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1. 发明专利

JP2004247980A Connection structure and method of transmission line 审中-公开
公开(公告)号：JP2004247980A
公开(公告)日：2004-09-02
申请号：JP2003035934
申请日：2003-02-14
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： YAGYU MASAYOSHI , SAITO TATSUYA , OMAE SHIGEO , AKASHI MITSUHISA
IPC分类号： H01P5/08
CPC分类号： H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a structure of a transmission line with an excellent signal transmission characteristic up to a high frequency band.
SOLUTION: In the connection structure of transmission lines configured such that an electric signal is transmitted from a signal wire of a first transmission line to a signal wire of a second transmission line, a conductor is provided at an end face of the first transmission line so as to be orthogonally crossing the signal wire of the first transmission line.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2011151210A Optical output device 审中-公开
标题翻译：光输出设备
公开(公告)号：JP2011151210A
公开(公告)日：2011-08-04
申请号：JP2010011306
申请日：2010-01-21
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： TAKASHIMA SHIGEHIRO , AKASHI MITSUHISA , KOGURE TAICHI , NAKAGAWA YASUSHI , TAKEGUCHI KOJI , NARUSAWA SAKI
IPC分类号： H01S5/0687 , H01S5/50 , H04B10/07 , H04B10/294 , H04B10/40 , H04B10/50 , H04B10/564 , H04B10/60 , H04J14/00 , H04J14/02
摘要： PROBLEM TO BE SOLVED: To prevent an optical signal from being output before a wavelength of a laser beam output from a laser reaches a target wavelength.
SOLUTION: A drive circuit 6 controls the drive of a Peltier device 5 so that the wavelength of the laser beam output from the laser 4 reaches the target wavelength. After the wavelength of the laser beam reaches the target wavelength, an amplification control circuit 16 controls the amplification of an amplifier 14 so that an amplification amount reaches a reference amplification amount, and until the wavelength of the laser beam reaches the target wavelength, the amplification control circuit controls the amplification of the amplifier 14 so that the amplification amount is smaller than the reference amplification amount. Moreover, after the wavelength of the laser beam reaches the target wavelength, an attenuation control circuit 20 controls the attenuation of an optical attenuator 18 so that the intensity of the optical signal reaches reference intensity, and until the wavelength of the laser beam reaches the target wavelength, the attenuation control circuit controls the attenuation of the optical attenuator 18 so that the intensity of the optical signal is lower than reference intensity.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止在从激光器输出的激光束的波长达到目标波长之前输出光信号。解决方案：驱动电路6控制珀耳帖装置5的驱动，使得从激光器4输出的激光束的波长达到目标波长。在激光束的波长达到目标波长之后，放大控制电路16控制放大器14的放大，使得放大量达到参考放大量，直到激光束的波长达到目标波长，放大控制电路控制放大器14的放大，使得放大量小于参考放大量。此外，在激光束的波长达到目标波长之后，衰减控制电路20控制光衰减器18的衰减，使得光信号的强度达到参考强度，并且直到激光束的波长达到目标衰减控制电路控制光衰减器18的衰减，使得光信号的强度低于基准强度。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2004063861A Optical communication apparatus, optical transmitter, optical transceiver, and optical transmission system 有权
公开(公告)号：JP2004063861A
公开(公告)日：2004-02-26
申请号：JP2002221082
申请日：2002-07-30
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： AKASHI MITSUHISA , SAITO HIRONORI , GOTO FUMITOSHI , KANKIPATI RAJU , NAKAGAWA YASUSHI
IPC分类号： H05K7/20 , H01L31/02 , H01S5/022 , H05K1/14 , H05K7/14
CPC分类号： H04B10/503 , H05K1/141
摘要： PROBLEM TO BE SOLVED: To increase heat dissipating efficiency of an IC by realizing reduction of cabinet size which receives restriction by component size and lowering of the back, in an optical transceiver used for an optical communication system.
SOLUTION: A printed circuit board on which components are to be mounted is divided, fixing positions of individual boards to a cabinet are set, on the basis of dimension specification of the optical transceiver, and the respective boards are connected by using electric connectors or the like, so that the lowering of back can be realized. At this time, the divided boards are overlapped so as not to be in contact with each other, board area is enlarged, and practical component-mounting area is extended, so that miniaturization of the optical transceiver can be realized. Since component-mounting surface can be determined arbitrarily, in matching the heat dissipating direction of an IC, heat dissipation to a heat sink side is enabled, and heat dissipating property can be improved. Further, when there is a failure in a component, only the board on which the component is mounted needs to be remedied or exchanged, so that improvement in productivity and reduction of manufacturing cost can be realized.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2012156749A Optical receiver 有权
