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    • 5. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH02205089A
    • 1990-08-14
    • JP2383089
    • 1989-02-03
    • HITACHI LTD
    • YOSHIZAWA MISUZUONO YUICHI
    • H01S5/00
    • PURPOSE:To prevent fusion of a high light density part at the end face by constituting the crystal at the end face part out of material which is transparent to laser beams. CONSTITUTION:The part in the resonator direction is composed of an end face window area 13 and a laser oscillation area 12. An n-type GaAs substrate crystal 1 is etched so as to form a mesa of Ww in width, Lw in length in resonator direction, and h in height at an end face window area. Next, on this n-type GaAs substrate crystal 1, an n-type Al0.37Ga0.63As first clad layer 2, an n-type Al0.20Ga0.80As light guide layer 3, an n-type Al0.37Ga0.63As second clad layer 4, an Al0.06Ga0.94As active layer 5, a p-type Al0.37Ga0.63As first clad layer 6, and an n-type GaAs current constriction layer 7 are formed in order by MOCVD method. Next, only at a laser oscillation area 12 the n-type GaAs current constriction layer 7 is removed completely, and the groove stripe to expose the surface of the p-type Al0.37Ga0.63As second clad layer 6 is formed.
    • 7. 发明专利
    • SEMICONDUCTOR LASER ELEMENT
    • JPS63208292A
    • 1988-08-29
    • JP4023587
    • 1987-02-25
    • HITACHI LTD
    • YAMASHITA SHIGEOONO YUICHITANAKA TOSHIAKIYOSHIZAWA MISUZUKAJIMURA TAKASHI
    • H01S5/00
    • PURPOSE:To obtain a semiconductor laser element, which is stably oscillated in a lateral fundamental mode, by making the thickness of a semiconductor clad layer thicker at a light guide part than at the regions on both sides, and providing a semiconductor current constriction layer, which is transparent to laser wavelengths. CONSTITUTION:On a first conductivity type semiconductor substrate 1, at least a first conductivity type first semiconductor clad layer 2, a second semiconductor active layer 3 and a second conductivity type third semiconductor clad layer 4 are provided. The thickness of the third semiconductor clad layer 4 is thicker at a strip shaped light guide part than at the outside of said part. Furthermore, a first conductivity type fourth semiconductor current constriction layer 5 is provided on the third semiconductor clad layer 4 other than a stripe region, whose width is narrower than the strip shaped region. At least a second conductivity type fifth semiconductor embedded layer 7 is further formed on the layer 5. When the fifth semiconductor current constriction layer 7 is constituted with a transparent semiconductor layer, whose refractive index is smaller than that of the semiconductor layer 4 constituting the strip shaped protruding part, a light guiding effect is yielded in the direction parallel to the active layer. Thus stable oscillation occurs in a lateral fundamental mode.
    • 8. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPS6360581A
    • 1988-03-16
    • JP20367986
    • 1986-09-01
    • HITACHI LTD
    • UOMI KAZUHISAYOSHIZAWA MISUZUYAMASHITA SHIGEOKAYANE NAOKIKAJIMURA TAKASHI
    • H01S5/00H01S5/042
    • PURPOSE:To control the half-value width of outgoing beams, and to enable predetermined half-value width by forming the shape of the end surface of a laser oscillator to a curved surface form and setting the radius of curvature of the end surface of the laser oscillator at a proper value in a phased array semiconductor laser. CONSTITUTION:Outgoing-angle half-value width in the direction parallel with the plane of an active layer is determined by the radius of curvature of a wave front on the end surface of laser beams projected from the end surface and spot size. Since a wave front at the time of outgoing from the end surface takes a convex shape on the convex end surface 1, the spreading angle of outgoing beams is made larger than a diffraction spreading angle. Since a wave front at the time of outgoing from the end surface takes a concave shape in the concave end surface 2, the spreading angle of outgoing beams is made larger than the diffraction spreading angle. Accordingly, the end surface is formed to a curved surface shape, thus broadening outgoing beam half-value width in the direction parallel with the active layer in a phased array semiconductor laser, then acquiring Outgoing beams approximating to a round circle.
    • 10. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH02199888A
    • 1990-08-08
    • JP1760389
    • 1989-01-30
    • HITACHI LTD
    • YOSHIZAWA MISUZUKAJIMURA TAKASHINAKAJIMA KEIICHIKONO TOSHIHIRO
    • H01S5/00
    • PURPOSE:To prevent a driving current from increasing and to extend a life by reducing in thickness an active layer in a civil high output semiconductor laser device, forming a clad layer in a 2-layer structure, and increasing the band gap of a clad layer farther from the active layer larger than that of a clad layer nearer therefrom. CONSTITUTION:An N-type Al0.37Ga0.63As clad layer 2, an N-type Al0.06Ga0.94As active layer 3, a P-type Al0.37Ga0.63As first clad layer 4 and an N-type GaAs current narrowing layer 6 are sequentially formed on an N-type GaAs substrate crystal 1 by a MOCVD method. In this case, the thickness of the active layer 3 is 35-45nm. The center of the current narrowing layer 6 is removed in a stripe state in a hot etching step, and the surface of the clad layer 4 is exposed. Thus, a groove stripe is formed. Then, a P-type second clad layer 7 and a P-type GaAs cap layer 8 are formed by a MOCVD method. Thereafter, after a P-type side electrode 9 and an N-type side electrode 10 are formed, a laser element is obtained by a cleaving method. Thus, an element which can operate for a long period can be obtained.