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1. 发明专利

JP2014129521A Modified siloxane compound, thermosetting resin composition, prepreg, resin-clad film, laminate sheet, multilayer printed wiring board, and semiconductor package 审中-公开
标题翻译：改性硅氧烷化合物，热固性树脂组合物，PREPREG，树脂膜，层压板，多层印刷线路板和半导体封装
公开(公告)号：JP2014129521A
公开(公告)日：2014-07-10
申请号：JP2013246496
申请日：2013-11-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , ABE SHINICHIRO , MIYATAKE MASATO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G73/00 , B32B5/28 , B32B27/00 , C08G77/388 , C08K3/00 , C08K5/3415 , C08L21/00 , C08L63/00 , C08L83/04 , H01L23/14 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a modified siloxane compound possessing an azomethine group; and a thermosetting resin composition, a prepreg, a resin-clad film, a laminate sheet, a multilayer printed wiring board, and a semiconductor package each including the same.SOLUTION: The provided modified siloxane compound possessing, within the molecule structure thereof, an azomethine group is obtained by reacting a siloxane compound whose molecule terminal possesses at least two amino groups with an aromatic aldehyde compound possessing at least two intramolecular aldehyde groups; a thermosetting resin composition, a prepreg, a resin-clad film, a laminate sheet, a multilayer printed wiring board, and a semiconductor package each including the same are also provided.
摘要翻译：要解决的问题：提供具有偶氮甲碱基团的改性硅氧烷化合物; 以及热固性树脂组合物，预浸料坯，树脂包覆膜，层压片，多层印刷线路板和包含该组合物的半导体封装。溶液：所提供的改性硅氧烷化合物在其分子结构内具有通过使分子末端具有至少两个氨基的硅氧烷化合物与具有至少两个分子内醛基的芳族醛化合物反应获得偶氮甲碱基; 还提供了包含它们的热固性树脂组合物，预浸料，树脂包覆膜，层压片，多层印刷线路板和半导体封装。

2. 发明专利

JP2014084452A Thermosetting resin composition, prepreg, laminate and printed wiring board 有权
标题翻译：热固性树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2014084452A
公开(公告)日：2014-05-12
申请号：JP2012237313
申请日：2012-10-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KATO IKUHIKO , KOTAKE TOMOHIKO , UCHIMURA RYOICHI , NAKAMURA YUKIO , OZE MASAHISA
IPC分类号： C08L35/00 , C08J5/24 , C08L83/04 , C08L101/02 , C09D7/47 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board which are excellent in heat resistance, a thermal expansion coefficient, surface smoothness and warp reduction.SOLUTION: A thermosetting resin composition contains (A) a maleimide compound having at least two N-substitution maleimide groups in one molecular structure, (B) a silicone compound having at least one reactant organic group in one molecular structure and (C) a leveling agent. A prepreg, a laminate and a printed wiring board are obtained using the thermosetting resin composition.
摘要翻译：要解决的问题：提供耐热性，热膨胀系数，表面光滑度和翘曲减少性优异的热固性树脂组合物，预浸料坯，层压板和印刷线路板。热固性树脂组合物含有（A ）具有一个分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物，（B）在一个分子结构中具有至少一个反应性有机基团的硅氧烷化合物和（C）流平剂。使用热固性树脂组合物获得预浸料，层压体和印刷线路板。

3. 发明专利

JP2014019795A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2014019795A
公开(公告)日：2014-02-03
申请号：JP2012160039
申请日：2012-07-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G59/50 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: A thermosetting resin containing (a) an epoxy resin having a naphthalene skeleton, (b) a silicone compound having amine groups at both ends, (c) an amine compound having an acidic substituent and (d) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and a prepreg, a laminate and a printed wiring board using the same are provided.
摘要翻译：要解决的问题：提供低热膨胀和耐去污性优异的热固性树脂组合物，以及预浸料，层压体和使用其的印刷线路板。本发明提供一种热固性树脂，其含有（a）具有萘的环氧树脂骨架，（b）在两端具有胺基的硅氧烷化合物，（c）具有酸性取代基的胺化合物和（d）分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和预浸料，提供了层叠体和使用其的印刷线路板。

