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1. 发明专利

JP2014024927A Prepreg, laminate and multilayer printed wiring board using the same 有权
标题翻译： PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2014024927A
公开(公告)日：2014-02-06
申请号：JP2012165179
申请日：2012-07-25
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08J5/24 , B32B15/08 , B32B15/088 , C08K3/00 , C08K5/17 , C08K5/18 , C08K5/3415 , C08L83/08 , C08L101/00 , C08L101/12 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a prepreg excellent in low thermal expansion and warpage property which are difficult to achieve only with conventional high charge of an inorganic filler or a low thermal expansion resin, and to provide a laminate and a multilayer printed wiring board using the same.SOLUTION: A prepreg contains a synthetic fiber substrate and a thermosetting resin composition, and a layer of the thermosetting resin composition contains a maleimide compound, a siloxane diamine and an amine compound containing an acidic substituent.
摘要翻译：要解决的问题：为了提供低热膨胀和翘曲性优异的预浸料，其难以仅通过常规高填充无机填料或低热膨胀树脂而实现，并且提供层压体和多层印刷线路板，其使用相同。解决方案：预浸料包含合成纤维基材和热固性树脂组合物，并且热固性树脂组合物层含有马来酰亚胺化合物，硅氧烷二胺和含有酸性取代基的胺化合物。

2. 发明专利

JP2014019796A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2014019796A
公开(公告)日：2014-02-03
申请号：JP2012160040
申请日：2012-07-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G59/56 , C08J5/24 , C08K3/00 , C08L63/00 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: A thermosetting resin containing (a) an epoxy resin having a naphthalene skeleton, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and a phenoxy group, (c) a silicone compound having a primary amino group, and (d) an amine compound having an acidic substituent, and a prepreg, a laminate and a printed wiring board using the same are provided.
摘要翻译：要解决的问题：提供低热膨胀和耐去粘性优异的树脂组合物，以及预浸料，层压体和使用其的印刷线路板。溶解性：一种含有（a）具有萘骨架的环氧树脂的热固性树脂，（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团和苯氧基的马来酰亚胺化合物，（c）具有伯氨基的硅氧烷化合物，和（d）具有酸性取代基的胺化合物，以及提供了预浸料，层压板和使用其的印刷布线板。

3. 发明专利

JP2013071940A Prepreg for printed circuit board, laminated board and printed circuit board 有权
标题翻译：印刷电路板，层压板和印刷电路板
公开(公告)号：JP2013071940A
公开(公告)日：2013-04-22
申请号：JP2011209668
申请日：2011-09-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA , UCHIMURA RYOICHI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a laminated board in which good impregnating ability of a resin and good adhesion of the resin to glass cloth are achieved and which has a low thermal expansion coefficient, excellent heat resistance and insulation reliability, and to provide a printed circuit board.SOLUTION: A thermosetting resin composition comprising a resin (A) having unsaturated maleimide groups produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups per molecule with an amine compound (b) having at least two primary amino groups per molecule in an organic solvent and a thermosetting resin (B) is impregnated into glass cloth having a thermal expansion coefficient of ≤5 ppm/°C treated with a phenylaminosilane treating agent represented by general formula (I), and drying by heating and B-staging are performed to obtain a prepreg for a printed circuit board. The laminated board and the printed circuit board are also provided. In the formula, R is 1-5C alkylene, and X is independently OCH, OCHor OCH.
摘要翻译：要解决的问题：提供一种树脂的良好浸渍能力和树脂对玻璃布具有良好粘附性并且具有低热膨胀系数，优异的耐热性和绝缘可靠性的层压板，以及提供印刷电路板。解决方案：一种热固性树脂组合物，其包含具有不饱和马来酰亚胺基团的树脂（A），其通过使每分子具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与具有至少两个将有机溶剂中的每分子的伯氨基和热固性树脂（B）浸渍到用通式（I）表示的苯基氨基硅烷处理剂处理的热膨胀系数≤5ppm/℃的玻璃布中，并通过进行加热和B阶分级以获得用于印刷电路板的预浸料。还提供了层压板和印刷电路板。在该式中，R为1-5C亚烷基，X独立地为OCH 3，SB SB =“POST”> 2 5 或OC 3 H 7 。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2014210936A 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法审中-公开
标题翻译：树脂组合物，树脂固化产品，接线板和制造接线板的方法
公开(公告)号：JP2014210936A
公开(公告)日：2014-11-13
申请号：JP2014158915
申请日：2014-08-04
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： NAKAMURA KONATSU , MORITA MASAKI , TAKANEZAWA SHIN , MURAI HIKARI , NAKANO HIROSHI , SUZUKI HITOSHI , AMO SATORU
IPC分类号： C08G59/18 , B32B27/38
CPC分类号： B32B27/38 , C08G59/18
摘要：【課題】絶縁樹脂層表面の凹凸形状が小さい状態でも、配線導体に対して容易に高い接着力を発現し得る絶縁樹脂、配線板及び配線板の製造方法を提供する。【解決手段】(A)1分子中に2個以上のエポキシ基を有するエポキシ樹脂、(B)紫外線活性型エステル基含有化合物、(C)イソシアネートシラン、及び(D)エポキシ樹脂硬化促進剤を含む樹脂組成物である。【選択図】なし
摘要翻译：要解决的问题：即使当绝缘树脂层的表面上的不均匀形状小时，也可以提供一种绝缘树脂，布线板以及用于制造布线板的方法，其可以容易地对布线导体显示出高的粘合强度。：树脂组合物含有（A）一分子中具有两个以上环氧基的环氧树脂，（B）含有紫外线活性型酯基的化合物，（C）异氰酸酯硅烷，（D）环氧树脂固化促进剂。

