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    • 2. 发明专利
    • CHAR CONVEYING EQUIPMENT
    • JPH1081886A
    • 1998-03-31
    • JP23548696
    • 1996-09-05
    • HITACHI LTDBABCOCK HITACHI KK
    • TANAKA SHINJIKOYAMA SHUNTAROMORIHARA ATSUSHINAGANUMA YOSHIOTAKAHASHI SADAOKIDA EIJI
    • C10J3/50
    • PROBLEM TO BE SOLVED: To provide char conveying equipment which can feed finer char particles into an oven without stagnation while separating the char discharged from a coal gasifier and collected by a cyclone into finer and coarser particles by subjecting it to an air stream without resort to mechanical means. SOLUTION: This equipment has a swirling air stream container 57 which is provided at the center on the top thereof with a char inlet pipe 71 for introducing char 25 from a cyclone and in which a swirling stream around the gravitational axis is formed by a conveying gas 27, a char discharge pipe 41 drooping from the peripheral part at the bottom of the container 57, a char conveying duct 31 branching horizontally from the pipe 41 at its lower end and extending to a coal gasifier, and a coarse particle separation pipe 72 drooping from the bottom port of the pipe 41. The char 25 is continuously sucked into the center of the swirling stream in the container 57 and allowed to flow out through the pipe 41 by the conveying gas 27, and char particles coarser than a certain size corresponding to the speed of the gas flowing down in the pipe 72 are allowed to fall, while finer char particles 25' are continuously conveyed through the duct 31.
    • 6. 发明专利
    • WASTE-HEAT GENERATOR SYSTEM
    • JPH07332637A
    • 1995-12-22
    • JP12855094
    • 1994-06-10
    • HITACHI LTD
    • NAGANUMA YOSHIOYAMADA AKIRASUZUKI TOMOKO
    • F23G5/04F22B1/18F23G5/44F23G5/46
    • PURPOSE:To temporarily store heat and effectively utilize waste heat by guiding the exhaust heat or the excessive heat generated upon incineration to a garbage pit in which the collected garbage is temporarily stored, taking out the heat applied to the garbage in the garbage pit and using the garbage pit for the storage of the garbage and heat accumulation. CONSTITUTION:Collected garbage is supplied to a garbage pit 1 from a garbage loading port 12 and temporarily stored therein until it is burnt in an incinerator 1. Then, the garbage is sequentially thrown into the incinerator 2 by a garbage crane 10 and a bucket 11 and burnt. The burnt ash 21 is collected in the lower part of the incinerator 2. Combustion gas 28 is guided to a boiler 3 to generate steam and the steam is guided to a steam turbine 7 to generate electricity by a generator 8. The steam flowing out of the steam turbine 7 is returned to the boiler 3 through a condenser 9 and reused. This return steam is fed to the garbage pit 1 to be directly heat exchanged with the garbage. Further. the combustion gas 28 is exhausted as combustion exhaust gas 29 from a funnel 5, so that a system can be effectively employed.
    • 7. 发明专利
    • CITY LIFELINE OPERATION MANAGEMENT SYSTEM
    • JPH06251030A
    • 1994-09-09
    • JP3516593
    • 1993-02-24
    • HITACHI LTD
    • NAGANUMA YOSHIOYAMADA AKIHIKOENBUTSU ICHIROUBABA KENJI
    • B65G61/00H02J3/14H02J13/00G06F15/21
    • PURPOSE:To prevent a waste of resources and energy and to reduce the load on circumstances by operating and managing a city equipment system as the object based on operation and management information where mutual relations between city equipment systems are taken into consideration. CONSTITUTION:Each city equipment system has peculiar operation and management information 10 required for its operation and management and is provided with an information communication network means 11 which freely takes out operation and management information of the other city equipment system besides this individual operation and management information 10, an information integrated management means 12 which manages taken-out operation and management information correspondingly to information of the position where this information exists, and a common information extracting means 13 which takes out information common to operation and management information of its own system from operation and management information of respective city equipment systems. Common operation and management information of equipment management related to respective city equipment systems is used to control the operation and the management of each system in cooperation between related city equipment systems.
    • 10. 发明专利
    • METHOD AND DEVICE FOR COOLING MULTICHIP MODULE
    • JPH04152659A
    • 1992-05-26
    • JP27633890
    • 1990-10-17
    • HITACHI LTD
    • NAGANUMA YOSHIOMORIHARA ATSUSHIOUCHI KAZUNORISATO YASUSHIKAJI RYUICHIMIYADERA HIROSHIOGURO TAKAHIROZUSHI SHIZUO
    • H01L23/473
    • PURPOSE:To enable a cooling device to be separately controlling in cooling capacity for each semiconductor element even when a multichip module is mounted in an operating condition by a method wherein the temperature of each semiconductor element mounted on a board is detected, and cooling medium supplied to a heat transfer plane which cools down the semiconductor element is changed in flow rate on the basis of the detected temperature. CONSTITUTION:Cooling medium fed from an inlet 7 is supplied and disturbed through a nozzle 11 of a header 10 provided for each semiconductor element 2, the jet of the cooling medium cools a part of a heat transfer surface 9 correspondent to the semiconductor element 2, and is discharged through an outlet as collected passing through an element arrangement structure. A valve 12 is formed cone-shaped, connected to the heat transfer surface 19 with a spring 13 of shape memory alloy, and guided by a valve support 14 so as to move changing the nozzle 11 in aperture in accordance with the shrinkage or the expansion of the spring 13. heat released from each semiconductor element is conducted through the intermediary of the heat transfer surface 9 and detected by the shape memory alloy spring 13, the valve 12 is changed in aperture by the spring 13 concerned, so that the semiconductor element can be kept constant at a certain temperature without being affected by the variation of a heat conductive compound in thickness or the change of a semiconductor element in heat release value.