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1. 发明专利

JP2006010437A Liquid leakage preventive tool for microchip, and microchip holder 审中-公开
标题翻译： MICROCHIP和MICROCHIP HOLDER液体防漏工具
公开(公告)号：JP2006010437A
公开(公告)日：2006-01-12
申请号：JP2004186303
申请日：2004-06-24
申请人： Hiroyuki Kishi , Richell Corp , 裕幸岸 , 株式会社リッチェル
发明人： KISHI HIROYUKI , YAMASHITA KAZUYUKI
IPC分类号： G01N35/04
摘要： PROBLEM TO BE SOLVED: To provide a microchip holder and a liquid leakage preventive tool for a microchip having excellent X-Y-directional and Z-directional (vertical-directional) positioning characteristics for the microchip such as a cell chip, capable of immobilizing easily the cell chip, capable of preventing easily a testing liquid from being leaked, and capable of setting a using amount of the testing liquid to the minimum.
SOLUTION: A chip storage part for positioning the microchip is formed in a holder base member, and the liquid leakage preventive tool is provided to fix the microchip attached to the chip storage part while pressing from its upper side. A seal part is preferably formed between a surface of the microchip and the liquid leakage preventive tool to put the testing liquid for use in an opening part of the liquid leakage preventive tool.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决方案：为了提供一种用于微芯片的微芯片保持器和防漏液工具，该微芯片具有优异的XY方向和Z方向（垂直方向）定位特性，用于诸如电池芯片的微芯片，能够固定容易地使细胞芯片容易地防止测试液体泄漏，并且能够将测试液体的使用量设定为最小。解决方案：用于定位微芯片的芯片存储部分形成在保持器基部构件中，并且设置防漏液工具以在从其上侧按压的同时固定安装在芯片存储部分上的微芯片。优选地，在微芯片的表面和防漏液工具之间形成密封部分，以将用于防漏液工具的开口部分的测试液体放置。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007276409A Insert molded article 有权
标题翻译： INSERT MOLDED ARTICLE
公开(公告)号：JP2007276409A
公开(公告)日：2007-10-25
申请号：JP2006109214
申请日：2006-04-11
申请人： Richell Corp , 株式会社リッチェル
发明人： YAMASHITA KAZUYUKI
IPC分类号： B29C45/14 , B29C33/12 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide an insert molded article in which a thin or fragile substrate such as a microchip is inserted by insert-molding.
SOLUTION: The insert molded article is provided with a thin substrate having a thickness of 10 μm-2.0 mm and a resin base member. The substrate is inserted into the base member by insert-molding. At least one part of the surface of the substrate is exposed outside and the back face is concealed. The substrate is made of a resin curable by light or heat or of a fragile silicon wafer, glass or ceramic.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种嵌入成型制品，其中通过嵌入成型将诸如微芯片的薄的或易碎的衬底插入其中。解决方案：插入成型制品设置有厚度为10μm-2.0mm的薄基材和树脂基材。通过嵌入成型将基板插入基座部件。衬底的表面的至少一部分暴露在外面，并且背面被隐藏。基板由可通过光或热固化的树脂或易碎的硅晶片，玻璃或陶瓷制成。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006181740A Adhesion-bondable structure 有权
标题翻译：粘结粘结结构
公开(公告)号：JP2006181740A
公开(公告)日：2006-07-13
申请号：JP2004375047
申请日：2004-12-24
申请人： Richell Corp , Toyama Prefecture , 富山県 , 株式会社リッチェル
发明人： YAMASHITA KAZUYUKI , ONAGA TAKASHI
IPC分类号： B29C65/02 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesion-bondable structure which can be easily and closely bonded without using an adhesive (including a pressure-sensitive adhesive) and can keep the recessed shape of the bonded surface as it is, and an adapted product thereof.
