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1. 发明专利

JP2009053005A Semiconductor strain sensor, and mounting method of semiconductor strain sensor 审中-公开
标题翻译：半导体应变传感器和半导体应变传感器的安装方法
公开(公告)号：JP2009053005A
公开(公告)日：2009-03-12
申请号：JP2007219342
申请日：2007-08-27
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , OKADA RYOJI , KAWAI TETSURO
IPC分类号： G01B7/16 , G01L1/18 , G01L3/10
摘要： PROBLEM TO BE SOLVED: To suppress a change of a sensor characteristic caused by temperature rise or thermal deformation by improving heat radiation from a sensor chip, in a semiconductor strain sensor using a semiconductor strain gage.
SOLUTION: In this semiconductor strain sensor having a strain sensor chip wherein a piezo resistance element is formed on a semiconductor, a metallic base plate, and a wiring part for leading out wiring from an electrode of the sensor chip to the outside, the sensor chip is bonded to the base plate with a metal material, and connection areas to be connected to a measuring object are provided on at least two spots sandwiching a bonding part of the sensor chip on the base plate. Since the sensor chip is bonded to the metallic base plate with the metal material, heat generated in the sensor chip easily escapes from the sensor chip rear surface to the base plate, to thereby prevent thermal deformation caused by temperature rise of the sensor chip and temperature unevenness between the sensor chip and the base plate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过使用半导体应变计的半导体应变传感器，通过改善传感器芯片的散热来抑制由温度升高或热变形引起的传感器特性的变化。解决方案：在具有应变传感器芯片的半导体应变传感器中，其中在半导体上形成压电电阻元件，金属基板和用于从传感器芯片的电极向外引出布线的布线部分，传感器芯片用金属材料接合到基板上，并且将连接到测量对象的连接区域设置在将传感器芯片的接合部分夹在基板上的至少两个点上。由于传感器芯片与金属材料接合到金属基板上，所以在传感器芯片中产生的热量容易地从传感器芯片背面向基板逸出，从而防止由传感器芯片的温度升高引起的热变形和温度传感器芯片与基板之间的不平坦度。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2012216170A Flow control device 有权
标题翻译：流量控制装置
公开(公告)号：JP2012216170A
公开(公告)日：2012-11-08
申请号：JP2011199150
申请日：2011-09-13
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： GOTO TAKAO , AONO TOSHIHIRO , KAWAI TETSURO
IPC分类号： G05D7/06
CPC分类号： G05D7/0635 , Y10T137/7759 , Y10T137/7761
摘要： PROBLEM TO BE SOLVED: To realize flow control with good responsiveness by an easy setting.SOLUTION: In a flow control device 100, a comparator 40 outputs a first control voltage Vref based on a comparison of an instruction value signal Vi1 of the flow volume and a signal Vi2 according to the sensor output signal Vs. A feedback current generator 30 generates a feedback current Ifb according to a difference between the sensor output signal Vs and a signal Vi2 according to the instruction value signal Vi1. A feedback voltage generator 50 is a resister. A feed forward current generator 20 generates a feed forward current Iff according to the instruction value signal Vi1. A synthesis unit 60 generates a second control voltage Vdrv* obtained by adding the feedback voltage Vfb to a voltage according to a sum of the feedback current Ifb and the feed forward current Iff. A valve unit 90 is controlled according to the first control voltage Vref and the second control voltage Vdrv*.
