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    • 1. 发明专利
    • LOGICAL INTEGRATED CIRCUIT
    • JPS57210729A
    • 1982-12-24
    • JP9535581
    • 1981-06-22
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • TAKAHASHI YOSHIKAZUTAKECHI MAKOTOMURATA SHINGO
    • G11C11/407H01L21/822H01L27/04H03K19/00
    • PURPOSE:To perform stable operation even if an output circuit charges or discharges a lot of external capacitors, by independently providing a power supply system energizing an input circuit and an internal circuit and a power supply system energizing an output circuit, in an MOS logical integrated circuit. CONSTITUTION:A CMOS integrated circuit is formed on a single semiconductor chip 10 and has input buffers 12-1-12-m, an internal circuit 14, and output buffers 16-1-16-n. The buffers 12-1-m are connected to input terminals 20-1-m and the output is connected to the circuit 14. The buffers 16-1-n are connected to the circuit 14 and the output is connected to terminals 28-1-n. A battery Vdd1 is connected to the buffers 16-1-n via a power terminal 32 and the other terminals are connected to a ground terminal 36. A power supply VDD2 is connected to the buffers 12-1-m and the circuit 14 and the other terminals are connected to a ground terminal 46. Thus, even if the potential at the terminals 32 and 36 is fluctuated with charge/discharge of external capacitors C1-Cn, no fluctuation is given to the threshold value receiving the input signal of the buffers 12-1-n.
    • 3. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS57211248A
    • 1982-12-25
    • JP9535781
    • 1981-06-22
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • TAKAHASHI YOSHIKAZUITOU TSUNEOTAKECHI MAKOTO
    • H01L21/822H01L21/60H01L21/82H01L27/04H01L27/118H03K19/003H03K19/0185H03K19/173
    • PURPOSE:To contrive to enlarge the degree of freedom of design of a master slice type IC by a method wherein the pad providing region adjoining to an I/O cell is divided into the plural number, and isolated and independent pads are provided respectively thereto. CONSTITUTION:When Al wirings 19 for independence of function of an input protective circuit (resistros 12 and diodes 14), an input circuit 15 and a CMOS inverter circuit 16 are to be provided in the I/O cell 5 conformed to the fundamental design, pads 6a-1, 6b-1 of the first layer Al-Ifor leading out of input-output independently from the cell of one piece are also provided and are connected 19. The second layer Al-II is provided interposing an insulating layer between them. Connection between the fundamental cell 2 and the I/O cell 5, an electric power source VDD, earthing wirings are provided, Al pads 6a-2, 6b-2 are accumulated directly upon the pads, and when the upper side and lower side Al layers are connected at the place shown with the ? mark, the pads 6a-1, 6a-2 for input and the pads 6b-1, 6b-2 for output are formed being isolated mutually adjoining to the I/O cell. The IC enabled to select voluntarily both of input- output and independent input or output can be obtained from the I/O cell of one piece using the pads of the plural number having constitution mentioned above.
    • 7. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS6028241A
    • 1985-02-13
    • JP13580883
    • 1983-07-27
    • HITACHI LTD
    • TAKECHI MAKOTO
    • H01L21/822H01L21/82H01L23/528H01L27/04H01L27/118
    • PURPOSE:To form a wiring easily while obtaining the optimum arrangement by fitting terminals to the intermediate sections of a plurality of fundamental cell rows and input-output cells and bending and forming the wiring through said terminals when the fundamental cell rows are mounted to the central section of a semiconductor substrate and the input-output cells to the peripheral section of the substrate and the cell rows and the cells are connected mutually by using the wiring. CONSTITUTION:A plurality of fundamental cell rows 3 are respectively formed to the central section of a semiconductor substrate 1 while holding channel regions 4, input-output buffers 2 connected to the cell rows are fitted to the peripheral section of the substrate 1, and bonding pads 5 are connected to the cell rows and the buffers. The cell rows 3 and the buffers 2 are connected by lateral first layer Al wirings 8 crossing each channel region 4 and vertical second layer Al wirings 9, but a plurality of terminals 7 are formed previously among the cell rows and the buffers, and the cell rows and the buffers are each connected through the terminals. Accordingly, wiring inhibiting regions among the end sections of the cell rows 3 and the end sections of the buffers 2 are reduced, and the degree of freedom of the wirings is improved.
