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1. 发明专利

JPH09247236A TAKING-OVER SYSTEM FOR SIGNAL INFORMATION 失效
公开(公告)号：JPH09247236A
公开(公告)日：1997-09-19
申请号：JP5485696
申请日：1996-03-12
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE , NEC CORP , FUJITSU LTD
发明人： HARU KAZUHIKO , KIYOHISA HARUYOSHI , UCHIDA AKIRA , ASANO TOSHIAKI , OSAKI KENJI , TERADA KAZUHIRO , NAKAJIMA SHINICHI , MIZUNO MITSUYUKI
IPC分类号： H04Q3/545 , H04L29/06 , H04L29/10
摘要： PROBLEM TO BE SOLVED: To secure the expansibility of addition and alteration of constituent elements of a message by handing over received signal information contents to an application, etc., without conversion from variable length to fixed length. SOLUTION: A receive signal 1d consists of layer-1 information 1e, layer-2 information 1f, and layer-3 information 1g. A signal receiving program receives the layer-3 information 1g consisting principally of variable-length elements and generates an address group 1h indicating representation of whether or not there is a variable-length or fixed-length element and the position in the signal information. A signal analyzing program 1c takes over those representation, address group 1h, and layer-3 information 1g and interprets respective information elements by referring to the presence/absence address group 1h.

2. 发明专利

JPH0847021A CALL IDENTIFICATION INFORMATION MANAGEMENT SYSTEM 失效
公开(公告)号：JPH0847021A
公开(公告)日：1996-02-16
申请号：JP18098894
申请日：1994-08-02
申请人： FUJITSU LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： MIZUNO MITSUYUKI , TERADA KAZUHIRO , KAI TOSHIHIRO
IPC分类号： H04Q3/72 , H04Q3/76
摘要： PURPOSE:To realize the call identification information management system in which the correspondence to calls is easily conducted independently of physical lines and even between unspecified exchanges not set in advance with respect to the call identification information management system for an exchange system using a call identification number between plural exchanges to process the calls. CONSTITUTION:This system is provided with a call identification number management section 100 giving an identification number of a call of a concerned station on the occurrence of a call and of the arrival of an opposite call, a call cross reference management section 200 having a call cross reference state control section 210 deciding and managing a call state of the call of the opposite station, having an opposite call identification number cross reference section 220 to extract an identification number of the opposite party call from call information sent through a signal line, and having a data area management section 230 managing a data area 300 to which the cross reference between the opposite call identification number from the opposite station extracted by the opposite call identification number cross reference section 220 and the call identification number of the concerned station is written.

3. 发明专利

JPH0746636A ADDRESS TRANSLATION METHOD FOR FILE-UPDATING IN ELECTRONIC EXCHANGE 失效
公开(公告)号：JPH0746636A
公开(公告)日：1995-02-14
申请号：JP18482393
申请日：1993-07-27
申请人： NIPPON TELEGRAPH & TELEPHONE
发明人： KISHIDA KOJI , TERADA KAZUHIRO , KAI TOSHIHIRO
IPC分类号： H04M3/00 , H04Q3/545
摘要： PURPOSE:To reduce a processing amount during a call processing and to effectively apply an object-oriented language by translating the addresses of data at the time of updating the file of an electronic exchange without making invariable numbers correspond to the data. CONSTITUTION:The contents of a storage area 3 are transferred to the storage area 13. Then, a difference between the addresses of the storage area 12 and the storage area 2 is obtained, the difference is added to a painter 24 stored in the data 15a of an updated file 20 and the address of the data 14a after updating the file is calculated. Further, the address of the data 15a is set to the pointer 23 inside the data 14a. The above operation is performed to all the data 15a, 15b, 14a and 14b. Then, since the values of the pointers 1a and 1b are transmitted to the pointers 11a and 11b, by adding an address difference to the pointer 11a, the address of the data 14a after updating the file is calculated. The conversion processing of the pointer 11a is performed to all the pointer 11b. Thus, the addresses of the data at the time of updating file is efficiently translated.

