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1. 发明专利

JPS62237743A WAFER MATCHING APPARATUS 失效
公开(公告)号：JPS62237743A
公开(公告)日：1987-10-17
申请号：JP7992886
申请日：1986-04-09
申请人： HITACHI LTD , HITACHI INSTRUMENTS ENG
发明人： NUMATA MITSUHIRO , OTSUKI SHIGEO
IPC分类号： H01L21/68 , H01L21/67
摘要： PURPOSE:To accurately match an eccentric position with respect to a rotary base in a direction of the orientation flat portion of a wafer in a predetermined direction and position by recognizing the orientation flat portion and calculating the eccentric amount with respect to the base to detect the outer edge position in noncontact with the outer periphery of the wafer. CONSTITUTION:A wafer 2 is attracted in vacuum on a rotary base 1, and the base 1 is secured to a rotational shaft 6 rotatably driven via gears 4, 5 by a drive motor 3. A rotating angle detector 7 is provided at the lower end of the shaft 6. A light 10 is emitted through a condensing lens 9 from a light source 8 at the outer edge of the wafer 2 to focus an image at the outer edge position of the wafer 2 on a one-dimensional image sensor 12. After position information data of l/2 rotation of the wafer 2 is input by a controller 13, parameter necessary for wafer matching operation is calculated by the data, and the direction of an orientation flat portion 14 of the wafer 2 and the eccentric position of the base 1 are detected with the parameters.

2. 发明专利

JPH03132054A WAFER CARRIER 失效
公开(公告)号：JPH03132054A
公开(公告)日：1991-06-05
申请号：JP26895889
申请日：1989-10-18
申请人： HITACHI LTD , HITACHI INSTRUMENTS ENG
发明人： SATO TAKASHI , OTSUKI SHIGEO , AOKI YASUSHI
IPC分类号： B65G47/90 , B65G49/07 , B65H5/04 , H01L21/677 , H01L21/68
摘要： PURPOSE:To shorten the time of exchange between the wafer unload after exposure and the load of an unexposed wafer by constituting a carrier arm out of an outer arm, which goes in and out picking up the two opposed sides of a wafer, and an inner arm, which goes in and out picking up the side caught by the two sides or the center. CONSTITUTION:When taking out an unexposed wafer 12a from the pocket at the lowermost stage of a cassette, a cassette 5a is elevated to directly oppose an inner arm 3, and hereafter in the order of arm entry, cassette descent, wafer suction, and arm retreat, the wafer is pulled out being sucked by the inner arm 3. Next, the entire arm 1 is rotated 90 deg. to align orientation flat,and it is opposed directly to a table 6, and in the order of wafer entry, suction release, elevation of a rotary table 7, wafer suction, and arm retreat, the wafer is carried to the table 6. Subsequently, in the order of the descent of the arm 1, the entry of outer arms 2a and 2b, and the descent of the table 7, it is sucked with the outer arms, and the arm 1 is elevated and rotated 90 deg. again, and the wafer is carried onto an exposure stage 9.

3. 发明专利

JP2000326210A ROTARY WORKING DEVICE 失效
公开(公告)号：JP2000326210A
公开(公告)日：2000-11-28
申请号：JP14113799
申请日：1999-05-21
申请人： HITACHI LTD
发明人： OTSUKI SHIGEO , MORIYAMA SHIGEO , KUGAYA TAKASHI , TOGAWA KENICHI , KAJIWARA MAKOTO , OWADA SHUICHI , SUZUKI YUKIO , SHIRAISHI YOKO
IPC分类号： B24B47/22 , B24B49/16 , B24B49/18 , B24B53/00 , B24B53/007 , B24B53/017 , B24B53/02 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To execute the shaping of a surface of a grinding tool without damaging the grinding tool, by comprising a detector for detecting the change of the rotation of a rotating mechanism for totating a tool, and determining the shaping starting height to the grinding tool by the tool on the basis of the detected change of rotation. SOLUTION: In a case when the dressing and the surface shaping of a wafer grind stone 4 is executed by using a grind stone 8, the wafer grind stone 4 is rotated in a state that it is fixed on a surface plate 5. The grind stone 8 is rotated at a high speed of, for example, 10,000 rpm by a spindle motor 10, and finely works a surface of the wafer grind stone 4 rotating at a speed, for example, about 20 rpm, by a cutting amount of μm order. On this occasion, the change of the rotating speed of the spindle motor 10 for adjusting the cutting amount is detected by a speed detector 18 for detecting the contact of the grind stone 8 and the wafer grind stone 4, and a position of a Z moving base 20 is detected by a Z position detector 21 when the change of the rotation is recognized. A shaping starting height of the grind stone 8 is determined on the basis of the position of the Z moving base 20.