5. 发明专利

JP2014129521A Modified siloxane compound, thermosetting resin composition, prepreg, resin-clad film, laminate sheet, multilayer printed wiring board, and semiconductor package 审中-公开
标题翻译：改性硅氧烷化合物，热固性树脂组合物，PREPREG，树脂膜，层压板，多层印刷线路板和半导体封装
公开(公告)号：JP2014129521A
公开(公告)日：2014-07-10
申请号：JP2013246496
申请日：2013-11-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , ABE SHINICHIRO , MIYATAKE MASATO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G73/00 , B32B5/28 , B32B27/00 , C08G77/388 , C08K3/00 , C08K5/3415 , C08L21/00 , C08L63/00 , C08L83/04 , H01L23/14 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a modified siloxane compound possessing an azomethine group; and a thermosetting resin composition, a prepreg, a resin-clad film, a laminate sheet, a multilayer printed wiring board, and a semiconductor package each including the same.SOLUTION: The provided modified siloxane compound possessing, within the molecule structure thereof, an azomethine group is obtained by reacting a siloxane compound whose molecule terminal possesses at least two amino groups with an aromatic aldehyde compound possessing at least two intramolecular aldehyde groups; a thermosetting resin composition, a prepreg, a resin-clad film, a laminate sheet, a multilayer printed wiring board, and a semiconductor package each including the same are also provided.
摘要翻译：要解决的问题：提供具有偶氮甲碱基团的改性硅氧烷化合物; 以及热固性树脂组合物，预浸料坯，树脂包覆膜，层压片，多层印刷线路板和包含该组合物的半导体封装。溶液：所提供的改性硅氧烷化合物在其分子结构内具有通过使分子末端具有至少两个氨基的硅氧烷化合物与具有至少两个分子内醛基的芳族醛化合物反应获得偶氮甲碱基; 还提供了包含它们的热固性树脂组合物，预浸料，树脂包覆膜，层压片，多层印刷线路板和半导体封装。

6. 发明专利

JP2014019795A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2014019795A
公开(公告)日：2014-02-03
申请号：JP2012160039
申请日：2012-07-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G59/50 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: A thermosetting resin containing (a) an epoxy resin having a naphthalene skeleton, (b) a silicone compound having amine groups at both ends, (c) an amine compound having an acidic substituent and (d) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and a prepreg, a laminate and a printed wiring board using the same are provided.
摘要翻译：要解决的问题：提供低热膨胀和耐去污性优异的热固性树脂组合物，以及预浸料，层压体和使用其的印刷线路板。本发明提供一种热固性树脂，其含有（a）具有萘的环氧树脂骨架，（b）在两端具有胺基的硅氧烷化合物，（c）具有酸性取代基的胺化合物和（d）分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和预浸料，提供了层叠体和使用其的印刷线路板。

7. 发明专利

JP2014012751A Thermosetting resin composition, and prepreg, laminated sheet and printed wiring board including the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板，包括它们
公开(公告)号：JP2014012751A
公开(公告)日：2014-01-23
申请号：JP2012149847
申请日：2012-07-03
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NAGAI SHUNSUKE , MIYATAKE MASATO , KOTAKE TOMOHIKO , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08L83/08 , B32B5/28 , B32B27/00 , B32B27/20 , B32B27/34 , C08G59/56 , C08J5/24 , C08K3/00 , C08K5/13 , C08K5/3415 , C08L61/14 , C08L63/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in especially adhesive strength for copper foil, high chemical resistance, high thermal resistance and low thermal expansion; and a prepreg, a laminated sheet and a printed wiring board including the same.SOLUTION: There are provided a thermosetting resin composition comprising (a) a maleimide compound having at least two N-substituted maleimide groups in one molecular structure and (b) a silicone compound of an amine equivalent of 500 or more and 2,300 or less having at least one amino group in one molecular structure; and a prepreg, a laminated sheet and a printed wiring board including the same.
摘要翻译：要解决的问题：提供一种特别优异的铜箔粘合强度，高耐化学性，高耐热性和低热膨胀性的树脂组合物; 以及预浸料，层叠片和包含该预浸料的层压片和印刷线路板。提供了一种热固性树脂组合物，其包含（a）在一个分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（b）在一个分子结构中具有至少一个氨基的胺当量为500以上至2,300以下的硅氧烷化合物; 以及预浸料，层压片和包括该预浸料的印刷线路板。