4. 发明专利

JPH11284020A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH11284020A
公开(公告)日：1999-10-15
申请号：JP8164498
申请日：1998-03-27
申请人： HITACHI LTD
发明人： TERADA KAZUHIRO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To protect a wiring which connects the electrodes of a semiconductor device to bump electrodes against disconnection and to reduce CSP-type semiconductor device in manufacturing cost. SOLUTION: A device 1 is equipped with a semiconductor element 2 with electrodes 6 on its primary surface, insulators 7 formed and bonded to the region of the primary surface of the element 2 other than this region where the electrodes 6 are provided, conductor pads 10 provided to the insulator 7, conductive wires 11 connecting the electrodes 6 to the conductor pads 10, bump electrodes 4 fixed to the conductor pads 10, and an insulating protector 3 provided to cover all the primary surfaces of the semiconductor element 2, so as to allow a part of the bump electrodes 4 to be protruded from the protector 3. The insulator 7 is formed of an insulating resin film.

5. 发明专利

JPH0832017A LEAD FRAME WITH REINFORCEMENT PLATE AND ASSEMBLY METHOD OF PLASTIC MOLDED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0832017A
公开(公告)日：1996-02-02
申请号：JP16404894
申请日：1994-07-15
申请人： HITACHI LTD
发明人： MIKINO HIROSHI , ICHITANI MASAHIRO , TERADA KAZUHIRO , SHIOTSUKI TOSHIHIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent deformation of a lead frame in a step before a plastic molding in assimbly processes of a plastic molded semiconductor device, and imperfect bonding due to deformation of a lead frame. CONSTITUTION:A plastic molded semiconductor device is assembled by maintaining a lead frame, before a plastic moding, in the state that a reinforcement plate 2 is fixed on a lead frame main body 1, and maintaining the lead frame, after the plastic molding, in the state that the reinforcement plate 2 is removed from the lead frame main body 1.

6. 发明专利

JPH053281A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH053281A
公开(公告)日：1993-01-08
申请号：JP15296391
申请日：1991-06-25
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： OTSUKA KENICHI , TERADA KAZUHIRO , KIMOTO RYOSUKE , KAMEOKA AKIHIKO
IPC分类号： H01L23/50
摘要： PURPOSE:To improve accuracy of a semiconductor device and to improve package density thereof. CONSTITUTION:In a semiconductor device 1 having a plurality of leads 2, a supporting frame 4 commonly connected to a plurality of leads 2 is connected to the lead 2 through a connecting material 3. Since strength of the lead 2 is reinforced by the supporting frame 4, deformation of the lead 2 is reduced. Since strength of the lead 2 is ensured by the supporting frame 4 even if the lead 2 is thinned, it is possible to arrange a number of pins at a small pitch.

7. 发明专利

JPS6038848A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6038848A
公开(公告)日：1985-02-28
申请号：JP14635283
申请日：1983-08-12
申请人： HITACHI LTD
发明人： TERADA KAZUHIRO , KUMAZAWA TETSUO
IPC分类号： H01L23/50 , H01L23/28 , H01L23/31
摘要： PURPOSE:To absorb a lead bending section and the thickness of a bent lead in a groove into which the bent lead is buried, and to widen the width of a package only by the absorbing sections by previously forming the groove to the side surface of the package. CONSTITUTION:A semiconductor chip 4 is loaded on a tab as a chip loading section for a lead frame 2, bonding pads for the chip and bonding pads on the lead frame side are connected electrically by connector wires 5, and these lead frame and chip are sealed with a resin, thus forming a sealing body 1. When leads 2 are bent in the upper sections of grooves 3 formed to the sealing body 1, the positions of the bending are positioned on the sides inner than the maximum width X of a package, and the width X of the package can also be made the same as or larger than spaces Y among the leads.

