专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS6223142A LEAD FRAME 失效
公开(公告)号：JPS6223142A
公开(公告)日：1987-01-31
申请号：JP16193685
申请日：1985-07-24
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： SUGIMOTO SHUICHI , MIWA TAKASHI , SHIRAI MASAYUKI
IPC分类号： H01L23/50 , H01L23/28 , H01L23/48
摘要： PURPOSE:To reduce the stress of sealing glass for a lead frame and the lead frame, to prevent defective leakage and to improve the reliability of a flat package sealed with glass by forming the section of a section buried to sealing glass for the lead frame to a circle. CONSTITUTION:The section of a central sealing section 2 is constituted to a circle while the sections of a bonding section 3 and a mounting section 4 are composed to a rectangle shown in a dotted line. Accordingly, thermal stress applied to sealing glass is reduced, defective air leakage can be minimized, and the sectional area of sealing glass is increased and sealing strength can be augmented.

2. 发明专利

JPS62224099A MULTILAYER INTERCONNECTION BOARD AND MANUFACTURE OF THE SAME 失效
公开(公告)号：JPS62224099A
公开(公告)日：1987-10-02
申请号：JP6577686
申请日：1986-03-26
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： EMOTO YOSHIAKI , SUGIMOTO SHUICHI , SHIRAI MASAYUKI
IPC分类号： H05K3/46

3. 发明专利

JPS61241955A LEAD MEMBER AND SEMICONDUCTOR DEVICE USING SAID LEAD MEMBER 失效
公开(公告)号：JPS61241955A
公开(公告)日：1986-10-28
申请号：JP8249985
申请日：1985-04-19
申请人： HITACHI VLSI ENG , HITACHI LTD , HITACHI TOKYO ELECTRON KK
发明人： SUGIMOTO SHUICHI , HONDA ATSUSHI , OOTA TADAAKI , TSUBOI TOSHIHIRO , YAMAMOTO KUNIO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To obtain lead members, which can implement a fine lead pitch, by forming the lead members having a structure, wherein conductors as thin plate leads and insulators are alternately laminated. CONSTITUTION:A silicon pallet 2 is attached to a specified position at the center of the surface of a pellet supporting substrate 4 with a coupling material 5. Lead members 6 in an L shape are attached in the four directions at the peripheral parts of the pellet 2 by a bonding agent 7 before and after the attachment of the pellet. Then, bonding pads 8, which are provided on the pallet 2 in a large quantity, are bonded to lead parts 6a of the lead members 6 with wires 9. Thus the pellet 2 and the leads 6a are electrically conducted. Thereafter, a dam 10 in a square frame shape is attached to the surrounding part of the pellet 2 with the bonding agent 7. Thus a cavity 11 is formed. Thereafter, silicon gel 3 is potted in the cavity 11. Finally, a cap 12 comprising a metal plate is attached to the dam 10 with the bonding agent 7. Thus, the lead members having a fine lead pitch can be provided.

4. 发明专利

JPS61101054A Manufacture of semiconductor device 失效
标题翻译：半导体器件的制造
公开(公告)号：JPS61101054A
公开(公告)日：1986-05-19
申请号：JP22218284
申请日：1984-10-24
申请人： Hitachi Ltd , Hitachi Micro Comput Eng Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： SUGIMOTO SHUICHI , HONDA ATSUSHI , MIWA TAKASHI , YAMAMOTO KUNIO
IPC分类号： H01L21/56 , H01L23/10 , H01L23/24 , H01L23/28
CPC分类号： H01L23/10 , H01L23/24 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To reduce part numbers eliminating adhesive by means of forming a dam utilizing thermosetting resin. CONSTITUTION:Dam members 10 forming a dam to cover a pellet 4 are mounted on a substrate 2. The dam members 10 are composed of two layered structure made of the first layers comprising thermosetting resin 10a melting at low temperature and the second layers comprising other thermosetting resin 10b melting at high temperature. In such a constitution, the part numbers of resin potting semiconductor device 1 may be reduced since the resins 10a, 10b may serve both as a dam and an adhesive.
摘要翻译：目的：通过使用热固性树脂形成坝来减少零件编号消除粘合剂。构成：形成用于覆盖颗粒4的坝的坝构件10安装在基板2上。坝构件10由由第一层构成的两层结构构成，第一层包括在低温下熔化的热固性树脂10a，第二层包含其它热固性树脂10b在高温下熔化。在这种结构中，可以减少树脂封装半导体器件1的部件号，因为树脂10a，10b可以用作坝和粘合剂。

