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1. 发明专利

JPH08285715A TRANSMITTER 失效
公开(公告)号：JPH08285715A
公开(公告)日：1996-11-01
申请号：JP9218695
申请日：1995-04-18
申请人： HITACHI LTD
发明人： NAGASU AKIRA , HOUTSUKI MASAHIRO
IPC分类号： G01L19/00
摘要： PURPOSE: To obtain a detachable transmitter which can be reused by removing and repairing only a diaphragm touching the cleaning liquid. CONSTITUTION: A capillary tube 4 is welded, respectively at the opposite ends thereof, with a body flange 2 and a connection metal 8 such that no gap is formed on the side touching an encapsulated liquid. The body flange 2 is fastened to the body 1 by means of bolts 11 and sealed through an O-ring 9. The connection metal 8 is fastened to a flange 5 touching the liquid by means of bolts 12 and sealed through an O-ring 10.

2. 发明专利

JP2000263420A SEMICONDUCTOR SUBSTRATE POLISHING DEVICE 失效
公开(公告)号：JP2000263420A
公开(公告)日：2000-09-26
申请号：JP7314399
申请日：1999-03-18
申请人： HITACHI LTD
发明人： KAJIWARA MAKOTO , MORIYAMA SHIGEO , KUGAYA TAKASHI , ISHIDA YOSHIHIRO , FURUKAWA TAKAYASU , OTSUKI SHIGEO , SUZUKI YUKIO , TOGAWA KENICHI , HOUTSUKI MASAHIRO , INAYOSHI KENJI , OWADA SHUICHI
IPC分类号： B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To improve the removing performance of a foreign matter accumulated on a dresser by generating ultrasonic waves in pure water in the washing of the dresser. SOLUTION: This device has a washing tank 31 for a dresser 28, and an ultrasonic wave generator 32 is provided within the washing tank 31 filled with pure water. The washing tank 31 also has a drain port 41 for draining the waste water after washing in the washing tank 31. The dresser 28 is moved to the washing tank 31 by a rocking rotating arm after the dressing of an abrasive pad 21 of hard material is ended. Thereafter, the whole dresser 28 is lowered just under the level 42 of the pure water in which ultrasonic waves are generated, and washed in the left state. The washing time is differed depending on the composition or accumulation degree of the abrasive foreign matter, and when the foreign matter is CeO2, it is about 3-10 min. After washing, the dresser 28 is raised from the level 42 and dried by its own rotation. The waste water after washing in the washing tank 31 is drained through the drain port 41 during the drying of the dresser 28. Thereafter, the washing tank 31 is again filled with pure water.

3. 发明专利

JP2000326212A APPARATUS AND METHOD FOR FLATLY GRINDING SEMICONDUCTOR BOARD 失效
公开(公告)号：JP2000326212A
公开(公告)日：2000-11-28
申请号：JP13372499
申请日：1999-05-14
申请人： HITACHI LTD
发明人： HOUTSUKI MASAHIRO , MORIYAMA SHIGEO , SUZUKI YUKIO , KAJIWARA MAKOTO , OWADA SHUICHI , INAYOSHI KENJI , OTSUKI SHIGEO , TOGAWA KENICHI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To prevent the excess expansion of a bag and to prevent the failure of a semiconductor board in the grinding of the semiconductor board while pressing the semiconductor board onto a surface of a grinding tool and utilizing the static pressure of the fluid inside of a bag made of an elastic body, by opening and closing the pressure releasing portion formed on the bag in interlocking with the expansion and contraction of the bag. SOLUTION: In the case where a wafer 1 as a semiconductor board is ground, the wafer 1 is pressed to a grind stone 20 by adding the pneumatics to a bag 22 made of an elastic body mounted on a rotatable holder board 21 through a pressure supply channel 23. On this occasion, when the load W to be added to the holder board 21 is reduced, the pressure in the bag 22 is increased, and the bag is expanded and finally bursted. A pressure releasing valve 25 is mounted on a pressure opening portion formed on the bag 22. The pressure releasing valve 25 is formed in such manner that a linear material 28 is pulled when the expansion of the bag 22 is advanced, and a spherical body 29 mounted on a point of the linear material 28 is separated from a valve seat, that is, the pressure in the bag 22 is released by the opening of the valve, and the excess expansion of the bag 22 can be prevented.

