUJIYOSHI MASARU , WAKANO MOTOKI , IKEDA YASUSHI
IPC分类号： B23K35/14 , H01L21/60 , H05K1/18 , H05K3/34
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a solder ball which can prevent the disconnection from occurring in a copper pad part while preventing a reaction of copper and tin between the copper pad part and the solder ball from being promoted; and to provide a semiconductor device using the solder ball.SOLUTION: This solder ball is configured by including a core material coated with a metal on the surface of a metal or resin; a first metal film layer formed on the surface of the core material and comprising nickel, titanium or chromium as a main component; a second metal film layer formed on the outer periphery of the first metal film layer and comprising copper as a main component; and a third metal film layer on the outer periphery of the second metal film layer and comprising tin as a main component. The semiconductor device is configured by connecting a first electrode pad on a first member and a second electrode pad on a second member by using this solder ball.
摘要翻译：要解决的问题：提供一种防止在铜焊盘部分发生断开的焊球，同时防止铜焊盘部分和焊球之间的铜和锡的反应被促进; 并提供使用焊球的半导体器件。
解决方案：该焊球通过在金属或树脂的表面上包括涂有金属的芯材构成; 形成在所述芯材的表面上并且包含镍，钛或铬作为主要成分的第一金属膜层; 第二金属膜层，形成在第一金属膜层的外周上，并以铜为主要成分; 以及在所述第二金属膜层的外周上并且包含锡作为主要成分的第三金属膜层。通过使用该焊球将第一构件上的第一电极焊盘和第二构件上的第二电极焊盘连接起来，构成半导体器件。版权所有（C）2013，JPO＆INPIT

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