专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004197010A Heat resistant adhesive, method for producing the same, and semiconductor device using the same 审中-公开
公开(公告)号：JP2004197010A
公开(公告)日：2004-07-15
申请号：JP2002369163
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C09J163/00 , C09J9/02 , C09J183/04 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01087 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive comprised of a thermosetting resin composition, which is liquid at room temperature(25°C) and excellent in workability such as casting etc. because of its low viscosity and gives after curing a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, and a semiconductor device using it. SOLUTION: The heat resistant adhesive comprises a thermosetting resin composition whose essential components are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by general formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by general formula (2) (wherein A is a divalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JPH11204943A ELECTRONIC CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH11204943A
公开(公告)日：1999-07-30
申请号：JP239698
申请日：1998-01-08
申请人： HITACHI LTD , HITACHI CABLE
发明人： TENMYO HIROYUKI , ISHINO MASAKAZU , AMAMIYA KYOKO , ONDA MAMORU , SATO TAKASHI , MURAKAMI TOMIO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To ensure reliable connection of conductors between upper and lower sheets in a multilayer electric circuit board which is produced by stacking insulator sheets on which conductor layers are formed and bonding the upper and lower layers. SOLUTION: An electric circuit board has a plurality of stacked insulator films 11, conductor patterns 15, 13 provided on the insulator films 11, and an adhesive layer 12 for bonding the insulator films 11. An alloy layer 27 is formed at the upper and lower junctions of the conductor pattern 15 in a step of heating and pressing the insulator films.

3. 发明专利

JP2000294933A MULTILAYER CIRCUIT SUBSTRATE AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000294933A
公开(公告)日：2000-10-20
申请号：JP9714199
申请日：1999-04-05
申请人： HITACHI LTD , HITACHI CABLE
发明人： ISHINO MASAKAZU , TENMYO HIROYUKI , ONDA MAMORU , SATO TAKASHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve the heat resistance property of a junction metal by using tin plating with copper ground as the junction metal of a via for electrically connecting a plurality of adjacent circuit boards and forming a tin/copper alloy for electrical connection. SOLUTION: A copper foil 102 is affixed to a polyimide film 101 as an insulation layer, a laser beam is applied from the reverse side of the film 101, and a blind via 103 where the surface copper foil 102 becomes a stopper is formed. A copper via 104 is formed so that a salient electrode can be formed by filling plating copper into the via 103. After that, a protective film 106 is affixed to the reverse side of the film 101, and a photolithographic process is made, thus allowing a resist 107 to remain at a required part. With the resist 107 as a mask, unwanted copper is eliminated by etching and a copper foil pattern 108 is formed, then a tin layer is laminated, and further an adhesive film 110 is affixed to the reverse side of the film 101 and is subjected to thermocompression bonding, thus forming a tin/copper alloy for electrical connection.

