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    • 1. 发明专利
    • Charged particle beam device and sample observation method
    • 充电颗粒光束装置和样品观测方法
    • JP2014143031A
    • 2014-08-07
    • JP2013009725
    • 2013-01-23
    • Hitachi High-Technologies Corp株式会社日立ハイテクノロジーズ
    • SAKAI TSUNEHIROFUNAKOSHI TOMOHIROTAMORI TOMOHIRODOI AYUMI
    • H01J37/21H01J37/28H01L21/66
    • PROBLEM TO BE SOLVED: To solve such a problem that although there is a technique for observing the pattern shapes of the bottom and the lower layer of a hole or a trench by increasing the acceleration voltage, the pattern of a layer of different focal position is detected erroneously because the pattern is seen through down to the lower layer when a sample of multilayer film is observed under high speed conditions, and it may be impossible to focus an object layer, and thereby it is necessary to focus a captured layer stably in the observation of high acceleration voltage.SOLUTION: A focal position on the sample surface is determined under first acceleration voltage conditions, and a focal position under second acceleration voltage conditions higher than the first acceleration voltage conditions is determined by adding a predetermined offset amount to the focal position.
    • 要解决的问题为了解决这样的问题,虽然存在通过增加加速电压来观察孔或沟槽的底层和下层的图案形状的技术,但是不同焦点位置的层的图案是 由于在高速条件下观察多层膜的样品时,通过向下看到图案,因此可能会错误地检测到,因此可能不可能聚焦目标层,因此需要将俘获层稳定地聚焦在 观察高加速电压。解决方案:在第一加速电压条件下确定样品表面上的焦点位置,并且通过向焦点添加预定的偏移量来确定在高于第一加速电压条件的第二加速电压条件下的焦点位置 位置。
    • 2. 发明专利
    • Charged particle beam device and sample preparation method
    • 充电颗粒光束装置和样品制备方法
    • JP2013246001A
    • 2013-12-09
    • JP2012118780
    • 2012-05-24
    • Hitachi High-Technologies Corp株式会社日立ハイテクノロジーズ
    • TAMORI TOMOHIROENDO FUMIAKI
    • G01N1/28H01J37/28
    • PROBLEM TO BE SOLVED: To solve problems which happen, when performing an impression marking on the periphery of a defect: when a film thickness of the outermost surface film of a sample is thin, its periphery is split to generate a foreign object or to view the defect with difficulty; and when an impression is impressed small not to split the periphery, the impression is too small to be viewed.SOLUTION: A marking suitable for a film thickness is performed by changing conditions of an impression marking such as a load and a depth of an indenter and the like on the basis of a film thickness measurement result measured by a film thickness meter. If a film thickness is thin and accordingly the size of an impression is made to be small and therefore the impression is viewed with difficulty, the number of impressions is increased to improve visibility.
    • 要解决的问题:为了解决在缺陷的周围进行印模标记时发生的问题:当样品的最外表面膜的膜厚度薄时,其外围被分割以产生异物或观察 缺点有困难; 并且当印模较小而不会分裂周边时,印模太小而不能被看到。解决方案:通过改变诸如载荷和压头深度的印痕标记的条件来进行适合于膜厚度的标记 基于由薄膜厚度计测量的薄膜厚度测量结果等。 如果胶片厚度较薄,因此使印象的尺寸变小,因此难以看出印象,增加曝光次数以提高可见度。
    • 3. 发明专利
    • Inspecting apparatus of substrate, and inspecting method of substrate
    • 检查基板的检查装置和检查基板的方法
    • JP2010080565A
    • 2010-04-08
    • JP2008245108
    • 2008-09-25
    • Hitachi High-Technologies Corp株式会社日立ハイテクノロジーズ
    • HAYAKAWA KOICHINOJIRI MASAAKIFUKUNAGA FUMIHIKOTAMORI TOMOHIRO
    • H01L21/66G01N23/225
    • PROBLEM TO BE SOLVED: To provide an inspecting apparatus of a substrate and an inspecting method of a substrate, for determining inspection conditions without repeatedly radiating electron ray to the same inspection region.
      SOLUTION: The electron ray is radiated to a substrate where a circuit pattern is formed and a generated secondary electron is detected. The detected signal is made into an image and is stored. The stored image is compared with a second image formed from the other identical circuit pattern. Based on a preset defect discrimination condition, a defect of the substrate is extracted from the comparison result. The inspecting apparatus includes a storage part in which an image of the region within a range of a substrate, from one end to the other end, is accumulated, and a defect determination part for repeatedly determining defects by utilizing the image accumulated in the storage part under a defect determination condition different from the preset defect determination condition.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供基板的检查装置和基板的检查方法,用于确定检查条件而不向相同的检查区域反复辐射电子射线。 解决方案:将电子射线照射到形成电路图案的基板上,并检测所产生的二次电子。 将检测到的信号制成图像并被存储。 将存储的图像与由另一相同电路图案形成的第二图像进行比较。 基于预设的缺陷识别条件,从比较结果中提取衬底的缺陷。 检查装置包括存储部,其中从一端到另一端的基板的范围内的区域的图像被累积;以及缺陷确定部,用于通过利用累积在存储部中的图像重复地确定缺陷 在与预设缺陷确定条件不同的缺陷确定条件下。 版权所有(C)2010,JPO&INPIT