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1. 发明专利

JP2014184446A Laminate joint material and joint body joined by using the same 审中-公开
标题翻译：使用相同的层压材料和接合体
公开(公告)号：JP2014184446A
公开(公告)日：2014-10-02
申请号：JP2013059416
申请日：2013-03-22
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUROKI KAZUMA , ODA YUICHI , KURODA HIROMITSU , TSUJI TAKAYUKI , UCHIDA SOHEI
IPC分类号： B23K35/14 , B23K1/00 , B23K35/28 , B23K101/40 , C22C9/06 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide a joint material capable of restraining a joint area shrinkage, while maintaining an advantage of zinc-aluminum (Zn-Al)-based solder as a non-lead-based high temperature solder.SOLUTION: The laminate joint material on the present invention is a sheet-like laminate joint material of laminating a plurality of metal layers, and in the laminate joint material, an Al layer is formed by two as both outer layers of sandwiching a zinc layer with the zinc layer as a central layer, and a Cu layer is formed as an outer layer of one layer of the two Al layers, and a Cu-Ni alloy layer is formed as an outer layer of the other layer of the two Al layers, and the Ni concentration in the Cu-Ni alloy layer is 10 mass%-30 mass%, and the Cu-Ni alloy layer is thicker than the Cu layer, and a difference between a thickness of the Cu-Ni alloy layer and a thickness of the Cu layer is 0.5% or more of the whole thickness of the laminate joint material, and the sum total of the thickness of the Cu-Ni alloy layer and the thickness of the Cu layer is more than 0.5% and 3% or less of the whole thickness of the laminate joint material.
摘要翻译：要解决的问题：提供能够抑制接合面收缩的接合材料，同时保持作为非铅基高温焊料的锌 - 铝（Zn-Al）基焊料的优点。解决方案：层压接头本发明的材料是层叠多个金属层的片状层叠接合材料，在层叠接合材料中，Al层由两层形成，两层都夹着锌层，锌层为中心层和Cu层形成为两层Al层的一层的外层，并且形成Cu-Ni合金层作为两个Al层的另一层的外层，并且Ni浓度 Cu-Ni合金层的厚度为10质量％-30质量％，Cu-Ni合金层比Cu层厚，Cu-Ni合金层的厚度与Cu层的厚度之差为层压接头材料的整个厚度的0.5％以上，t的总和 Cu-Ni合金层的厚度和Cu层的厚度大于层压接头材料的整个厚度的0.5％以上3％以下。

2. 发明专利

JP2014170945A Semiconductor module and joint material 有权
标题翻译：半导体模块和接头材料
公开(公告)号：JP2014170945A
公开(公告)日：2014-09-18
申请号：JP2014077543
申请日：2014-04-04
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： YAMAGUCHI TAKUTO , OKAMOTO MASAHIDE , IKEDA YASUSHI , KURODA HIROMITSU , KUROKI KAZUMA , HATA SHOHEI , ODA YUICHI
IPC分类号： H01L21/52 , B23K35/28 , H01L23/36
CPC分类号： H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To use a lead-free material for joining a semiconductor element and a frame or substrate or joining a metal plate and a metal plate, and to ensure high reliability.SOLUTION: As a joint material for a semiconductor element and a frame or substrate, a Zn-based metal layer 101 is sandwiched by Al-based metal layers 102a, 102b. Further, as a joint material, a laminate material in which the outsides of the Al-based metal layers 102a, 102b are sandwiched by X-based metal layers 103, 103b (X=Cu, Au, Ag, Sn). Thereby, even in a high oxygen concentration atmosphere, the X-based metal layer as a surface protects Zn and Al from oxidation until the joint material melts. Thus, wettability and bondability of the joint materials, as solder, can be maintained, and the high reliability of the joint parts can be ensured.
摘要翻译：要解决的问题：使用无铅材料来连接半导体元件和框架或基板或者接合金属板和金属板，并且确保高可靠性。解决方案：作为用于半导体元件和框架或衬底，Zn基金属层101被Al基金属层102a，102b夹持。此外，作为接合材料，其中Al基金属层102a，102b的外部被X基金属层103,103b（X = Cu，Au，Ag，Sn）夹持的层压材料。因此，即使在高氧浓度气氛中，作为表面的X基金属层也可以保护Zn和Al免于氧化，直到接合材料熔化。因此，可以保持作为焊料的接合材料的润湿性和粘合性，并且可以确保接合部件的高可靠性。