4. 发明专利

JP2004200354A Wiring board and method of manufacturing the same, and member therefor and method of manufacturing the same 审中-公开
公开(公告)号：JP2004200354A
公开(公告)日：2004-07-15
申请号：JP2002366261
申请日：2002-12-18
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： ONDA MAMORU , SATO TAKASHI , YAMADA HIROSHI , KOIZUMI TOYOHARU , SUZUKI MASAHIRO , TAKAHASHI AKIO
IPC分类号： C08L63/00 , C08L79/08 , C08L83/04 , C08L101/00 , H01L23/14 , H05K1/03 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent deformation of the wiring board at the temperature near the soldering temperature without providing any base material for the reinforcement to an insulated substrate in the wiring board, in which the wiring is provided on the surface of the insulated substrate using a resin material or on the surface and interior of the same substrate. SOLUTION: The insulated substrate is formed as the wiring board comprising an oligomer type organic silicon compound which is generated with the reaction between the organic silicon compound expressed by the following chemical formula (R is an organic group including an functional group which shows additional reaction with the epoxy resin, and R' is a methyl group or ethyl group), a hardening agent which realize hardening through the additional reaction of the epoxy resin and the oligomer type organic silicon compound, and a resin material formed through thermal hardening of a mixture of the functional group which is easily coupled with hydrogen and a compound including the reactive unsaturated coupling. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004197009A Thermosetting resin, method for producing the same, and its product 审中-公开
公开(公告)号：JP2004197009A
公开(公告)日：2004-07-15
申请号：JP2002369159
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C08L63/00 , C08K3/00 , C08L35/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/83192 , H01L2224/92125 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solventless thermosetting resin composition, which is excellent in workability such as casting because it is liquid of low viscosity at room temperature(25°C) and gives, after curing, a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, a method for producing the same and its product. SOLUTION: Essential components of the thermosetting resin composition are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by formula (2) (wherein A is a bivalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2001358255A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREFOR, AND INSULATING TAPE SUBSTRATE FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2001358255A
公开(公告)日：2001-12-26
申请号：JP2000177357
申请日：2000-06-13
申请人： HITACHI LTD , HITACHI CABLE
发明人： MORITA TOSHIAKI , KAJIWARA RYOICHI , KOIZUMI MASAHIRO , TAKAHASHI KAZUYA , ONDA MAMORU , SATO TAKUMI , NISHIMURA HIDETO , SATO TAKASHI
IPC分类号： H01L23/12 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package by which the electrode of a semiconductor chip is sturdily bonded to the metal wiring of an insulating tape substrate without damage, and the insulating tape substrate for the semiconductor package. SOLUTION: When a plurality of electrode pads 2 formed on a semiconductor chip 1 are directly connected to a plurality of metal wirings 5 formed on an insulating tape substrate 7 mounted on the semiconductor chip 1, the metal wirings 5 are made of a copper alloy having a Vicker's hardness of from 60 to 100 and plated with gold of from 0.01 μm to 0.8 μm in thickness. The metal wirings 5 are bonded to the electrode pads 2 by applying heat and load and transverse ultrasonic vibrations of a frequency of 100 kHz and an amplitude of 1.5 μm or less so that an intermetallic compound made of bonded both metals is formed at the outer peripheral portion and the center portion of the connection interface between the metal wirings 5 and the electrode pads 2.

7. 发明专利

JPH0337916A METHOD AND DEVICE FOR STRANDING ELECTRIC WIRE 失效
公开(公告)号：JPH0337916A
公开(公告)日：1991-02-19
申请号：JP17052689
申请日：1989-06-30
申请人： HITACHI CABLE
发明人： ITO HIROAKI , NIREKI TADASHI , SATO TAKASHI , SUGANO MAKOTO
IPC分类号： H01B13/02
摘要： PURPOSE:To obtain a stranded wire through a single process free from untwisting by preforming wires with a twisting pitch shorter than that as desired for electric wire before twisting wires pass through a collecting board. CONSTITUTION:Before twisted wires 11 pass through a collecting board 3, each of them 11 is preformed with a pitch shorter than that as desired for an electric wire, and later, when the wires 11 are twisted, they are twisted such that the desired twisting pitch can provided by somewhat lengthily untwisting the piches of the preformed wires. That is, one of wire holders 2 is fixed and the other of them is fixed provided with an angle of rotation to make the wires 11 pass through the collecting board 3 in a twisting condition with the result that the wires 11 can be plastically deformed depending on the degrees of an angle of rotation and preformed. If these wires 11 are a little over-preformed, it is possible to get a twisting pitch just as desired thanks to untwisting which will take place later and to be free from untwisting. It is thus possible to get a strand free from untwisting through a single process.