4. 发明专利

JP2014012751A Thermosetting resin composition, and prepreg, laminated sheet and printed wiring board including the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板，包括它们
公开(公告)号：JP2014012751A
公开(公告)日：2014-01-23
申请号：JP2012149847
申请日：2012-07-03
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NAGAI SHUNSUKE , MIYATAKE MASATO , KOTAKE TOMOHIKO , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08L83/08 , B32B5/28 , B32B27/00 , B32B27/20 , B32B27/34 , C08G59/56 , C08J5/24 , C08K3/00 , C08K5/13 , C08K5/3415 , C08L61/14 , C08L63/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in especially adhesive strength for copper foil, high chemical resistance, high thermal resistance and low thermal expansion; and a prepreg, a laminated sheet and a printed wiring board including the same.SOLUTION: There are provided a thermosetting resin composition comprising (a) a maleimide compound having at least two N-substituted maleimide groups in one molecular structure and (b) a silicone compound of an amine equivalent of 500 or more and 2,300 or less having at least one amino group in one molecular structure; and a prepreg, a laminated sheet and a printed wiring board including the same.
摘要翻译：要解决的问题：提供一种特别优异的铜箔粘合强度，高耐化学性，高耐热性和低热膨胀性的树脂组合物; 以及预浸料，层叠片和包含该预浸料的层压片和印刷线路板。提供了一种热固性树脂组合物，其包含（a）在一个分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（b）在一个分子结构中具有至少一个氨基的胺当量为500以上至2,300以下的硅氧烷化合物; 以及预浸料，层压片和包括该预浸料的印刷线路板。

5. 发明专利

JP2013064136A Thermosetting resin composition, and prepreg, laminate plate and multilayer printed wiring board each obtained using the same 有权
标题翻译：热固性树脂组合物，和PREPREG，层压板和多层印刷线路板每个获得使用它
公开(公告)号：JP2013064136A
公开(公告)日：2013-04-11
申请号：JP2012239553
申请日：2012-10-30
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , TSUCHIKAWA SHINJI , TAKANEZAWA SHIN , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08L79/00 , B32B27/00 , C08J5/24 , C08K3/00 , C08K5/18 , C08K5/3445 , C08L87/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has excellent resin curing property, i.e., requires no process with a high temperature and a prolonged period of time upon laminating a prepreg, has excellent curing property and storage stability as a varnish and a prepreg, and is excellent in chemical resistance, heat resistance and adhessiveness, and to provide a prepreg, a laminate plate and a multilayer printed wiring board, each obtained using the resin composition.SOLUTION: The thermosetting resin composition comprises (A) a resin composition having an unsaturated maleimide group and produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule with (b) an amine compound having at least two primary amino groups per one molecule in an organic solvent, (B) a thermosetting resin (B), and (C) a modified imidazole compound such as an isocyanate-masked imidazole or an epoxy-masked imidazole.
摘要翻译：要解决的问题：提供一种具有优异的树脂固化性的热固性树脂组合物，即在层压预浸料时不需要高温和长时间的工艺，具有优异的固化性能和储存稳定性，如清漆和预浸料，并且具有优异的耐化学性，耐热性和粘合性，并且提供使用该树脂组合物获得的预浸料，层压板和多层印刷线路板。解决方案：热固性树脂组合物包含（A）具有不饱和马来酰亚胺基团的树脂组合物，其通过（a）每分子具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物与（b）胺化合物在有机溶剂中每分子具有至少两个伯氨基，（B）热固性树脂（B）和（C）改性的咪唑化合物如异氰酸酯掩蔽的咪唑或环氧屏蔽的咪唑。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2014040584A Thermosetting resin composition and prepreg, laminate sheet, and print wire board using the same 有权
标题翻译：使用相同的热固性树脂组合物和PREPREG，层压板和打印线
公开(公告)号：JP2014040584A
公开(公告)日：2014-03-06
申请号：JP2013153613
申请日：2013-07-24
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI HIKARI , NAKAMURA SHINYA
IPC分类号： C08G59/56 , B32B15/08 , B32B15/088 , B32B15/092 , B32B27/34 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in terms of glass transition point (Tg), low thermal expansion tendency, and low curing shrinkage and a prepreg, a laminate sheet, and a print wire board using the same.SOLUTION: The provided thermosetting resin composition is obtained by blending (a) an adduct of a tertiary phosphine and a quinone, (b) an amine compound having at least two intramolecular primary amino groups, (c) an amine compound having an acidic substituent, and (d) a maleimide compound having at least two intramolecular N-substituted maleimide groups; a prepreg, a laminate sheet, and a print wire board using the same are also provided.
摘要翻译：要解决的问题：提供一种玻璃化转变点（Tg），低热膨胀倾向和低固化收缩率的树脂组合物，预浸料，层压片和使用其的印刷线板。解决方案：提供的热固性树脂组合物通过（a）叔膦和醌的加合物，（b）具有至少两个分子内的氨基的胺化合物，（c）具有酸性取代基的胺化合物和（d ）具有至少两个分子内N-取代的马来酰亚胺基团的马来酰亚胺化合物; 还提供了预浸料，层压片和使用其的印刷线板。