标题翻译：光接收机
公开(公告)号：JP2012156749A
公开(公告)日：2012-08-16
申请号：JP2011013717
申请日：2011-01-26
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： TAKASHIMA SHIGEHIRO , AKASHI MITSUHISA , ERA YOSHIKAZU , TAKAI ATSUSHI
IPC分类号： H04B10/516 , H04B10/07 , H04B10/524 , H04B10/556 , H04B10/61 , H04L7/02 , H04L27/22
CPC分类号： H04B10/613 , H04B10/69
摘要： PROBLEM TO BE SOLVED: To establish signal conduction at a high speed with no use of such combination as a bit shift overlaps with a pattern change, in pattern synchronization for correctly reproducing reception data which is performed with an optical receiver that receives an optical signal subjected to orthogonal phase modulation.SOLUTION: The control method does not confirm a duplicated combination caused by a modulation method and a pattern synchronization searching order. A signal check circuit performs data confirmation of the data multiplexed by an MUX circuit which multiplexes two data trains. A bit shift/pattern change control circuit controls a bit shift circuit and a pattern change circuit based on the data confirmation result to detect a correct combination of correct reproduction data and establish signal conduction. Here, no confirmation is performed on duplicated combination, for the bit shift circuit and the pattern change circuit.
摘要翻译：要解决的问题：为了正确再现接收数据的光接收器执行的图形同步，为了不用比特移位与图形变化重叠的组合来高速建立信号传导，光信号进行正交相位调制。
解决方案：控制方法不能确认由调制方法和模式同步搜索顺序引起的复制组合。信号检查电路对通过多路复用两个数据列的MUX电路复用的数据进行数据确认。位移/模式改变控制电路基于数据确认结果控制位移电路和模式改变电路，以检测正确的再现数据的正确组合并建立信号传导。这里，对于位移电路和模式改变电路，不对复制组合进行确认。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2008210931A Photoelectric conversion module 有权
标题翻译：光电转换模块
公开(公告)号：JP2008210931A
公开(公告)日：2008-09-11
申请号：JP2007045142
申请日：2007-02-26
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , AKASHI MITSUHISA , OTAKE TOSHIKAZU , ISHII HIROYOSHI
IPC分类号： H05K9/00 , H01L31/02
摘要： PROBLEM TO BE SOLVED: To reduce an assembling man-hour by facilitating the handling of an encapsulant provided between an upper case unit and a lower case unit upon combining the upper case unit and the lower case unit for a photoelectric conversion module. SOLUTION: A gasket groove 15 recessed from the side of a bottom plate 21 toward the side of a ceiling plate 11 and into which a part of a conductive gasket 30 can be entered in a state that the wide surface 33 of the conductive gasket 30 is substantially parallel to the side plate 12 is formed on the side plate 12 of the upper case unit 10. A slanted pushing surface 25 for pushing the conductive gasket 30 into the gasket groove 15 is formed on the side plate 22 of the lower case unit 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过组合上壳体单元和用于光电转换模块的下壳单元，便于处理设置在上壳单元和下壳单元之间的密封剂的装配工时。解决方案：从底板21的侧面朝向天花板板11的侧面凹陷的垫圈槽15，并且导电垫片30的一部分可以在导电性的垫片30基本上平行于在上壳体单元10的侧板12上形成的侧板12.在下侧的侧板22上形成用于将导电垫片30推入垫圈槽15的倾斜的推压表面25 案例单位20.版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2011221541A Photoelectric conversion module 审中-公开
标题翻译：光电转换模块
公开(公告)号：JP2011221541A
公开(公告)日：2011-11-04
申请号：JP2011112123
申请日：2011-05-19
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , AKASHI MITSUHISA , OTAKE TOSHIKAZU , ISHII HIROYOSHI
IPC分类号： G02B6/42 , G02B6/00 , H01L31/0232 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To reduce an assembly man-hour by facilitating the handling of an encapsulant provided between an upper case part and a lower case part of a photoelectric conversion module when both of them are combined.SOLUTION: A gasket groove 15 which is recessed from the side of a bottom plate 21 toward the side of a ceiling plate 11 and into which a part of a conductive gasket 30 can be put in a state that a wide surface 33 of the conductive gasket 30 is substantially parallel to a side plate 12 is formed on a side plate 12 of an upper case part 10. A slanted pushing surface 25 for pushing the conductive gasket 30 in the gasket groove 15 is formed on a side plate 22 of a lower case part 20.
摘要翻译：要解决的问题：当两者组合时，通过促进设置在光电转换模块的上壳体部分和下壳体部分之间的密封剂来减少装配工时。解决方案：从底板21侧朝向天花板板11的侧面凹陷的衬垫槽15，导电垫片30的一部分能够被放置在其中，宽的表面33 导电垫圈30基本上平行于在上壳体部件10的侧板12上形成的侧板12.在垫片槽15中的导电垫圈30的推压表面25形成在侧板22上（C）2012，JPO＆INPIT

