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    • 3. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPH08236861A
    • 1996-09-13
    • JP2501996
    • 1996-02-13
    • HITACHI LTD
    • KAJIMURA TAKASHI
    • H01S5/00H01S3/18
    • PURPOSE: To obtain the passivation method of a reflecting surface of semiconductor laser which is excellent in workability and mass-productivity, by forming a dielectric film from the side surfaces of a plurality of semiconductor layers containing an active layer laminated on a semiconductor substrate to the side surface of the semiconductor substrate, and forming a region in which the dielectric film is not formed, on the semiconductor substrate side surface. CONSTITUTION: On the surface of an N-type GaAs substrate 1, a belt type recessed trench is formed, on which an N-type GaAlAs clad layer 3, a GaAlAs active layer 4, a P-type GaAlAs clad layer 5 and an N-type GaAs cap layer 6 are formed. After that, a P side electrode 8 is formed. A photoresist film is used as a mask, and a resonator reflecting surface 11 is formed by a reactive ion beam etching method. The reflecting surface can be formed almost vertically. By using a sputter coating method, SiO2 10 is formed on the whole surface. In this case, SiO2 creeps over the resonator reflecting surface, and a passivation film is formed. A photoresist mask is formed, SiO2 on the P side electrode is eliminated, and an N side electrode is formed.
    • 6. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPH03292787A
    • 1991-12-24
    • JP9400990
    • 1990-04-11
    • HITACHI LTD
    • UCHIDA KENJIYAMASHITA SHIGEONAKATSUKA SHINICHIKAJIMURA TAKASHI
    • H01S5/00H01S5/223H01S5/323
    • PURPOSE:To prevent a leakage current from occurring in lateral direction in a clad layer outside a ridge stripe region by a method wherein a ridge stripe structure is provided to the surface of a semiconductor laser, and a semiconductor current constriction layer is provided to a region other than the ridge stripe region. CONSTITUTION:A stripe-like dielectric film is formed on the surface of an N-type GaAs substrate 1, and a ridge stripe is formed through etching. Thereafter, a first current constriction layer P-GaAs layer 2 is made to grow through a first organic metal vapor growth method, and an N-GaAs buffer layer 3, an N-Al0.5Ga0.5As clad layer 4, an undoped Al0.1Ga0.9As active layer 5, a P-Al0.5 Ga0.5As clad layer 6, and a P-GaAs cap layer 7 are successively grown in crystal through a second organic metal vapor method. Furthermore, an N-GaAs layer 8 serving as a second current constriction layer is selectively gown through a third organic metal vapor growth method, a stripe-like dielectric film left unremoved is removed, and lastly a P-GaAs buried layer 9 is made to grow in crystal.
    • 7. 发明专利
    • OPTICAL ELEMENT
    • JPH03109789A
    • 1991-05-09
    • JP24628889
    • 1989-09-25
    • HITACHI LTD
    • TANAKA TOSHIAKIMINAGAWA SHIGEKAZUKONDO MASAHIKOKAJIMURA TAKASHI
    • H01S5/00
    • PURPOSE:To obtain an optical element of high performance which cannot be obtained by an optical element created on a (100) substrate crystal by using a substrate crystal whose substrate crystal face is tilted by a specific angle toward a direction. CONSTITUTION:A crystal face of a substrate is tilted from a (001) face toward a direction while the tilt angle is 5 to 16 deg. and a shape of stripes is laterally symmetric with respect to a lengthwise direction of a laser resonator. For example when a (511) A substrate is used, this substrate has a substrate crystal face with a (100) face tilted by 15.8 deg. toward a direction of a (111) face. cleavage faces perpendicular to this face are (01-1) and (0-11) faces while other cleavage faces are not perpendicular to it. Thus a pair of crystal faces are most likely to be cleaved while other faces are less likely to be cleaved. There fore, laser devices can be formed by this pair of crystal faces while rectangular chips can be cut out from the remaining cleavage faces. Thus a resultant device exhibits performance more excellent than that formed on the (100) face.