8. 发明专利

JPH10209224A MANUFACTURE OF SEMICONDUCTOR DEVICE AND TAB TAPE 失效
公开(公告)号：JPH10209224A
公开(公告)日：1998-08-07
申请号：JP639497
申请日：1997-01-17
申请人： HITACHI CABLE
发明人： ONDA MAMORU , MURAKAMI HAJIME , SATO TAKASHI , NIIZAWA MASAHARU , OKABE NORIO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To enable to manufacture, with relative ease, simple configuration without complex process, wherein the interface between polyimide film and sealing resin does not carse peel-off, crack does not occur at the sealing resin, by attaching a reinforcing material and a ball terminal before attaching a semiconductor element. SOLUTION: When a semiconductor device is to be manufactured by attaching, a semiconductor element, a reinforcing material 7 for reinforcing tape, and a ball terminal 5 are fit to a TAB tape 15 and then performing resin- sealing, the reinforcing material 7 and the ball terminal 5 are attached before the semiconductor element is attached. For example, to the TAB tape 15 where the semiconductor element is not yet mounted, a stiffener 7 obtained by working a copper plate of 1.0mm thickness into a window frame shape is pasted with an epoxy-group bonding agent, then heated to solidify the bonding agent, for drying the water content in a polymide resin. Then, a Pb-Sn based eutectic solder ball terminal of 0.6mmϕ is mounted with flux, while the ball terminal 5 is connected to the land of TAB tape 15 through a reflow furnace.

9. 发明专利

JPH01191784A METHOD AND DEVICE FOR TREATING INSIDE SURFACE OF PIPE MATERIAL 失效
公开(公告)号：JPH01191784A
公开(公告)日：1989-08-01
申请号：JP1604888
申请日：1988-01-27
申请人： HITACHI CABLE
发明人： ITO YASUHIKO , SATO TAKASHI
IPC分类号： C23C22/73 , B05C7/08 , B05D7/14 , B05D7/22
摘要： PURPOSE:To treat the inside surface of a metallic pipe so as to obtain a film having a uniform thickness even if the amt. of a film material decreases by increasing the sectional area of the spacing for passage of the film material according to a decrease in the film material passing the hole of a plug with a decrease in the diameter of the metallic pipe material. CONSTITUTION:The pipe material 1 is drawn by 1st and 2nd dies 6a, 6b and is reduced in the diameter in 2 stages when said material is drawn in an arrow direction. A high-polymer material 2 which is previously injected therein is moved together with the pipe material 1 and a part thereof is fed through the hole 11a of a cap 11 into the hole 8a of the plug 8 and is supplied from the spacing with a tapered bar plug 9 into the bored plug 5. The elastic force of a spring 10 overcomes the pressure in the pipe material 1 exerted on a resistance disk 12 and moves the plug 9 in an arrow A direction when the amt. of the material 2 decreases on progression of the consumption thereof and the pressure in the pipe material decreases during this time. The spacing for the passage of the material 2 is, therefore, increased and always the specified amt. of the material 2 can be supplied to the plug 5. The film 7 having the uniform film thickness is thus formed by the plug 3 for coating even if the amt. of the material 2 decreases.

10. 发明专利

JP2004063710A Wiring board and electronic evice, and method for manufacturing the same 审中-公开
公开(公告)号：JP2004063710A
公开(公告)日：2004-02-26
申请号：JP2002219067
申请日：2002-07-29
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ONDA MAMORU , YOSHIKAZU TAKAYUKI , SATO TAKASHI , KOIZUMI TOYOHARU
IPC分类号： H05K1/14 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of inspecting a conductivity of a wiring board comprising a rigid board and a felxible substrate before connecting the rigid board and the flexible substrate. SOLUTION: A wiring board comprises a first wiring board 1 with wirings 102 (conductive patterns) provided on the surface, or on the surface and inside, and a second wiring substrate 2 with wirings 202 (conductive patterns) provided on the surface of a film insulation substrate. The substrate 2 is connected to the board 1 so that the wirings 202 provided on the surface of the board 1 are drawn outside region of the board 1, and the wirings 102 of the board 1 and the wirings 202 of the substrate 2 are electrically connected by projective conductors 203. COPYRIGHT: (C)2004,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式