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1. 发明专利

JP2008277863A Inspection apparatus of circuit pattern 审中-公开
标题翻译：电路图检查装置
公开(公告)号：JP2008277863A
公开(公告)日：2008-11-13
申请号：JP2008189098
申请日：2008-07-22
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： NARA YASUHIKO , NOJIRI MASAAKI , HAYAKAWA KOICHI
IPC分类号： H01L21/66 , G01N23/225 , H01J37/29
摘要： PROBLEM TO BE SOLVED: To provide an inspection apparatus of circuit patterns in which, when images of the circuit patterns as inspection objects are inspected through a monitor screen, an inspection process can promptly be conducted by the accurate information of the screen, and defects across the whole product or in a specific region thereof can promptly be detected.
SOLUTION: The inspection apparatus of the circuit patterns radiates an electromagnetic wave or a charged particle beam on a wafer substrate surface on which the circuit patterns are formed, and detects defects on the circuit patterns from an inspection image obtained based on signals generated from the substrate by the radiation. The inspection apparatus is provided with an inspection condition setting section to set a procedure wherein the corresponding part of the inspection image is irradiated with an electron beam to alter the charging state of the wafer before and after the inspection image is acquired.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路图案的检查装置，其中当通过监视器屏幕检查作为检查对象的电路图案的图像时，可以通过屏幕的准确信息快速地进行检查处理，并且可以迅速地检测整个产品或其特定区域中的缺陷。解决方案：电路图案的检查装置在其上形成有电路图案的晶片衬底表面上辐射电磁波或带电粒子束，并从基于产生的信号获得的检查图像中检测电路图案上的缺陷从基板通过辐射。检查装置具有检查条件设定部，其设定检查图像的对应部分用电子束照射以改变在获取检查图像之前和之后的晶片的充电状态的过程。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005175333A Inspection method of circuit pattern and its device 有权
标题翻译：电路图及其器件的检查方法
公开(公告)号：JP2005175333A
公开(公告)日：2005-06-30
申请号：JP2003415866
申请日：2003-12-15
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： NARA YASUHIKO , NOJIRI MASAAKI , HAYAKAWA KOICHI
IPC分类号： G01N23/225 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an inspection method of a circuit pattern and its device capable of rapidly processing an image of a circuit pattern as an inspection object on the basis of the accurate information of a monitor screen upon inspecting the image of the circuit pattern through the monitor screen, and capable of rapidly detecting defects over an entire product or defects in a specific region.
SOLUTION: The inspection method of the circuit pattern detects any defect on the circuit pattern from an inspection image obtained on the basis of a signal generated from the substrate by the irradiation of electromagnetic waves or charged particle rays on a substrate surface on which the circuit pattern of a wafer is formed. In the method, at least before or after the inspection image is obtained, an electron beam is irradiated on a corresponding part of the inspection image to change the charged state of the wafer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电路图案及其装置的检查方法，其能够在检查图像的图像时基于监视器屏幕的准确信息快速处理作为检查对象的电路图案的图像通过监视器屏幕的电路图案，并且能够快速检测整个产品上的缺陷或特定区域的缺陷。解决方案：电路图案的检查方法从基于由基板产生的信号通过电磁波或带电粒子光线的照射而获得的检查图像检测电路图案上的任何缺陷，基板表面上形成晶片的电路图案。在该方法中，至少在获得检查图像之前或之后，将电子束照射在检查图像的对应部分上以改变晶片的充电状态。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2009277648A Inspection device and inspection method 审中-公开
标题翻译：检查装置和检查方法
公开(公告)号：JP2009277648A
公开(公告)日：2009-11-26
申请号：JP2009071121
申请日：2009-03-24
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HAYAKAWA KOICHI , NOJIRI MASAAKI
IPC分类号： H01J37/147 , G01N23/225 , H01J37/28 , H01L21/66
CPC分类号： H01J37/26 , H01J37/045 , H01J37/302 , H01J2237/004 , H01J2237/2482 , H01J2237/2817
摘要： PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method can prevent irradiation of an electron beam to non-inspection zones even if a sample has mixed non-inspection zones during inspection of patterns of a semiconductor wafer and inspect desired inspection zones.