    • 8. 发明专利
    • Manufacture of semiconductor integrated circuit device
    • 半导体集成电路器件的制造
    • JPS59132144A
    • 1984-07-30
    • JP590783
    • 1983-01-19
    • Hitachi Ltd
    • YUYAMA YASUSHITAKECHI MAKOTO
    • H01L21/822H01L21/82H01L27/02H01L27/04H01L27/118
    • H01L27/0207
    • PURPOSE:To shorten and facilitate the wiring between variable length cells, by providing an arrangement improving process, by which the variable length cells are exchanged and arranged when the areas of the cells are different. CONSTITUTION:The areas of all variable length cells other than basic variable length cell are the integer times the area of the variable length cell. The variable length cell 3B has the area twice the basic variable length cell 3A. The variable length cell 3A and a variable length cell 3C in the vicinity thereof are combined so that the area becomes equal to the area of the variable cell 3B. The variable length cells 3A and 3B are exchanged and arranged. In this way, the restriction of the arranging pattern of the variable length cells can be eased, and the wiring between the variable length cells is shortened and facilitated.
    • 目的:通过提供一种布置改进过程来缩短和促进可变长度单元之间的布线,当单元的区域不同时,通过该布置改进处理可变长度单元被交换和排列。 构成:基本可变长度单元以外的所有可变长度单元格的区域是可变长度单元格区域的整数倍。 可变长度单元3B具有两倍于基本可变长度单元3A的面积。 可变长度单元3A和其附近的可变长度单元3C组合,使得该面积变得等于可变单元3B的面积。 可变长度单元3A和3B被交换和布置。 以这种方式,可以减轻可变长度单元的布置图案的限制,并且可缩短并简化可变长度单元之间的布线。
    • 9. 发明专利
    • Manufacture of semiconductor device
    • 半导体器件的制造
    • JPS5956762A
    • 1984-04-02
    • JP15328283
    • 1983-08-24
    • Hitachi Ltd
    • TAKECHI MAKOTOKAWAMOTO HIROSHI
    • H01L27/10H01L21/8234H01L21/8242H01L23/522H01L27/06H01L27/108H01L29/78
    • H01L23/522H01L2924/0002H01L2924/00
    • PURPOSE:To contrive to improve the flexibility of wiring design and the integration degree by a method wherein the second wiring layer is enabled to be easily connected directly to a source layer and a drain layer by thinning the film thickness of an interlayer insulation film. CONSTITUTION:Si oxide films 2 are formed on a P type Si substrate 1. P type Si layer 3 are formed under the oxide films 2. The source layer 4 and the drain layer 5 are formed by the selective diffusion of an N type impurity, a polycrystalline Si layer 7, a gate electrode, covered with an Si thermal oxide film 6 is provided on the surface of the Si substrate 1 therebetween, and accordingly an Si gate MOS transistor 8 is formed. Polycrystalline Si layers 9 and 10 serving as the first wiring layer are formed on the upper surface of the Si oxide films 2. A polycrystalline Si layer 13 serving as the second wiring layer is formed on an Si thermal oxide film 12 serving as the layer insulation film. The source layer 4 and the drain layer 14 are connected directly to the wiring layer of a polycrystalline Si layer formed simultaneously with the polycrystalline Si layer 13.
    • 目的:为了通过使层间绝缘膜的膜厚变薄,能够容易地将第二布线层直接连接到源极层和漏极层的方法来提高布线设计的灵活性和集成度。 构成:在P型Si衬底1上形成Si氧化物膜2.在氧化物膜2的下方形成P +型Si层3.源极层4和漏极层5通过选择性扩散N形成 <+>型杂质,在Si衬底1的表面上设置多晶Si层7,覆盖有Si热氧化膜6的栅极,因此形成Si栅极MOS晶体管8。 在Si氧化膜2的上表面上形成用作第一布线层的多晶硅层9和10.作为第二布线层的多晶Si层13形成在作为层绝缘体的Si热氧化膜12上 电影。 源极层4和漏极层14直接连接到与多晶Si层13同时形成的多晶Si层的布线层。