摘要翻译：要解决的问题：通过简单的设置实现具有良好响应性的流量控制。解决方案：在流量控制装置100中，比较器40根据传感器输出信号Vs对流量的指令值信号Vi1和信号Vi2进行比较，输出第一控制电压Vref。反馈电流发生器30根据指示值信号Vi1根据传感器输出信号Vs和信号Vi2之间的差产生反馈电流Ifb。反馈电压发生器50是电阻器。前馈电流发生器20根据指示值信号Vi1产生前馈电流Iff。合成单元60产生通过将反馈电压Vfb与反馈电流Ifb和前馈电流Iff的和相加的电压相加而获得的第二控制电压Vdrv *。根据第一控制电压Vref和第二控制电压Vdrv *控制阀单元90。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009264976A Semiconductor strain sensor 有权
标题翻译：半导体应变传感器
公开(公告)号：JP2009264976A
公开(公告)日：2009-11-12
申请号：JP2008116245
申请日：2008-04-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , OKADA RYOJI , HAMAGUCHI YASUHIRO , KAWAI TETSURO
IPC分类号： G01B7/16
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor strain sensor using a semiconductor strain gauge, which can ensure stable characteristics for a long period and perform accurate strain measurement even when mounted on a measuring object differed in coefficient of thermal expansion from a strain sensor chip by minimizing the effect of a thermal strain resulting from the difference in coefficient of thermal expansion. SOLUTION: The strain sensor chip is bonded to a base plate, and the base plate is connected to the measuring object in two connecting areas at both sides across the strain sensor chip of the base plate. A strain detection part of the strain sensor chip comprises a bridge circuit by piezoresistive elements with direction of p-type silicon and a direction vertical thereto as current direction, the direction being matched to a direction of connecting the two connection areas (X-direction). A thermal strain due to a difference in coefficient of thermal expansion between the strain sensor chip and the base plate can be canceled by the bridge circuit, and an X-directional strain selectively transmitted to the base plate can be detected with high sensitivity. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用半导体应变计的半导体应变传感器，其可以长期确保稳定的特性，并且即使在安装在测量对象上的应变热系数不同时执行精确的应变测量通过最小化由热膨胀系数差导致的热应变的影响的传感器芯片。解决方案：将应变传感器芯片接合到基板，并且基板在两侧的基板的应变传感器芯片的两侧的连接区域中连接到测量对象。应变传感器芯片的应变检测部分包括具有p型硅的<110>方向的压阻元件和垂直于其的方向作为电流方向的桥式电路，<110>方向与连接两个连接的方向相匹配区域（X方向）。由于应变传感器芯片和基板之间的热膨胀系数的差异导致的热应变可以被桥接电路消除，并且可以以高灵敏度检测选择性地传输到基板的X方向应变。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009075039A Semiconductor strain sensor, and attaching method of semiconductor strain sensor 有权
标题翻译：半导体应变传感器和半导体应变传感器的连接方法
公开(公告)号：JP2009075039A
公开(公告)日：2009-04-09
申请号：JP2007246695
申请日：2007-09-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAZAMA ATSUSHI , OKADA RYOJI , KAWAI TETSURO
IPC分类号： G01B7/16 , G01L1/18
摘要： PROBLEM TO BE SOLVED: To stabilize characteristics for a long period of time and stabilize the conversion coefficient of a strain generated in the strain sensor chip corresponding to a strain of a subject to be measured, within a strain range, in a semiconductor strain sensor having a semiconductor strain sensor gauge.
SOLUTION: The back surface of a strain sensor chip is bonded to a base board surface, and a groove that has a length of a side length or longer and separates a strain sensor chip connecting part from a connecting area is formed in the back surface of the base board and in the side part of the strain sensor chip. A projecting part surrounded by the groove is formed in the back surface of the strain sensor chip, thereby improving the rigid balance between front and back sides, suppressing bending deformation of the strain sensor chip, and stabilizing the conversion coefficient of the strain.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了稳定长时间的特性并且使应变传感器芯片中产生的应变的变换系数稳定在应变测量对象的应变范围内，在半导体中应变传感器具有半导体应变传感器。解决方案：将应变传感器芯片的背面接合到基板表面，并且形成具有侧部长度或更长的长度并且将应变传感器芯片连接部分与连接区域分离的凹槽基板的后表面和应变传感器芯片的侧面部分。在应变传感器芯片的背面形成由凹槽包围的突出部，从而提高前后两面之间的刚性平衡，抑制应变传感器芯片的弯曲变形，并稳定应变的转换系数。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2005252030A Lead free solder material and manufacturing method of solder material 有权
标题翻译：无铅焊料的材料和制造方法
公开(公告)号：JP2005252030A
公开(公告)日：2005-09-15
申请号：JP2004061201
申请日：2004-03-04
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： OKAMOTO MASAHIDE , IKEDA YASUSHI , KAWAI TETSURO , INOUE RYOJI , TACHIKAWA KIYOSHI
IPC分类号： B23K35/14 , B23K35/26 , B23K35/40 , C22C13/00 , H01L21/52
CPC分类号： H01L24/29 , H01L24/27 , H01L24/73 , H01L24/743 , H01L2224/32225 , H01L2224/32245 , H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/92247 , H01L2924/01029 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/0105 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solder material for die mount connection which does not generate a flash at a reflow temperature of 240 to 260°C and does not cause solder peeling which affects connection reliability due to cracks in a temperature cycle in a practical use environment.
SOLUTION: The solder material has a Pb free metal 13 which does not melt with a base solder 12 which melts at a reflow temperature of 240 to 260°C, and the ratio of the Pb free metal 13 is 40 to 80 vol.%. The portion of the Pb free metal 13 exists in the base solder 12 like a floating island.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于芯片安装连接的焊料材料，其在240至260℃的回流温度下不产生闪光，并且不引起焊料剥离，这影响由于温度循环中的裂纹引起的连接可靠性在实际使用环境中。
解决方案：焊料材料具有无铅金属13，其不会与240-660℃的回流温度熔化的基底焊料12熔融，并且无铅金属13的比例为40至80体积％％。无铅金属13的部分像浮岛一样存在于基底焊料12中。版权所有（C）2005，JPO＆NCIPI

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