8. 发明专利

JPH0878605A LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE UTILIZING THE SAME 失效
公开(公告)号：JPH0878605A
公开(公告)日：1996-03-22
申请号：JP20840394
申请日：1994-09-01
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： TERADA KAZUHIRO , TSUBOSAKI KUNIHIRO , WATANABE HIROSHI , SUZUKI KAZUNARI
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50
摘要： PURPOSE: To provide a lead frame suitable for assembly of logic LSI. CONSTITUTION: In a lead frame structure, a part of the rear surface of a semiconductor chip is placed in direct contact with the mold resin, even if the semiconductor chip of any external size is mounted on a die pad 2, by providing a slit 9 at the center of the die pad 2, providing a plurality of slits 10 surrounding the slit 9 at the external circumference of the die pad 2 and extending the end part of the external circumference of the slit 9 to the external side of the end part of the center of the slit 10.

9. 发明专利

JPH0817988A RESIN-SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0817988A
公开(公告)日：1996-01-19
申请号：JP14612194
申请日：1994-06-28
申请人： HITACHI LTD
发明人： MIKINO HIROSHI , ICHITANI MASAHIRO , TERADA KAZUHIRO , SHIOTSUKI TOSHIHIRO
IPC分类号： H01L23/50 , H01L23/29
摘要： PURPOSE:To reduce a heat resistance to reach from a semiconductor chip to the surface of a resin-sealed semiconductor device and to contrive to improve the heat dissipation property of the device by a method wherein a reinforcing and heat dissipation plate consisting of a material having a heat conductivity higher than that of a resin sealed material is laminated on a prescribed region of a lead frame via an insulative bonding agent. CONSTITUTION:The upper surface of a reinforcing and heat dissipation plate 1 is aligned with a prescribed region of a lead frame 4 and the plate 6 is made to laminate to the frame 4 via an insulative bonding agent 5. A heat resistance to reach from a semiconductor chip 2 to the surface of a resin-sealed semiconductor device is reduced by a factor of to the replacement of a part of a heat conduction path, which reaches from the chip 2 to the surface of the device, with the plate 6 having a heat conductivity higher than that of a resin sealed material 1 and the heat dissipation property of the device can be improved. Moreover, the resistance of the frame 4 to an external force, which is applied to the frame 4 at the time of operation of the assembly of the frame and at the time of transfer of the frame, is increased. Accordingly, deformation of the lead frame and the defective assembly of the lead frame in a precess of manufacturing the device can be prevented or can be reduced.

10. 发明专利

JPH04111386A ELECTRONIC DEVICE 失效
公开(公告)号：JPH04111386A
公开(公告)日：1992-04-13
申请号：JP22930890
申请日：1990-08-30
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TERADA KAZUHIRO , OTSUKA KENICHI , KIMOTO RYOSUKE , MASUDA MASACHIKA , SUGANO TOSHIO , AKEYAMA KENJI , MURAKAMI HAJIME , NISHIMURA ASAO , KITANO MAKOTO
IPC分类号： H05K1/18 , H05K1/00 , H05K1/02 , H05K1/03 , H05K3/34 , H05K3/46
摘要： PURPOSE:To ensure the reliability of a soldered part at a module on which many IC's have been mounted by a method wherein a board whose coefficient of thermal expansion is matched to the value of an IC package as far as possible is used. CONSTITUTION:At an electronic device, a single-layer board or a multilayer board, of ten layers or lower, whose coefficient of thermal expansion is at 7.0X10 to 3.0X10 is used, and a semiconductor device in a package in which an interval between opposite lead terminals is at 10mm or higher and the height of leads from the board is at 0.7mm or lower is mounted at least on one face. Leads 3 of a TSOP- type semiconductor device 2 on a ceramic board 1 are bonded (soldered) by using a solder 4 and the device is mounted. The thickness of the package for the TSOP-type semiconductor device 2 is at about 1.27mm. The ceramic board 1 has a multilayer interconnection structure formed in the following manner: copper foils 1B having a thickness of about 18mum are pasted on both faces of a ceramic core material 1; glass cloths are impregnated with an epoxy resin and dried to form prepregs 1C; the prepregs having a thickness of about 100mum are laminated on the copper foils; copper foils 1B having a thickness of about 18mum are pasted on them; prepregs 1C having a thickness of about 100mum are laminated on them; the copper foils 1B having a thickness about 18mum are pasted on them.

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