SOLUTION: The adhesion-bondable structure comprises at least two injection-molded products which are composed of the same kind of a composition or a different kind of compositions and injection-molded using a resin composition which contains at least two kinds of synthetic resin components and of which the transparency is not lowered as compared with a resin composition comprising only one synthetic resin component lowest in transparency even if mixed. Each of the injection-molded products is characterized in that its degree of crystallization is 50% or below and the difference between the melting point of the crystal region and the glass transition temperature of a continuous phase is 50°C or above, at least regions ready to be bonded have smooth surfaces and are bonded through the smooth surfaces without using an adhesive.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以在不使用粘合剂（包括压敏粘合剂）的情况下容易且紧密地粘合并且可以保持接合表面的凹陷形状的可粘合结合结构，并且其适应产品。粘合性结构包括至少两种注射成型产品，其由相同种类的组合物或不同种类的组合物组成，并使用含有至少两种合成的树脂组合物注射成型与仅包含一种低透明度的合成树脂组分的树脂组合物相比，其透明性不降低。各注塑成型品的结晶度为50％以下，结晶区域的熔点与连续相的玻璃化转变温度之间的差为50℃以上，至少为区域准备粘合的表面光滑，并且通过光滑的表面粘合而不使用粘合剂。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005023148A Polypropylene-based resin composition for injection molding and injection-molded product using the composition 审中-公开
标题翻译：基于聚丙烯的树脂组合物，用于注塑成型和注塑成型产品
公开(公告)号：JP2005023148A
公开(公告)日：2005-01-27
申请号：JP2003188064
申请日：2003-06-30
申请人： Richell Corp , Toyama Prefecture , 富山県 , 株式会社リッチェル
发明人： ONAGA TAKASHI , YAMASHITA KAZUYUKI
IPC分类号： C08L23/10 , C08K3/00 , C08K5/00 , C08L53/00
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition for providing an injection-molded product comprising a crystalline polypropylene as a main component with transparency without reducing heat resistance and rigidity.
SOLUTION: The polypropylene-based resin composition for injection molding comprises a crystalline polypropylene having 5-65 g/10 minutes MFR (melt flow rate) under 2.16 kg load at 230°C, a nucleating agent and a polystyrene-based or polyolefin-based hydrogenated thermoplastic elastomer. The composition comprises a crystalline polypropylene, a nucleating agent and a polystyrene-based or polyolefin-based hydrogenated thermoplastic elastomer and has ≥100 MPa tensile modulus of molded product after injection molding.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得用于提供包含结晶聚丙烯作为主要成分的注塑产品的树脂组合物，其透明性不降低耐热性和刚性。解决方案：用于注射成型的聚丙烯基树脂组合物包括在230℃下2.16kg负荷下具有5-65g / 10分钟MFR（熔体流动速率）的结晶聚丙烯，成核剂和基于聚苯乙烯的或聚烯烃系氢化热塑性弹性体。该组合物包含结晶聚丙烯，成核剂和基于聚苯乙烯或聚烯烃的氢化热塑性弹性体，并且在注射成型后具有≥100MPa的模制产品拉伸模量。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2010264446A Structure excellent in fluid flowing performance 审中-公开
标题翻译：流体性能优良的结构
公开(公告)号：JP2010264446A
公开(公告)日：2010-11-25
申请号：JP2010138737
申请日：2010-06-17
申请人： Richell Corp , Toyama Prefecture , 富山県 , 株式会社リッチェル
发明人： YAMASHITA KAZUYUKI , ONAGA TAKASHI
IPC分类号： B01J19/00 , B29C45/00 , B81B1/00 , C08L23/10 , C08L53/02 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a structure which can easily be adhesion joined without using a binder (containing an adhesive), also is excellent in an adhesion bondability in which a concave shape of a joining surface is maintained as it is, and then is excellent in flowing performance of a fluid when forming a passage.
SOLUTION: A content of a polypropylene based resin in a synthetic resin composition is 70-30 mass%, the content of a hydrogen addition derivative is 30-70 mass%, and the surface of the structure forms a microdomain without miscibility of a polymer block X with a PP phase to provide a structure in which a polymer block Y is miscible with an amorphous region part of the PP phase. As estimation of the flowing performance, a flowing tip of an ink is the concave shape when the ink is poured into the passage, flows in naturally in atmospheric pressure, and an injection molded product consisting of the synthetic resin composition is excellent in adhesion bondability (wherein, X is the polymer block immiscible with the polypropylene based resin, and Y is an elastomeric polymer block of a conjugate diene.).