4. 发明专利

JP2000263420A SEMICONDUCTOR SUBSTRATE POLISHING DEVICE 失效
公开(公告)号：JP2000263420A
公开(公告)日：2000-09-26
申请号：JP7314399
申请日：1999-03-18
申请人： HITACHI LTD
发明人： KAJIWARA MAKOTO , MORIYAMA SHIGEO , KUGAYA TAKASHI , ISHIDA YOSHIHIRO , FURUKAWA TAKAYASU , OTSUKI SHIGEO , SUZUKI YUKIO , TOGAWA KENICHI , HOUTSUKI MASAHIRO , INAYOSHI KENJI , OWADA SHUICHI
IPC分类号： B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To improve the removing performance of a foreign matter accumulated on a dresser by generating ultrasonic waves in pure water in the washing of the dresser. SOLUTION: This device has a washing tank 31 for a dresser 28, and an ultrasonic wave generator 32 is provided within the washing tank 31 filled with pure water. The washing tank 31 also has a drain port 41 for draining the waste water after washing in the washing tank 31. The dresser 28 is moved to the washing tank 31 by a rocking rotating arm after the dressing of an abrasive pad 21 of hard material is ended. Thereafter, the whole dresser 28 is lowered just under the level 42 of the pure water in which ultrasonic waves are generated, and washed in the left state. The washing time is differed depending on the composition or accumulation degree of the abrasive foreign matter, and when the foreign matter is CeO2, it is about 3-10 min. After washing, the dresser 28 is raised from the level 42 and dried by its own rotation. The waste water after washing in the washing tank 31 is drained through the drain port 41 during the drying of the dresser 28. Thereafter, the washing tank 31 is again filled with pure water.

5. 发明专利

JPH04107947A WAFER CARRIER DEVICE 失效
公开(公告)号：JPH04107947A
公开(公告)日：1992-04-09
申请号：JP22534390
申请日：1990-08-29
申请人： HITACHI LTD
发明人： SATO TAKASHI , OTSUKI SHIGEO
IPC分类号： H01L21/677 , G03F7/20 , H01L21/027
摘要： PURPOSE:To make the accuracy of an apparatus higher by supporting a processing station in a vibration-proof manner on a foundation, by supporting, on one hand, a wafer carrier device separately on the processing station and by providing, on the other hand, the processing station with the alignment means of a wafer. CONSTITUTION:A wafer loader 1 for conducting taking a wafer out from a wafer cassette, causing orientation flats to coincide with each other, exchanging wafers with an exposure station, housing the wafer in the cassette, etc., is mounted on a frame 2 and installed on a floor. On the other hand, the exposure station 3 is mounted on a base 5 provided on a vibration-proof stand 4 for insulating a floor vibration and is composed of the lower half XY driving stage 6 and upper half prealignment theta driving stage 7. Also, a reduction projection optical system 8, prealignment scope 9, etc., are provided on the base 5. Thus, neither vibration by a carrier operation is transmitted to the exposure station nor exposure performance is deteriorated by the occurrence of a measurement error, etc., so that it is possible to obtain a highly reliable wafer carrier device with a simple constitution.

6. 发明专利

JPH09198143A TRANSPORTATION DEVICE 失效
公开(公告)号：JPH09198143A
公开(公告)日：1997-07-31
申请号：JP2843596
申请日：1996-01-22
申请人： HITACHI LTD , HITACHI KIDEN KOGYO KK , HITACHI SEIKO KK
发明人： KUGAYA TAKASHI , OTSUKI SHIGEO , MIYOSHI TOMOSHI , FUJII HIROSHI , TERAJIMA MASAKI , YAMAMOTO MASARU
IPC分类号： H01L21/677 , G05D3/10 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To easily and highly reliably stop at a position provided with a prescribed offset quantity, namely an offset stopping position, from a reference stopping position without fit-changing a reference stopping position striker. SOLUTION: The striker 1 setting the stopping position of the traveling object of a transporting device consists of the reference stopping position striker 11 setting the reference stopping position and comb-shaped strikers 12 and 13 arranged in front of and behind this reference stopping position striker 11. Then two stopping position detecting sensors 31 and 32 detecting these strikers are provided to detect the comb-shaped strikers 12, 13 and the reference stopping position striker 11 while the traveling object travels or stops. Therefore the operation of the stopping position detecting sensors 31 and 32 are mutually confirmed to improve the reliability of striker detection and when the traveling object tops, the stopping position detecting sensors 31 and 32 respectively detect the reference stopping position striker 11 and the comb-shaped strikers 12 and 13 to highly reliably position the position provided with a prescribed offset quantity from the reference stopping position.

7. 发明专利

JPH04361522A SHUTTER CONTROL DEVICE 失效
公开(公告)号：JPH04361522A
公开(公告)日：1992-12-15
申请号：JP13752491
申请日：1991-06-10
申请人： HITACHI LTD
发明人： OTSUKI SHIGEO
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
摘要： PURPOSE:To accurately control an exposure operation by a method wherein a residual light counter, with which the residual light is accurately and quantitatively measured, is provided, the residual light is measured by a computer used for control, and the correction of the residual light is added to exposure amount data which is different for every product lot. CONSTITUTION:A residual light amount counter 16 counts the counter pulse 14 in proportion to the level of illumination from the point of time at which a shutter 2 started a closing movement. The amount of residual light is measured in advance by a controlling computer 7 before an article is exposed, and the new data of exposing amount, which is obtained by deducting the amount of residual light from the exposing-amount data to be set for every article, is set on a counter 8. As a result, the entire amount of exposure, including the amount of residual light, can be controlled. Also, the amount of residual light is measured every time the shutter 2 is moved, the result is compared with the last and the past data of measurement, a judgement is given, a motor is properly controlled, and as a result, a highly precise exposing amount control can be conducted.

