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    • 2. 发明专利
    • ELECTRONIC COMPONENT
    • JPH01293555A
    • 1989-11-27
    • JP12381488
    • 1988-05-23
    • HITACHI LTDHITACHI TOBU SEMICONDUCTOR LTD
    • WATANABE NORIHIDEAKEYAMA KENJI
    • H01L25/18H01L25/00H01L25/04H05K1/18
    • PURPOSE:To obtain an electronic component with a safety function for scarcely decoding a program software and protecting the profit of the software by mounting a SRAM chip or the like in the bottom of the cavity of a circuit board, covering it with a sealer, and connecting the interconnection layer of a power source circuit including a backup battery to the board through a leaf spring. CONSTITUTION:Mounting components such as a microcomputer chip 4 mounted on a circuit board 17, a SRAM chip 3, a random logic IC chip 2, etc., and an electronic component associated with a program software having a power source circuit including the backup battery 14 of the chip 3 are formed in a structure in which the chips 2 to 4 are mounted in the bottom of the cavity 16 of the board 17 of a multilayer structure, so covered with a sealer 7 as not to be visually observed for its interconnecting state, the power source circuit is composed of interconnection layers 21, 25 provided over the front and rear faces of a ceramic board 22, and a ground interconnection layer 23 is superposed on the layer 25 through an insulating film 24 at least on one side face, and the layer 21 is so composed as to be electrically connected to the board 17 through a connecting terminal 20 of a leaf spring.
    • 3. 发明专利
    • Resin-sealed semiconductor device and manufacture thereof
    • 树脂密封半导体器件及其制造
    • JPS5910245A
    • 1984-01-19
    • JP11857782
    • 1982-07-09
    • Hitachi Ltd
    • SUDA MINORUAKEYAMA KENJI
    • H01L23/29H01L21/56H01L23/31H01L23/32
    • H01L23/32H01L2224/48091H01L2224/48247H01L2224/8592H01L2924/181H01L2924/00014H01L2924/00012
    • PURPOSE:To increase the strength of tightening by a bolt without lowering the intensity of power cycles, by forming an undercoat resin layer to be in a double-layer structure whose lower layer is formed of first resin having large adhesiveness to a supporting substrate and whose upper layer is formed of second resin having small adhesiveness to a resin mold body. CONSTITUTION:An undercoat resin, which is prepared by adding liquid or powder silicon resin of 4wt% to liquid epoxy resin, is dropped on a semiconductor pellet 2 mounted on a heat sink 1, baking is applied thereto, and thereby the resin is polymerized and set. A resin layer thus prepared has a double-layer structure wherein a lower layer is formed of epoxy resin 13 and an upper layer of silicon resin 14. When a heat or a mechanical stress is applied to a semiconductor device thus prepared, which is fixed on a wiring substrate 9 by a bolt 8, the silicon resin 14 acts as a release material even when a substrate 1 is deformed, a space 16 is thereby formed, and thus no stress is applied onto the pellet 2. On the other hand, the thermal expansion coefficient of the epoxy resin 13 is almost the same with that of a mold body 5 (epoxy resin), and thus the intensity of power cycles is not lowered. Therefore, the strength of tightening by the bolt 8 can be improved.