3. 发明专利

JP2014140852A Joint material 审中-公开
标题翻译：联合材料
公开(公告)号：JP2014140852A
公开(公告)日：2014-08-07
申请号：JP2013009355
申请日：2013-01-22
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ODA YUICHI , KUROKI KAZUMA , KURODA HIROMITSU , TSUJI TAKAYUKI , UCHIDA SOHEI
IPC分类号： B23K35/14 , B23K1/00 , B23K35/28 , B23K101/40 , C22C5/02 , C22C5/04 , C22C5/06 , C22C9/00 , C22C19/00 , H01L21/52 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a joint material capable of suppressing displacement caused by shrinkage.SOLUTION: A joint material comprises: a shrinkage suppression layer 2 that is made of metal predominantly composed of one of Cu, Ni, Au, Ag, Co, Cr, Pd, Pt and Rh; a molten layer 3 that is provided in such a manner as to sandwich the shrinkage suppression layer 2 from a thickness direction and that has a Zn layer 4 made of metal predominantly composed of Zn and an Al layer 5 made of metal predominantly composed of Al; and an oxidation suppression layer 6 that is provided in such a manner as to sandwich the shrinkage suppression layer 2 and the molten layer 3 from the thickness direction and that is made of metal predominantly composed of one of Cu, Au and Ag.
摘要翻译：要解决的问题：提供能够抑制由收缩引起的位移的接合材料。解决方案：接头材料包括：收缩抑制层2，其由主要由Cu，Ni，Au，Ag，Co， Cr，Pd，Pt和Rh; 熔融层3以厚度方向夹着收缩抑制层2的方式设置，并且具有由主要由Zn构成的金属制成的Zn层4和主要由Al构成的金属构成的Al层5; 以及氧化抑制层6，其设置成从厚度方向夹住收缩抑制层2和熔融层3，并且由主要由Cu，Au和Ag之一构成的金属制成。

4. 发明专利

JP2014185793A Heat pipe and composite material for heat pipe 审中-公开
标题翻译：热管热合管和复合材料
公开(公告)号：JP2014185793A
公开(公告)日：2014-10-02
申请号：JP2013059946
申请日：2013-03-22
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUROKI KAZUMA , SAGAWA HIDEYUKI , KURODA HIROMITSU , SUZUKI YUKIO
IPC分类号： F28D15/02 , B23K20/04
CPC分类号： B32B15/015 , B23K35/302 , F01N5/02 , F28D15/0233 , F28D15/0275 , F28F19/06 , F28F21/083 , Y10T428/1291
摘要： PROBLEM TO BE SOLVED: To provide a heat pipe and a composite material for the heat pipe that can restrain oxidation on an inner surface of the heat pipe.SOLUTION: A heat pipe 1 comprises: a cylindrical body made of metal and including a closed storage space 10a in which water 5 is stored; a heat absorption part 101 provided at its one end part and for absorbing heat by vaporizing the water 5; a heat dissipation part 102 provided at another end part and for dissipating heat by condensing water vapor generated by vaporizing the water 5; a base material 2 mainly made of stainless steel; a nickel layer 3 provided on an inner surface of the base material 2 and mainly made of nickel; and a copper layer 4 provided on an inner surface of the nickel layer 3 and containing copper. A surface 4a of the copper layer 4 is exposed to the storage space 10a.
摘要翻译：要解决的问题：提供一种能够抑制热管的内表面上的氧化的热管的热管和复合材料。热管1包括：由金属制成的圆筒体，包括封闭的储存存储有水5的空间10a; 设置在其一个端部并用于通过蒸发水5吸收热量的吸热部分101; 设置在另一端部的散热部102，通过使通过蒸发水5而产生的水蒸气冷凝而散发热量; 主要由不锈钢制成的基材2; 镍层3，设置在基材2的内表面上，主要由镍构成; 以及设置在镍层3的内表面并含有铜的铜层4。铜层4的表面4a暴露于存储空间10a。

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