7. 发明专利

JP2014015528A Prepreg and laminate sheet 审中-公开
标题翻译： PREPREG和层压板
公开(公告)号：JP2014015528A
公开(公告)日：2014-01-30
申请号：JP2012153535
申请日：2012-07-09
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： AOSHIMA MASAHIRO , KAMIGATA YASUO , KOTAKE TOMOHIKO , MIYATAKE MASATO , TAKAHASHI YOSHIHIRO
IPC分类号： C08J5/24 , C08K3/10 , C08K5/3415 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg and a laminate sheet showing a small reduction in the thermal conductivity when a glass fiber fabric is impregnated with a resin composition, and having low thermal expansion property.SOLUTION: The prepreg is obtained by impregnating and coating a glass fiber base material with a resin composition that comprises an epoxy resin having a specified structure as a thermosetting resin and a polyimide resin having a specified structure as a hardening agent. In the resin composition, the content of the epoxy resin having the specified structure is 30 to 50 mass%. The resin composition further contains an inorganic filler; the content of the inorganic filler is 30 to 70 vol% with respect to the whole resin composition; and the inorganic filler contains at least aluminum oxide.
摘要翻译：要解决的问题：提供一种当玻璃纤维织物浸渍有树脂组合物并且具有低热膨胀性能时，预浸料和层压片材显示出小的导热性降低。溶解性：预浸料通过浸渍和涂布获得具有树脂组合物的玻璃纤维基材，其包含具有特定结构的环氧树脂作为热固性树脂和具有特定结构的聚酰亚胺树脂作为硬化剂。树脂组合物中，具有规定结构的环氧树脂的含量为30〜50质量％。树脂组合物还含有无机填料; 无机填料的含量相对于整个树脂组合物为30〜70体积％无机填料至少含有氧化铝。