7. 发明专利

JP2007184400A Optical transmission module and semiconductor device 有权
标题翻译：光传输模块和半导体器件
公开(公告)号：JP2007184400A
公开(公告)日：2007-07-19
申请号：JP2006001307
申请日：2006-01-06
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MAEDA FUMIHIDE , YAMADA OSAMU , MOTOHIRO SATOSHI , HAYASHI TAKAYUKI , AKASHI MITSUHISA , TAKANO MITSUHIRO , NAKAGAWA YASUSHI
IPC分类号： H01S5/022 , H01L31/02 , H05K1/18
CPC分类号： H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the reliability of temperature cycle of an optical transmission module, where a coaxial ceramic BGA solder ball IC is mounted.
SOLUTION: The fillet of an underfill is optimized so as to have catenarian profile as a whole by arranging a flow prevention frame 5 for an underfill 6 and optimizing the size, the Young's modulus of the underfill is set to 5 Gpa or lower, and thermal expansion coefficient is set to 20-35 ppm/°C. The entire circumference of the solder ball mounting surface is chamfered by 0.5 mm or larger, or round-chamfered by 0.2 mm or larger.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高安装同轴陶瓷BGA焊球IC的光传输模块的温度循环的可靠性。解决方案：底部填料的圆角被优化，通过为底部填料6设置防流体框架5并优化尺寸，使底填料的杨氏模量设定为5Gpa以下，从而具有整体的横截面形状。，热膨胀系数设定为20-35ppm /℃。焊球安装面的整个圆周倒角0.5mm以上，圆形倒角0.2mm以上。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006345031A OPTICAL RECEPTION MODULE AND OPTICAL RECEPTION MODULE SYSTEM 审中-公开
公开(公告)号：JP2006345031A
公开(公告)日：2006-12-21
申请号：JP2005166551
申请日：2005-06-07
申请人： OPNEXT JAPAN INC
发明人： AKASHI MITSUHISA , AOKI TETSUYA , NAKAGAWA YASUSHI
IPC分类号： H04B10/2507 , H04B10/07 , H04B10/2525 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/69
摘要： PROBLEM TO BE SOLVED: To provide an optical reception module used for a high bit rate long distance transmission system that suppresses deterioration in a transmission penalty characteristic against waveform distortion caused by long distance transmission. SOLUTION: A storage device 42 stores in advance a relationship between an optical input power monitor value of an optical transmission signal before passing through a fiber and an input signal amplitude monitor value. Then an actual optical transmission waveform is given to the optical reception module and an arithmetic unit 33 executes comparison among the optical input power monitor value, the input signal amplitude monitor value, and the respective monitor values when no waveform distortion is received to calculate a waveform distortion value. The arithmetic unit 33 calculates an optimum threshold value and a phase adjustment value whereat the reception sensitivity is highest depending on the calculated waveform distortion amount to control a threshold value adjustment circuit 41 and a phase value adjustment circuit 37 so that the optimum threshold value and phase value with respect to the input distortion amount can be set and the transmission penalty characteristic can be enhanced. COPYRIGHT: (C)2007,JPO&INPIT