SOLUTION: The inspection device includes a scanning deflector for scanning an electron beam over the sample wherein the electron beam has irradiation energy for imaging an irradiating zone of the sample, a blanking deflector for blanking the electron beam to prevent it from irradiating the sample during scanning, a stage for continuously moving the sample during scanning of the electron beam, and a control device for transmitting a deflection demand to the blanking deflector to blank the electron beam over non-irradiation zones of the sample according to selection of irradiation zones of the sample.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使在检查半导体晶片的图案期间样品具有混合的非检查区域并且检查期望值时，提供检查装置和检查方法也可以防止将电子束照射到非检查区域检验区。解决方案：检查装置包括用于扫描样品上的电子束的扫描偏转器，其中电子束具有用于对样品的照射区域进行成像的照射能量，用于消隐电子束的消隐偏转器，以防止其照射扫描期间的样品，用于在扫描电子束期间连续移动样品的阶段;以及控制装置，用于将偏转要求传送到消隐偏转器，以根据照射区的选择将样品的非照射区域上的电子束空白的样品。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007067170A Inspection apparatus of circuit pattern 有权
标题翻译：电路图检查装置
公开(公告)号：JP2007067170A
公开(公告)日：2007-03-15
申请号：JP2005251237
申请日：2005-08-31
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HAYAKAWA KOICHI , MIYAI YASUSHI , NOJIRI MASAAKI , NAKANO MICHIO
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method of creating an efficient inspection recipe for inspecting a plurality of inspection regions of different picture brightness by roughness and fineness of a pattern in a circuit pattern inspection of a semiconductor wafer. SOLUTION: When stripe inspection is carried out in a chip, since the combination of cell comparison regions I-VII are different in each of regions A, B, C, inspection origination/end coordinates, cell comparison pitches, inspection threshold values are registered as an inspection region information for every inspection region I-VII, the pattern inspection is carried out while changing these cell comparison pitches and inspection threshold values during scanning the stripe. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种创建用于通过半导体晶片的电路图案检查中的图案的粗糙度和细度来检查不同图像亮度的多个检查区域的有效检查配方的方法。解决方案：当在芯片中进行条纹检查时，由于区域A，B，C，检测始发/结束坐标，单元比较间距，检查阈值被注册为每个检查区域I-VII的检查区域信息，在扫描条纹期间改变这些单元格比较间距和检查阈值的同时执行图案检查。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2012150065A Circuit pattern inspection device and inspection method thereof 审中-公开
标题翻译：电路图案检查装置及其检查方法
公开(公告)号：JP2012150065A
公开(公告)日：2012-08-09
申请号：JP2011010355
申请日：2011-01-21
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HIROI TAKASHI , NOJIRI MASAAKI , YAMAMOTO TAKUMA , NINOMIYA HIROSHI
IPC分类号： G01B15/04 , H01L21/66
CPC分类号： G06T7/0004 , G01B15/00 , G01N23/2251 , G01N2223/611 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a speedy circuit pattern inspection method and a device thereof which have short inspection preparation time and can perform defect determination by image detection for one die.SOLUTION: Referring to design information, a coordinate expected to have the same pattern as a corresponding coordinate and an alignment coordinate are selected. The alignment coordinate is used to perform alignment of a detection image and the design information for correction of a shift amount and comparison is made with the pattern of a coordinate expected to have the same pattern, thereby performing pattern comparison by image detection for one die.
摘要翻译：要解决的问题：提供一种快速的电路图案检查方法及其装置，其具有短的检查准备时间，并且可以通过一个管芯的图像检测执行缺陷确定。
解决方案：参考设计信息，选择预期具有与相应坐标和对准坐标相同的图案的坐标。对准坐标用于执行检测图像的对准和用于校正偏移量的设计信息，并且与预期具有相同图案的坐标的图案进行比较，从而通过一个模具的图像检测进行图案比较。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2010080565A Inspecting apparatus of substrate, and inspecting method of substrate 审中-公开
标题翻译：检查基板的检查装置和检查基板的方法
公开(公告)号：JP2010080565A
公开(公告)日：2010-04-08
申请号：JP2008245108
申请日：2008-09-25
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HAYAKAWA KOICHI , NOJIRI MASAAKI , FUKUNAGA FUMIHIKO , TAMORI TOMOHIRO
IPC分类号： H01L21/66 , G01N23/225
摘要： PROBLEM TO BE SOLVED: To provide an inspecting apparatus of a substrate and an inspecting method of a substrate, for determining inspection conditions without repeatedly radiating electron ray to the same inspection region.
