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    • 1. 发明专利
    • Clean room
    • 整理房间
    • JPS6191433A
    • 1986-05-09
    • JP21137584
    • 1984-10-11
    • Hitachi LtdHitachi Plant Eng & Constr Co Ltd
    • SAIKI ATSUSHISUZUKI MICHIOSUNAMI HIDEOASAI SHOJIROMAKI MICHIYOSHIASAMI KINICHIRO
    • F24F7/06F24F3/16F24F7/10
    • F24F3/161F24F7/10
    • PURPOSE:To make it possible to make a super clean space where the diffusion of dusts and dirts is small by setting a small opening degree of floor plates close to an under-floor return port, and setting a large opening degree of floor plates farther from the return port. CONSTITUTION:The opening degree of floor plates 6 are made larger from the position of an air return port 8 successively in the order of a region (a), a region (b) and a region (c). As a result, in the air flow the concentration of an air current to parts close to the air return port 8 is reduced as shown by arrow 11, and the horizontal air flow is substantially eliminated. Thus, the air flow becomes substantially a vertical air flow, and a down flow is realized. As a result, diffusion of dusts and dirts can be prevented, and improvements in the yield of the product and reliability therefor are realized.
    • 目的:通过将地板板的小开度设置在靠近底板返回口的地方,可以使粉尘和污垢扩散的超洁净空间变小,并将较大的开口度设置在更低的地板上 返回端口。 构成:按照区域(a),区域(b)和区域(c)的顺序,从空气返回口8的位置开始使地板6的开度更大。 结果,在空气流动中,如箭头11所示,气流对接近空气返回口8的部分的浓度降低,并且基本上消除了水平空气流。 因此,空气流变成基本上垂直的空气流,实现向下流动。 结果,可以防止粉尘和污垢的扩散,从而实现产品的产量提高和可靠性的提高。
    • 2. 发明专利
    • Clean room
    • 整理房间
    • JPS6191434A
    • 1986-05-09
    • JP21137684
    • 1984-10-11
    • Hitachi LtdHitachi Plant Eng & Constr Co Ltd
    • SAIKI ATSUSHISUZUKI MICHIOSUNAMI HIDEOASAI SHOJIROMAKI MICHIYOSHIASAMI KINICHIRO
    • F24F7/06F24F3/16F24F7/10
    • F24F7/10F24F3/161
    • PURPOSE:To prevent dust from diffusing from a region where dust is liable to be generated to a region where cleanness should be maintained by providing a difference in the air flow speeds depending on the character of the region so that the blow-off speed of the air flow in a passing region becomes greater than that in a working region. CONSTITUTION:When as a blow-off air flow from a filter 4, the blow-off speed in a working region 6a is made larger than a blow-off air flow speed in a passing region 6b, air on the low air flow side is induced to the high air flow side. Thus, dust is diffused by offsetting to the high air flow speed side, and air on the low speed side has a low dust concentration. Hence, diffusion of dust to the low air flow side cannot almost be observed. As a result, the yield of the product and reliability therefor can be improved.
    • 目的:为了防止灰尘从易于产生灰尘的区域扩散到通过根据该区域的特性提供空气流速的差异来保持清洁度的区域,使得吹扫速度 通过区域中的空气流量变得大于工作区域中的空气流量。 构成:作为来自过滤器4的吹出空气流,工作区域6a中的吹出速度大于通过区域6b中的吹出空气流速,低气流侧的空气为 诱导到高气流侧。 因此,灰尘通过偏移到高空气流速侧而扩散,低速侧的空气的灰尘浓度低。 因此,几乎不能观察到灰尘向低空气流侧的扩散。 结果,可以提高产品的产量和可靠性。
    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR MEMORY DEVICE
    • JPH08274281A
    • 1996-10-18
    • JP12433196
    • 1996-05-20
    • HITACHI LTD
    • KIMURA SHINICHIROKAWAMOTO YOSHIFUMIKAGA TORUSUNAMI HIDEO
    • H01L27/04H01L21/822H01L21/8242H01L27/108
    • PURPOSE: To dispense with an alignment operation that conductive layers stacked up above a switching transistor are aligned with the switching transistor by a method wherein conductive films are deposited on a first and a second interlayer insulating film, patterned, and partially formed into the conductive layers of required pattern which extend over the first and the second interlayer insulating film. CONSTITUTION: A conductive film 1-10 is formed on a semiconductor substrate 1-1, a first interlayer insulating film 1-11 is deposited on the conductive film 1-10, the films 1-10 and 1-11 are patterned and partially extended over a gate electrode 1-4, and a first patterned conductive layer which the first interlayer insulating film 1-11 has left is formed thereon. A second interlayer insulating film 1-12 is formed on the side of the first patterned conductive layer through anisotropic etching. Thereafter, other conductive films are deposited on the first and the second interlayer insulating film, 1-11 and 1-12, and patterned into a second patterned conductive layer 1-13 which is partially extended over the interlayer insulating films 1-11 and 1-12. Therefore, a wiring structure which enhances a semiconductor memory device in storage capacity can be realized.