9. 发明专利

JP2002270954A OPTICAL WAVELENGTH STABILIZING CIRCUIT, OPTICAL TRANSMITTER AND OPTICAL TRANSMITTING SYSTEM 失效
公开(公告)号：JP2002270954A
公开(公告)日：2002-09-20
申请号：JP2001072834
申请日：2001-03-14
申请人： OPNEXT JAPAN INC
发明人： AKASHI MITSUHISA , MOTOSAWA YOICHI , SHARMA SUNIL , TOKITA SHIGERU , NAKAO TAKAYUKI
IPC分类号： H01S5/024 , H01S5/042 , H01S5/0683 , H01S5/0687 , H04B10/07 , H04B10/293 , H04B10/564 , H04B10/572 , H04B10/04 , H04B10/06 , H04B10/14
摘要： PROBLEM TO BE SOLVED: To suppress the change of a wavelength due to the temperature dependency of each characteristic of an optical splitter, a wavelength filter and a light reception element when mounting the optical splitter, wavelength filter and light reception element comprising a laser element and a wavelength monitoring part to the same thermoionic cooling element, in an optical transmitter used for a high-density wavelength multiplexing system. SOLUTION: The change of a wavelength of an output light signal to that of a laser injection current is monitored in an initial state by a wavemeter, the changing quantity of the wavelength is fed back to a wavelength compensation circuit, a correction voltage value for keeping the wavelength in the initial state is obtained, and the obtained voltage value is recorded by a memory element or the like. The corrected voltage is added to a comparison circuit, thus correcting the change of a characteristic to the change of a temperature in the light reception element and obtaining a stabilized optical wavelength. An injection current value to be applied to a laser is always monitored during the operation of the optical transmitter, and the corrected voltage corresponding to the change of a current is given to the comparison circuit thus stabilizing the optical wavelength.

10. 发明专利

JPH11183758A OPTICAL SEMICONDUCTOR ELEMENT MODULE AND OPTICAL SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11183758A
公开(公告)日：1999-07-09
申请号：JP35158897
申请日：1997-12-19
申请人： HITACHI LTD
发明人： HAYAMI AKIHIRO , YAMADA YASUHIRO , BABA NAOHIKO , AISAKA MIYUKI , AKASHI MITSUHISA , HATANO OSAMU
IPC分类号： G02B6/42 , H01L33/00 , H01L33/62 , H01L33/64 , H04B10/00 , H04B10/25 , H05K1/02 , H05K3/30 , H05K3/34 , H04B10/12 , H04B10/13 , H04B10/135 , H04B10/14
摘要： PROBLEM TO BE SOLVED: To simply and firmly fix an optical semiconductor element module and a printed board, to reduce assembling manhour and to suppress the deterioration of optical and electrical characteristics of the module in an optical semiconductor device constituted of packaging the module on the printed board. SOLUTION: A cylindrical metallic case 6 for an optical semiconductor element module 5 storing a part optically connecting an optical fiber 1 to an optical semiconductor element in the case 6 is provided with a terminal-attached flange 3b allowed to be soldered to the board 7. Structure for shielding a front end part improves a shielding effect and suppresses the deterioration of optical and electrical characteristics of the module 5.

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