SOLUTION: The electron ray is radiated to a substrate where a circuit pattern is formed and a generated secondary electron is detected. The detected signal is made into an image and is stored. The stored image is compared with a second image formed from the other identical circuit pattern. Based on a preset defect discrimination condition, a defect of the substrate is extracted from the comparison result. The inspecting apparatus includes a storage part in which an image of the region within a range of a substrate, from one end to the other end, is accumulated, and a defect determination part for repeatedly determining defects by utilizing the image accumulated in the storage part under a defect determination condition different from the preset defect determination condition.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供基板的检查装置和基板的检查方法，用于确定检查条件而不向相同的检查区域反复辐射电子射线。解决方案：将电子射线照射到形成电路图案的基板上，并检测所产生的二次电子。将检测到的信号制成图像并被存储。将存储的图像与由另一相同电路图案形成的第二图像进行比较。基于预设的缺陷识别条件，从比较结果中提取衬底的缺陷。检查装置包括存储部，其中从一端到另一端的基板的范围内的区域的图像被累积;以及缺陷确定部，用于通过利用累积在存储部中的图像重复地确定缺陷在与预设缺陷确定条件不同的缺陷确定条件下。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009194124A Inspection method and inspection apparatus for circuit pattern 有权
标题翻译：电路图案的检查方法和检查装置
公开(公告)号：JP2009194124A
公开(公告)日：2009-08-27
申请号：JP2008032746
申请日：2008-02-14
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HAYAKAWA KOICHI , NOJIRI MASAAKI
IPC分类号： H01L21/66 , G01N23/225
CPC分类号： G01N21/956 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a means for reducing degradation in throughput even when the pixel size at the time of inspection must be reduced to deal with microfabrication of a circuit pattern. SOLUTION: The inspection method and the inspection apparatus acquire the images from signals generated by irradiating a charged particle beam onto a sample to be inspected 9 with a circuit pattern, and detect any deficiency in the circuit pattern from such images. The inspection apparatus employs a configuration wherein the inspection pixel size in the direction where the charged particle beam is scanned onto the sample to be inspected 9 and the inspection pixel size in the traveling direction of stages 31, 32 and 33 that travel with the sample to be inspected placed thereon are separately set up for inspection. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使当检查时的像素尺寸必须减小以处理电路图案的微细加工时，提供用于降低吞吐量降低的手段。解决方案：检查方法和检查装置从通过用电路图案将带电粒子束照射到要检查的样品9产生的信号中获取图像，并且从这些图像检测电路图案的任何不足。检查装置采用将被检测的带电粒子束的方向上的检查像素尺寸和要检查的样品9的检查像素尺寸和行进方向的检查像素尺寸进行比较的结构，被检查放置在其上单独设置检查。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007003404A Circuit pattern inspection device 有权
标题翻译：电路图案检查装置
公开(公告)号：JP2007003404A
公开(公告)日：2007-01-11
申请号：JP2005185074
申请日：2005-06-24
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： NOJIRI MASAAKI , HAYAKAWA KOICHI , FUKUNAGA FUMIHIKO , OKAMURA MITSURU
IPC分类号： G01R31/302 , G01N23/225 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a circuit pattern inspection device made easy to use by improving a screen function and an inspection stripe position determining function when an inspection stripe position for a circuit pattern is assigned.
SOLUTION: The inspection stripe position is allowed to be assigned with respect to an inspection area. An actual inspection position and a position irradiated with an electron beam are also confirmed by displaying a position of an inspection stripe before inspection.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：当分配电路图案的检查条带位置时，提供通过改善屏幕功能和检查条带位置确定功能而易于使用的电路图案检查装置。
解决方案：允许检查条纹位置相对于检查区域分配。通过在检查前显示检查条的位置也可以确认实际检查位置和用电子束照射的位置。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2004340650A Circuit pattern inspection device 有权
公开(公告)号：JP2004340650A
公开(公告)日：2004-12-02
申请号：JP2003135261
申请日：2003-05-14
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： NARA YASUHIKO , NOJIRI MASAAKI , HAYAKAWA KOICHI , SHINADA HIROYUKI , HAGITA YUKIO
IPC分类号： G01N23/225 , G01R31/302 , H01J37/28 , H01L21/66
CPC分类号： H01J37/28 , H01J2237/004 , H01J2237/2817
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit pattern inspection device using an electron beam for arbitrarily controlling the electrified state of a substrate under inspection. SOLUTION: In this circuit pattern inspection device, an electron beam is radiated to the surface of the substrate having a plurality of chips on each of which a circuit pattern is formed, signals generated from the substrate by the irradiation are detected and imaged, and the image is compared with another image to detect defects on the circuit patterns. A condition setting means is provided for setting inspection conditions so that an electron beams is previously radiated to an irradiation area prior to radiating the electron beam to a chip or a plurality of chips to acquire an image for inspection. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2011022100A Substrate inspection device, and method for acquiring defect distribution on substrate in the substrate inspection device 审中-公开
标题翻译：基板检查装置以及用于在基板检查装置中的基板上获取缺陷分布的方法
公开(公告)号：JP2011022100A
公开(公告)日：2011-02-03
申请号：JP2009169680
申请日：2009-07-21
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： HAYAKAWA KOICHI , NOJIRI MASAAKI , FUKUNAGA FUMIHIKO
IPC分类号： G01N21/956 , G01N23/225 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of acquiring a defect distribution on the whole surface of the substrate in early stages, even when overflow of a memory storing defect images occurs, and to provide a method for acquiring the defect distribution on the substrate in the substrate inspection device.
SOLUTION: A substrate image is acquired, and a pixel having a difference is extracted by image comparison. When a signal quantity of a pixel exceeds a threshold set beforehand, the pixel is determined to be a defect candidate, and a coordinate of a representative pixel of the defect candidate is stored in a storage device. When a capacity of the storage device overflows, or before the overflow, a value of the threshold is changed to continue determination of the defect candidate, and the defect distribution on the substrate is displayed on a display.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使在存储缺陷图像的存储器的溢出发生时，提供能够在早期阶段获得基板的整个表面上的缺陷分布的基板检查装置，并且提供一种用于获取在基板检查装置中的基板上的缺陷分布。解决方案：获取衬底图像，并且通过图像比较提取具有差异的像素。当像素的信号量超过预先设定的阈值时，将像素确定为缺陷候选，并将缺陷候选的代表像素的坐标存储在存储装置中。当存储装置的容量溢出或溢出之前，阈值的值被改变以继续确定缺陷候选，并且在显示器上显示衬底上的缺陷分布。版权所有（C）2011，JPO＆INPIT

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