8. 发明专利

JP2000317835A FLATTENING MACHINING METHOD AND DEVICE FOR SEMICONDUCTOR 失效
公开(公告)号：JP2000317835A
公开(公告)日：2000-11-21
申请号：JP12673499
申请日：1999-05-07
申请人： HITACHI LTD
发明人： KASHIMA HIDEO , HARADA KUNIO , KANETOMO MASABUMI , FURUKAWA AKIHIRO , KATAGIRI SOUICHI , MORIYAMA SHIGEO , FURUKAWA TAKAYASU , OTSUKI SHIGEO
IPC分类号： B24B53/007 , B24B53/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To execute dressing and brushing process by a single machine by mounting a dressing tool and a brushing tool on a common arm for oscillating the tools from the vicinity of center of rotation of a polishing surface of a grinding wheel surface to the vicinity of the outermost peripheral edge. SOLUTION: An arm 8 having a dressing tool 12 and a brushing tool 19 is disposed through a direct acting guide on an oscillating shaft 5. An annular brushing tool 9 is disposed to surround the dressing tool 12. In the dressing process, the dressing tool 12 is lowered to be in contact with the surface of a grinding wheel 29. By the oscillating shaft 5, the dressing tool is repeatedly oscillated from the vicinity of the center of the grinding wheel 29 to the vicinity of the outermost peripheral edge. Similarly, the brushing process can be executed in parallel. Compressed air is supplied to an air cylinder 27, and the dressing tool is repeatedly oscillated with the brushing tool 19 in contact with the surface of the grinding wheel 29.

9. 发明专利

JP2000277471A METHOD AND DEVICE FOR POLISHING SEMICONDUCTOR SUBSTRATE 失效
公开(公告)号：JP2000277471A
公开(公告)日：2000-10-06
申请号：JP7914299
申请日：1999-03-24
申请人： HITACHI LTD
发明人： TOGAWA KENICHI , MORIYAMA SHIGEO , OTSUKI SHIGEO , KUGAYA TAKASHI , SHIRAISHI YOKO
IPC分类号： B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To stabilize a polishing process by acquiring frictional between a polishing part and the surface of a semiconductor substrate periodically, and deciding the polishing time so that the total value of frictional of a single semiconductor substrate is constant. SOLUTION: Each value of pressurizing amount 22 and revolution speed 21 of wafer holder for friction control, distortion 23 of a wafer holder presser, and revolution speed 24 of a surface plate is multiplied by the contribution factor to friction, and the total value is assumed as friction. The condition of a polishing part reproduction based on the change amount of the assumed friction is immediately applied to a polishing part reproduction process. A total friction up to when polishing of a semiconductor substrate is finished is calculated from F1=Σfln=fl1+fl2+-fln, thus a polishing time is decided, where F is a friction factor, fl1 is friction at the start of a first sheet, fl2 is friction when a second sheet, from the start of the first sheet, is measured, and fln is friction when n-th measurement, from the start of the first sheet, is performed.

10. 发明专利

JP2000133689A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000133689A
公开(公告)日：2000-05-12
申请号：JP30065398
申请日：1998-10-22
申请人： HITACHI LTD
发明人： SUZUKI YUKIO , MORIYAMA SHIGEO , KUGAYA TAKASHI , ISHIDA YOSHIHIRO , FURUKAWA TAKAYASU , OWADA SHUICHI , HOUTSUKI MASAHIRO , INAYOSHI KENJI , OTSUKI SHIGEO , TOGAWA KENICHI , KAJIWARA MAKOTO
IPC分类号： H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To shorten the distance between modules regardless of the distances between the outer packages of the modules and the stages on the modules, by a method wherein one part of a wafer transfer unit or one part of the operating space of the transfer unit is housed in the modules even at the times of the operations other than the operations at the time when the transfer unit puts a wafer on the stages or takes the wafer from the stages or the time of standby of the transfer unit. SOLUTION: A transfer of a wafer from a module 15 to a module 18 is executed by a method wherein a wafer transfer unit 11 takes out the wafer, which is put on a wafer stage 16 on the module 15, and the unit 11 puts the wafer on a wafer stage 19 on the module 18. The unit 11 is a robot and is constituted of an arm 12 and a drum body 13. There is a space 17, wherein one part of the unit 11 or one part of the operating space 14 of the unit 11 is housed even at the time of the operations other than the operations at the time when the unit 11 puts the wafer on the stage 16 or takes the wafer from the stage 16 or the time of standby of the unit 11 in the module 15, and there is the same space 10 as the space 11 also on the module 18.

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