    • 目的:通过在不降低动力循环强度的情况下增加螺栓的紧固强度,通过将底层树脂层形成为双层结构,其下层由与支撑基材具有大粘合性的第一树脂形成,并且其双 上层由对树脂成型体具有小粘合性的第二树脂形成。 构成:将通过将4重量%的液体或粉末硅树脂添加到液体环氧树脂中而制备的底涂层树脂滴在安装在散热器1上的半导体芯片2上,对其进行烘烤,由此树脂聚合, 组。 如此制备的树脂层具有双层结构,其中下层由环氧树脂13和硅树脂14的上层形成。当将如此制备的半导体器件的热或机械应力施加到固定在 通过螺栓8的布线基板9,即使当基板1变形时,硅树脂14也用作剥离材料,由此形成空间16,从而在颗粒2上不施加应力。另一方面, 环氧树脂13的热膨胀系数与模具体5(环氧树脂)的热膨胀系数几乎相同,因此功率循环的强度不降低。 因此,能够提高螺栓8的紧固强度。
    • 4. 发明专利
    • LEAD FRAME
    • JPS58127355A
    • 1983-07-29
    • JP894482
    • 1982-01-25
    • HITACHI LTD
    • ENOMOTO USUKEYAMAGUCHI MASAOINABA KEIZOUAKEYAMA KENJIIKEZAWA RIYUUICHI
    • H01L21/52H01L23/48H01L23/495
    • PURPOSE:To realize automatic pellet fitting through flux-lessening and to execute pellet fitting with small thermal resistance by providing a lead frame forming solder plating layer which is not easily oxidized on the semiconductor element fitting surface in the desired thickness. CONSTITUTION:A solder in the specified composition ratio can be obtained through accurate control of thickness of each layer by separately plating a lead layer 11 and tin laye 12. At this time, the lead layer 11 which is easily oxidized is used as the lower layer, while the tin layer 12 which is comparatively difficult to be oxidized is used as the upper layer in view of protecting the lead layer 11. From the point of view of preventing oxidation of the lead layer 11, the tin layer 12 is required to have the thickness of at least about 0.2mum or more (in this case, the lead layer is thicker than about 2.6mum). If the tin layer 12 is excessively thick, a longer time is required for alloying of lead layer 11 and tin layer 12 and the solder plating dose not dissolve within a short period and accordingly the pellet fitting cannot be realized and surface gloss becomes insufficient.
    • 8. 发明专利
    • Semiconductor device and substrate used for assembling therefor
    • 用于组装的半导体器件和衬底
    • JPS58216449A
    • 1983-12-16
    • JP9782182
    • 1982-06-09
    • Hitachi LtdHitachi Tobu Semiconductor Ltd
    • HAGIWARA YOSHIMITANAKA NOBUKATSUAKEYAMA KENJIYOSHIHARA NORIO
    • H01L23/48H01L23/28H01L23/31H01L23/495
    • H01L23/49562H01L23/3135H01L2224/48H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00012H01L2924/00
    • PURPOSE:To reduce the number of manufacturing steps and the cost of a product by hardly flowing out undercoating resin from an undercoated region which is formed with a groove extending in an endless shape. CONSTITUTION:After a semiconductor element 14 is secured onto the semiconductor element mounting region 2 of a header 5, the prescribed electrodes of the element 14 are connected via wirings 15 to the inner ends of the leads 8 at both sides, and the element 14 is covered with undercoating resin 16. Since a sharp corner which is produced due to the flowout of resin is not present at the peripheral edge of an undercoated region 4 in this case, the resin does not flow out. After the resin 16 is then hardened, a resin molding region 17 is molded with epoxy resin, and the prescribed part is covered with a resin package 18. Thereafter, unnecessary frame 11 and dam 12 are cut and removed, and a semiconductor device 19 is manufactured. Since the undercoating resin does not override to flow out in the assembly in this manner, the sampling work for flow- out resin can be eliminated.
    • 目的:通过从形成有环状延伸的槽的底涂层区域难以流出底涂层树脂来减少制品的制造步骤和成本。 构成:在将半导体元件14固定在集管5的半导体元件安装区域2上之后,元件14的规定电极经由布线15连接到引线8的两端的内端,元件14为 由于在这种情况下在底涂区域4的周缘处不存在由于树脂流出而产生的尖角,因此树脂不会流出。 树脂16然后硬化后,用环氧树脂模制树脂成型区域17,并用树脂封装18覆盖规定的部分。之后,将不必要的框架11和堤坝12切割并移除,半导体装置19 制造。 由于底涂层树脂不以这种方式超过组装流出,因此可以消除流出树脂的取样工作。