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以容易地粘合而不使用粘合剂（含有粘合剂）的结构，粘接性优异，接合面的凹形维持原样也是优异的，然后在形成通道时流体的流动性能优异。解决方案：合成树脂组合物中的聚丙烯类树脂的含量为70〜30质量％，氢加成衍生物的含量为30〜70质量％，结构的表面形成微区，具有PP相的聚合物嵌段X，以提供聚合物嵌段Y与PP相的非晶区域部分混溶的结构。作为流动性的推测，当墨水流入通道中时，油墨的流动尖端为凹形，并且在大气压下自然流动，并且由合成树脂组合物组成的注塑产品具有优异的粘合能力（其中X是与聚丙烯基树脂不混溶的聚合物嵌段，Y是共轭二烯的弹性聚合物嵌段。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2008064652A Chip holder 有权
标题翻译：芯片支架
公开(公告)号：JP2008064652A
公开(公告)日：2008-03-21
申请号：JP2006243950
申请日：2006-09-08
申请人： Nano System Solutions:Kk , Richell Corp , Toyama Univ , Toyamaken Shinseiki Sangyo Kiko , 国立大学法人富山大学 , 株式会社ナノシステムソリューションズ , 株式会社リッチェル , 財団法人富山県新世紀産業機構
发明人： YAMASHITA KAZUYUKI , HONDA RITSU , KINO SATORU , NAKAZATO HIROKICHI
IPC分类号： G01N35/04 , G01N1/28
摘要： PROBLEM TO BE SOLVED: To provide a chip holder which heightens a rate of dispensing cells to microwells and a utilization factor of the cells and facilitates an operation of removing suspended cells.
SOLUTION: The chip holder with a plate-like body comprises a chip holding part for holding a chip on its one main surface, a substrate having a perimeter wall disposed at the perimeter of the chip holding part, an aperture, and a liquid leakage preventing frame which has a flexible skirt part projecting from the peripheral edge of the aperture toward the one main surface. The skirt part is made up such that its aperture area is smaller than the main surface of the chip which is held by the chip holder part. The liquid leakage preventing frame can be detachably attached to the perimeter wall, and when attached to the perimeter wall, the skirt part comes in a press contact with the main surface of the chip held by the chip holding part.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种芯片保持器，其将分配细胞的速率提高到微孔和细胞的利用率，并且促进去除悬浮细胞的操作。解决方案：具有板状主体的芯片保持器包括用于在其一个主表面上保持芯片的芯片保持部分，具有设置在芯片保持部分的周边的周边壁的基板，液体防漏框架具有从孔的周缘向一个主表面突出的柔性裙部。裙部被制成使得其开口面积小于由芯片保持器部分保持的芯片的主表面。防泄漏框架可以可拆卸地附接到周壁，并且当附接到周壁时，裙部与由芯片保持部保持的芯片的主表面压接。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2006192535A Microscopic part with macromolecular particulate as raw material and its manufacturing method 审中-公开
标题翻译：具有大分子颗粒的微晶部分作为原料及其制造方法
公开(公告)号：JP2006192535A
公开(公告)日：2006-07-27
申请号：JP2005007358
申请日：2005-01-14
申请人： Richell Corp , Toyama Prefecture , 富山県 , 株式会社リッチェル
发明人： ONAGA TAKASHI , YAMASHITA KAZUYUKI
IPC分类号： B81B1/00 , B01J19/00 , B29C39/02 , B32B3/30 , B81C99/00 , B82B3/00 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a microscopic part having various surface characteristics and functional groups, high in precision in a micro pattern and easy to manufacture by studying a new manufacturing method of the microscopic part using macromolecular particulates.
SOLUTION: The microscopic part is constituted of a molded film including the macromolecular particulates, a plurality of either one of recessed parts, protruded parts and holes are formed singly or by combining them on a surface of this molded film, characteristically depth of the recessed part and protruding height of the protruded part is within a range of 0.1 μm to 200 μm and opening width of the recessed part, protruding width of the protruded part and a contact circular radius of the hole are within a range of 0.1 μm to 200 μm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过研究使用大分子微粒的微观部件的新制造方法，提供具有各种表面特性和官能团的微观部件，微观精度高，易于制造。解决方案：微观部分由包括大分子微粒的模制膜构成，多个凹陷部分，突出部分和孔中的任一个单独形成或通过将其组合在该模制膜的表面上，特征在于突出部的凹部和突出高度在0.1μm〜200μm的范围内，凹部的开口宽度，突出部的突出宽度和孔的接触圆半径在0.1μm〜 200μm。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006183060A Resin composition having good transfer properties 有权
标题翻译：具有良好转印性能的树脂组合物
公开(公告)号：JP2006183060A
公开(公告)日：2006-07-13
申请号：JP2006077550
申请日：2006-03-20
申请人： Richell Corp , Toyama Prefecture , Toyama Univ , 国立大学法人富山大学 , 富山県 , 株式会社リッチェル
发明人： YAMASHITA KAZUYUKI , ONAGA TAKASHI , FUJISHIRO TOSHIFUMI , MORIMOTO HIDEKI , OBATA TSUTOMU , SUZUKI MASAYASU
IPC分类号： C08L23/10 , B29C45/00 , C08L23/12 , C08L23/14 , C08L53/00 , C08L53/02
CPC分类号： C08L23/12 , B29C45/0001 , B29C2045/0094 , C08L23/10 , C08L23/14 , C08L53/025 , C08L2666/24 , C08L2666/06
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which can be molded at a temperature and pressure equal to or lower than those in the case of general injection molding, enables the precise transfer of the micromachined feature of a stamper or the shape of a mold, and micropparts formed by using the resin composition.