5. 发明专利

JPS6132528A Manufacture of semiconductor device 失效
标题翻译：半导体器件的制造
公开(公告)号：JPS6132528A
公开(公告)日：1986-02-15
申请号：JP15302384
申请日：1984-07-25
申请人： Hitachi Ltd , Hitachi Micro Comput Eng Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： SUGIMOTO SHUICHI , SATO KEIICHI , HONDA ATSUSHI , MIWA TAKASHI , YAMAMOTO KUNIO
IPC分类号： H01L21/56 , H01L23/28
CPC分类号： H01L21/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PURPOSE:To fill the gap between a pellet and a cap closely with resin preventing the resin upon the pellet surface from thinning down by a method wherein an upright semiconductor with its cap implanted with resin is heated and then cooled down to solidify the resin. CONSTITUTION:A semiconductor device 1 is placed with an opening 11 of a dam 9 turned upward to implant the opening 11 with liquid silicon resin 13. Next the semiconductor is heated as it is upright. Then the silicon 13 is cooled down to room temperature and an aluminum cap 14 is bonded on the opening 11 likewise the dam 9 is bonded to a plastic substrate 2 using silicon base adhesive 10a to complete the device. At this time, the silicon 13 is solidified into hard jelly state so that the silicon 13 may not be fluidized within the cavity even if the semiconductor 1 is laid sideways.
摘要翻译：目的：为了通过树脂填充颗粒和盖子之间的间隙，通过树脂防止树脂在颗粒表面变薄的方法，其中将其顶盖植入树脂的直立半导体加热然后冷却以使树脂固化。构成：半导体装置1放置有坝9的开口11向上转动以将液体硅树脂13注入开口11.接下来，半导体被直立加热。然后将硅13冷却至室温，同时使用硅基粘合剂10a将坝9接合到塑料基板2上，将铝盖14接合在开口11上以完成该装置。此时，硅13固化成硬果冻状态，使得硅13可能不会在空腔内流动，即使半导体1被横向放置。

6. 发明专利

JPS61125053A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS61125053A
公开(公告)日：1986-06-12
申请号：JP24591584
申请日：1984-11-22
申请人： Hitachi Ltd , Hitachi Micro Comput Eng Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： HONDA ATSUSHI , MIWA TAKASHI , YAMAMOTO KUNIO , SUGIMOTO SHUICHI
IPC分类号： H01L21/60 , H01L23/04 , H01L23/24
CPC分类号： H01L23/04 , H01L23/24 , H01L2224/16145 , H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01079 , H01L2924/15312 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To improve transfer efficiency of heat generated by a pellet to a cap, by providing one or more protruded parts on the back surface of the cap. CONSTITUTION:A substrate 1 is formed by resin such as epoxy resin. The type is a so-called pin-grid array type. On the periphery of the upper surface of said substrate, a dam 2, which is an aluminum frame, is attached by silicon bonding agent 3. A cap 4 made of aluminum is attached on the upper surface of the dam 2 by a silicon bonding agent 3a. The inside of a package is sealed. A pellet 5 comprising silicon is bonded to the approximately central part of the upper surface of the substrate 1 by silver paste 6. The pellet is electrically conducted to electrode parts by connecting a gold wire 8 to a metallized layer 7, which is formed on the upper surface of the substrate 1. Therefore, the metallized layer 7 is electrically connected to pins 9 embedded in the substrate 1. The pellet 5 is coated by a silicon gell 10, which is a heat conducting material filled in the back surface of the cap 4 in a contact state.
摘要翻译：目的：通过在盖的后表面上提供一个或多个突出部分来提高由颗粒产生的热量对盖的转移效率。构成：基材1由树脂如环氧树脂形成。该类型是所谓的pin-grid阵列类型。在所述基板的上表面的周围，通过硅粘合剂3附着铝框架的水坝2。由铝制成的盖4通过硅粘合剂安装在坝2的上表面 3a。包装内部密封。包含硅的颗粒5通过银膏6结合到基板1的上表面的大致中央部。通过将金线8连接到形成在金属层7上的金属化层7而将电池导电到电极部分因此，金属化层7与嵌入基板1中的引脚9电连接。颗粒5被硅凝胶10覆盖，硅凝胶10是填充在盖的后表面中的导热材料 4处于接触状态。

7. 发明专利

JPS61123165A Lead frame 失效
标题翻译：领导框架
公开(公告)号：JPS61123165A
公开(公告)日：1986-06-11
申请号：JP22679785
申请日：1985-10-14
申请人： Hitachi Ltd , Hitachi Tokyo Electron Kk
发明人： USAMI TAMOTSU , OTSUKA KANJI , DOI HIROAKI , TSUBOI TOSHIHIRO , SUGIMOTO SHUICHI
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/495 , H01L2224/48 , H01L2224/48247 , H01L2224/49 , H01L2224/49171 , H01L2924/00
摘要： PURPOSE:To improve yield at a time when lead pieces for a lead frame are fixed to a ceramic board by mounting a hanging body connected in common with a plurality of the lead pieces extended from a frame body at the center of the frame body. CONSTITUTION:A hanging board 213 for a lead frame 21 is detached from lead frames 212, and placed on the surface of a ceramic board 22, and the lead pieces 212 are fastened to the peripheral section of the surface of the ceramic board 22. A semiconductor pellet 23 is placed and fixed to a recessed section at the central section of the main surface of the ceramic board 22. The pellet 23 and bonding wires 24 are connected, a frame body 211 in the frame 21 is separated from the lead pieces 212, and a ceramic cap is superposed on the ceramic board 22 and sealed with low melting-point glass, etc.
摘要翻译：目的：通过安装与从框架体的框架体的中心延伸的多个引线片共同连接的悬挂体，将引线框架的引线片固定在陶瓷板上，提高产量。构成：用于引线框架21的悬挂板213从引线框架212拆下并放置在陶瓷板22的表面上，引线片212紧固到陶瓷板22的表面的周边部分。将半导体芯片23放置并固定在陶瓷基板22的主面的中央部的凹部。连接片23和接合线24，框架21的框体211与引线片212分离并且陶瓷盖重叠在陶瓷板22上并用低熔点玻璃等密封。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式