8. 发明专利

JP2013209671A Thermosetting resin composition, and prepreg and stacked plate, using the same 有权
标题翻译：使用相同的热固化树脂组合物和预制板和堆叠板
公开(公告)号：JP2013209671A
公开(公告)日：2013-10-10
申请号：JP2013138025
申请日：2013-07-01
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TSUCHIKAWA SHINJI , AKIYAMA MASANORI , KOTAKE TOMOHIKO
IPC分类号： C08L63/00 , B32B15/08 , C08J5/24 , C08K5/31 , C08K5/3415 , C08K5/5313
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a balance in metal foil adhesion, heat resistance, moisture resistance, flame retardancy, heat resistance with metals, specific dielectric constant, and dielectric tangent, and a prepreg using the same and a stacked plate.SOLUTION: A thermosetting resin composition includes (A) a metal salt of a two-substituted phosphinic acid, (B) a maleimide compound having an N-substituted maleimide group in the molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin that contains at least two epoxy groups in one molecule. There are provided a prepreg and a stacked plate, using the composition.
摘要翻译：要解决的问题：提供一种在金属箔粘附性，耐热性，耐湿性，阻燃性，金属耐热性，比介电常数和介电切线方面具有平衡性的热固性树脂组合物，以及使用该热固性树脂组合物的叠层体热固性树脂组合物包含（A）二取代次膦酸的金属盐，（B）分子中具有N-取代的马来酰亚胺基的马来酰亚胺化合物，（C）6-取代的胍胺化合物或双氰胺和（D）在一个分子中含有至少两个环氧基的环氧树脂。提供了使用该组合物的预浸料和堆叠板。

9. 发明专利

JP2014111696A Thermosetting resin composition, prepreg using the same, laminate, and multilayer printed wiring board 有权
标题翻译：热固性树脂组合物，使用它的PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2014111696A
公开(公告)日：2014-06-19
申请号：JP2012266667
申请日：2012-12-05
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G59/00 , C08K3/00 , C08K5/17 , C08K5/20 , C08L35/00 , C08L79/04
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition particularly excellent in surface smoothness and warpage reduction, a prepreg using the same, a laminate, and a multilayer printed wiring board.SOLUTION: There are provided: the thermosetting resin composition containing (A) at least one thermosetting resin selected from an epoxy resin and a cyanate resin, (B) a maleimide compound having at least two N-substituted maleimide groups in one molecule, (C) an amine compound having at least two primary amino groups in one molecule, (D) a monoamine compound having an acidic substituent, and (E) a rheology control agent; the prepreg using the thermosetting resin composition; the laminate; and the multilayer printed wiring board.
摘要翻译：要解决的问题：提供特别优异的表面光滑度和翘曲降低的热固性树脂组合物，使用该热固性树脂组合物的预浸料，层压体和多层印刷线路板。提供：含有（A）至少一种选自环氧树脂和氰酸酯树脂的热固性树脂，（B）在一个分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物，（C）在一个分子中具有至少两个伯氨基的胺化合物，（D）具有酸性取代基的单胺化合物，和（E）流变控制剂; 使用热固性树脂组合物的预浸料; 层压板和多层印刷线路板。

10. 发明专利

JP2014024926A Thermosetting resin composition and prepreg, laminate sheet, and multilayer printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板以及使用其的多层印刷线路板
公开(公告)号：JP2014024926A
公开(公告)日：2014-02-06
申请号：JP2012165178
申请日：2012-07-25
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , NAGAI SHUNSUKE , MIYATAKE MASATO , HASHIMOTO SHINTARO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08L83/14 , C08G59/50 , C08G73/12 , C08G77/54 , C08J5/24 , C08K3/00 , C08L21/00 , C08L63/00 , C08L79/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition and a prepreg, a laminate sheet, and a printed wiring board using the same.SOLUTION: This thermosetting resin composition includes a thermoplastic elastomer, and a modified silicone compound obtained by reacting a siloxane diamine expressed by a specified chemical formula, a maleimide compound having at least two unsaturated N-substituted maleimide groups within the molecule structure thereof, and an amine compound having an acidic substituent. A prepreg, a laminate sheet, and a printed wiring board using the thermosetting resin composition are also provided.
摘要翻译：要解决的问题：提供热固性树脂组合物和预浸料，层压片和使用其的印刷线路板。溶解性：该热固性树脂组合物包括热塑性弹性体和通过使硅氧烷二胺由指定的化学式表示，在其分子结构内具有至少两个不饱和N-取代的马来酰亚胺基团的马来酰亚胺化合物和具有酸性取代基的胺化合物。还提供了预浸料，层压片和使用该热固性树脂组合物的印刷线路板。

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