8. 发明专利

JP2013064136A Thermosetting resin composition, and prepreg, laminate plate and multilayer printed wiring board each obtained using the same 有权
标题翻译：热固性树脂组合物，和PREPREG，层压板和多层印刷线路板每个获得使用它
公开(公告)号：JP2013064136A
公开(公告)日：2013-04-11
申请号：JP2012239553
申请日：2012-10-30
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , TSUCHIKAWA SHINJI , TAKANEZAWA SHIN , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08L79/00 , B32B27/00 , C08J5/24 , C08K3/00 , C08K5/18 , C08K5/3445 , C08L87/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has excellent resin curing property, i.e., requires no process with a high temperature and a prolonged period of time upon laminating a prepreg, has excellent curing property and storage stability as a varnish and a prepreg, and is excellent in chemical resistance, heat resistance and adhessiveness, and to provide a prepreg, a laminate plate and a multilayer printed wiring board, each obtained using the resin composition.SOLUTION: The thermosetting resin composition comprises (A) a resin composition having an unsaturated maleimide group and produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule with (b) an amine compound having at least two primary amino groups per one molecule in an organic solvent, (B) a thermosetting resin (B), and (C) a modified imidazole compound such as an isocyanate-masked imidazole or an epoxy-masked imidazole.
摘要翻译：要解决的问题：提供一种具有优异的树脂固化性的热固性树脂组合物，即在层压预浸料时不需要高温和长时间的工艺，具有优异的固化性能和储存稳定性，如清漆和预浸料，并且具有优异的耐化学性，耐热性和粘合性，并且提供使用该树脂组合物获得的预浸料，层压板和多层印刷线路板。解决方案：热固性树脂组合物包含（A）具有不饱和马来酰亚胺基团的树脂组合物，其通过（a）每分子具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物与（b）胺化合物在有机溶剂中每分子具有至少两个伯氨基，（B）热固性树脂（B）和（C）改性的咪唑化合物如异氰酸酯掩蔽的咪唑或环氧屏蔽的咪唑。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2014040584A Thermosetting resin composition and prepreg, laminate sheet, and print wire board using the same 有权
标题翻译：使用相同的热固性树脂组合物和PREPREG，层压板和打印线
公开(公告)号：JP2014040584A
公开(公告)日：2014-03-06
申请号：JP2013153613
申请日：2013-07-24
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HASHIMOTO SHINTARO , MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI HIKARI , NAKAMURA SHINYA
IPC分类号： C08G59/56 , B32B15/08 , B32B15/088 , B32B15/092 , B32B27/34 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in terms of glass transition point (Tg), low thermal expansion tendency, and low curing shrinkage and a prepreg, a laminate sheet, and a print wire board using the same.SOLUTION: The provided thermosetting resin composition is obtained by blending (a) an adduct of a tertiary phosphine and a quinone, (b) an amine compound having at least two intramolecular primary amino groups, (c) an amine compound having an acidic substituent, and (d) a maleimide compound having at least two intramolecular N-substituted maleimide groups; a prepreg, a laminate sheet, and a print wire board using the same are also provided.
摘要翻译：要解决的问题：提供一种玻璃化转变点（Tg），低热膨胀倾向和低固化收缩率的树脂组合物，预浸料，层压片和使用其的印刷线板。解决方案：提供的热固性树脂组合物通过（a）叔膦和醌的加合物，（b）具有至少两个分子内的氨基的胺化合物，（c）具有酸性取代基的胺化合物和（d ）具有至少两个分子内N-取代的马来酰亚胺基团的马来酰亚胺化合物; 还提供了预浸料，层压片和使用其的印刷线板。

10. 发明专利

JP2013163719A Low thermally-expandable resin composition, prepreg, laminate, and wiring board 有权
标题翻译：低热膨胀树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2013163719A
公开(公告)日：2013-08-22
申请号：JP2012026519
申请日：2012-02-09
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , MURAI AKIRA , TAKANEZAWA SHIN , INOUE YASUO
IPC分类号： C08G59/44 , B32B15/08 , B32B15/092 , C08J5/24 , C08K5/16 , C08K5/5313 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board especially excellent in low thermal expansion without the need of high filling of an inorganic filler or enhanced crosslink density of the resin composition; and a prepreg, a laminate, and a wiring board using the same.SOLUTION: A low thermally-expandable resin composition includes an epoxy resin (A) having polycyclic structure, a phosphorus compound (B) represented by chemical formula (I), and dicyandiamide (C), wherein an epoxy resin (E1), which is obtained when 0.005-0.05 mol of the phosphorus compound (B) represented by chemical formula (I) is blended or preliminary reacted with 1 mol of an epoxy group of the epoxy resin (A) having polycyclic structure, is contained.
摘要翻译：要解决的问题：提供一种特别优异的低热膨胀性的印刷线路板用树脂组合物，而不需要高填充无机填料或提高树脂组合物的交联密度; 以及预浸料，层叠体和使用其的布线基板。低热膨胀性树脂组合物包括具有多环结构的环氧树脂（A），由化学式（I）表示的磷化合物（B）和双氰胺（C），其中当化学式（I）表示的0.005〜0.05摩尔的磷化合物（B）与1摩尔环氧基的环氧基共混时，得到的环氧树脂（E1）含有多环结构的树脂（A）。

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