SOLUTION: The resin composition having good transfer properties comprises a polypropylene-based resin and a hydrogenated derivative of a block copolymer shown by the general formula X-Y, wherein X represents a polymer block immiscible with a polypropylene-based resin, and Y represents an elastomeric polymer block of a conjugated diene.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供在与普通注射成型的情况下相同或更低的温度和压力下模塑的树脂组合物，能够精确地传递压模的微加工特征或形状的模具，以及通过使用树脂组合物形成的微型部件。解决方案：具有良好转移性能的树脂组合物包含聚丙烯基树脂和由通式XY所示的嵌段共聚物的氢化衍生物，其中X表示与聚丙烯类树脂不混溶的聚合物嵌段，Y表示共轭二烯的弹性聚合物嵌段。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2008292253A Groove structure for microchannel 审中-公开
标题翻译：微型通道的结构
公开(公告)号：JP2008292253A
公开(公告)日：2008-12-04
申请号：JP2007136902
申请日：2007-05-23
申请人： Richell Corp , 株式会社リッチェル
发明人： YAMASHITA KAZUYUKI
IPC分类号： G01N35/10 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a groove structure for microchannel, which is excellent in flowability for a liquid sample such as a body fluid, has a bonding surface excellent in adhesion and prevents any liquid from leaking. SOLUTION: The structure is equipped with: a base body having the bonding surface on which a microchannel groove is formed and a cover body 2 which adheres to the bonding surface of the base body 1 so as to cover at least a portion of the microchannel groove. The base body 1 is made up of a polypropylene type resin and a resin composition including a hydrogenation derivative of a block copolymer represented by formula: X-Y (wherein, X is a polymer block being not compatible with the polypropylene type resin, and Y is an elastomeric polymer block of a conjugated diene). A functional film layer is formed on at least a portion of the microchannel groove of the base body, and the adhesion between the base body and the cover body is carried out by using an adhesion layer which contains an alkyl alkoxysilane compound and is applied to one or both bonding surfaces so as to cover the functional film layer when the adhesion is completed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种液体样品如体液的流动性优异的微通道凹槽结构，具有粘合性优异并且防止任何液体泄漏的粘合表面。解决方案：该结构配备有：具有形成有微通道槽的接合面的基体和附着于基体1的接合面的盖体2，以覆盖至少一部分微通道槽。基体1由聚丙烯类树脂和包含由式XY表示的嵌段共聚物的氢化衍生物的树脂组合物构成（其中，X为与聚丙烯类树脂不相容的聚合物嵌段，Y为共轭二烯的弹性聚合物嵌段）。在基体的微通道槽的至少一部分上形成功能性膜层，并且通过使用含有烷基烷氧基硅烷化合物的粘合层来进行基体与盖体之间的粘附，并施加到一个或两个接合表面，以便当粘合完成时覆盖功能膜层。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2006347087A STAMPER FOR INJECTION MOLD 审中-公开
公开(公告)号：JP2006347087A
公开(公告)日：2006-12-28
申请号：JP2005178607
申请日：2005-06-17
申请人： RICHELL CORP , TOYAMA PREFECTURE
发明人： YAMASHITA KAZUYUKI , ONAGA TAKASHI
IPC分类号： B29C45/26 , B29C39/02 , B29K101/10 , G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a stamper made of a resin for an injection mold having a fine uneven shape formed on its surface with high precision, easy to manufacture and having great versatility, and its manufacturing method. SOLUTION: A curable resin composition is injected in a master mold manufactured using a resin composition containing a polypropylene resin and a hydrogenated derivative of a block copolymer represented by formula: X-Y (wherein X is a polymer block incompatible with the polypropylene resin and Y is an elastomeric polymer block of a conjugated diene) and subsequently cured to be molded. COPYRIGHT: (C)2007,JPO&INPIT

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