4. 发明专利

JPH10300660A DEVICE FOR OBSERVING EMISSION 失效
公开(公告)号：JPH10300660A
公开(公告)日：1998-11-13
申请号：JP10705297
申请日：1997-04-24
申请人： HITACHI LTD
发明人： HOUTSUKI MASAHIRO , FURUKAWA TAKAYASU , AMITANI SHIGERU , YASUDA KENJI
IPC分类号： G01J3/443 , G01N21/01 , G01N21/62
摘要： PROBLEM TO BE SOLVED: To prepare a dark room simultaneously with camera switching at the time of detecting a very weak emission, to make it unnecessary to input a whole device in a large dark room, and to miniaturize a device including the dark room by integrally constituting a camera for detecting very weak emission and an elastic body being the upper cover of the dark room. SOLUTION: A camera 3 for detecting very weak emission and a camera 6 for observing an emitting substance are fixed to a base 10 moving right and left. The cameras 3 and 6 are provided with mechanisms 8 moving up and down. This device is provided with a camera switching mechanism for operating camera switching by the right and left movement of the base 10 and the up and down moving mechanisms 8 of the cameras and a compact box 1 without any ceiling in which an emitting substance is inputted. The camera 3 for detecting the very weak emission and an elastic body being the upper cover of the dark room are fixed, and the camera 3 for detecting the very weak emission and the upper cover of the dark room are simultaneously moved so that the dark room can be prepared only at the time of detecting the very weak emission.

5. 发明专利

JP2001053037A DEVICE FOR PLANARIZING SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2001053037A
公开(公告)日：2001-02-23
申请号：JP22628099
申请日：1999-08-10
申请人： HITACHI LTD , NIPPON TOKUSHU KENTO KK
发明人： INAYOSHI KENJI , MORIYAMA SHIGEO , FURUKAWA TAKAYASU , HOUTSUKI MASAHIRO , NAYA KENJI
IPC分类号： B24B1/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To prevent a grindstone from chipping, improve dressing accuracy of the grindstone and prevent a side slip of the grindstone due to sliding friction between a semiconductor wafer and grindstone segments when a wafer surface is planarized with a segmented grindstone. SOLUTION: A grindstone 20 for planarizing the surface of a processed wafer 1 is one used in a fixed abrasive grain grinding method and divided into a plurality of segments. These segments are bonded on a similarly segmented grindstone base 51 and then replaceably mounted on a surface plate 12 via the grindstone base 51. A gap between the grindstone segments is set to be 0.2-2 mm. The grindstone segments 20 are surface attracted to the surface plate 12. Keys for accepting sliding friction caused by wafer planarization via the grindstone base are disposed on the surface plate.

6. 发明专利

JP2000133689A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000133689A
公开(公告)日：2000-05-12
申请号：JP30065398
申请日：1998-10-22
申请人： HITACHI LTD
发明人： SUZUKI YUKIO , MORIYAMA SHIGEO , KUGAYA TAKASHI , ISHIDA YOSHIHIRO , FURUKAWA TAKAYASU , OWADA SHUICHI , HOUTSUKI MASAHIRO , INAYOSHI KENJI , OTSUKI SHIGEO , TOGAWA KENICHI , KAJIWARA MAKOTO
IPC分类号： H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To shorten the distance between modules regardless of the distances between the outer packages of the modules and the stages on the modules, by a method wherein one part of a wafer transfer unit or one part of the operating space of the transfer unit is housed in the modules even at the times of the operations other than the operations at the time when the transfer unit puts a wafer on the stages or takes the wafer from the stages or the time of standby of the transfer unit. SOLUTION: A transfer of a wafer from a module 15 to a module 18 is executed by a method wherein a wafer transfer unit 11 takes out the wafer, which is put on a wafer stage 16 on the module 15, and the unit 11 puts the wafer on a wafer stage 19 on the module 18. The unit 11 is a robot and is constituted of an arm 12 and a drum body 13. There is a space 17, wherein one part of the unit 11 or one part of the operating space 14 of the unit 11 is housed even at the time of the operations other than the operations at the time when the unit 11 puts the wafer on the stage 16 or takes the wafer from the stage 16 or the time of standby of the unit 11 in the module 15, and there is the same space 10 as the space 11 also on the module 18.

7. 发明专利

JP2000127023A POLISHING METHOD FOR SEMICONDUCTOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000127023A
公开(公告)日：2000-05-09
申请号：JP30503498
申请日：1998-10-27
申请人： HITACHI LTD
发明人： OWADA SHUICHI , MORIYAMA SHIGEO , SUZUKI YUKIO , HOUTSUKI MASAHIRO , INAYOSHI KENJI , KAJIWARA MAKOTO , OTSUKI SHIGEO , TOGAWA KENICHI
IPC分类号： B24B53/017 , B81C99/00 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To enable flattening working having high accuracy, high efficiency and low cost without generating working damage by making it possible to exchange the edge of a blade of a dress tool and to adjust the height of the edge of the blade. SOLUTION: On a dressing part 200 for dressing, a small-sized throw away tip 201 is mounted with a screw 202. It is desirable that a plurality of these small-sized throw away tips 201 are provided so as to improve dynamic balance at the time of rotation. As a result, an exchanging work at the time of maintenance becomes easy. Because the small-sized throw-away tips 201 are easy to fix with a dressing tool because the throw-away tips 201 are large, falling of the throw away tips 201 can be prevented and clutch becomes difficult to be generated. Further, because the small-sized throw away chips 201 can be adjusted in height with the screws 202, changes in cutting location can be prevented in sizing dressing and stable dressing can be performed for a long period.

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