会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPS61258488A
    • 1986-11-15
    • JP9955685
    • 1985-05-13
    • HITACHI LTD
    • UOMI KAZUHISAKAYANE NAOKIKAJIMURA TAKASHIFUKUZAWA TADASHISASAKI YOSHIMITSU
    • H01S5/00
    • PURPOSE:To obtain a semiconductor laser having low aberration of laser light, low noise and high reliability, by providing at least a pair of layered dielectric films each of which has a specific refractive index, on each of two reflecting surfaces constituting an optical resonator. CONSTITUTION:An N-type Ga0.55Al0.45As clad layer 4 and a P-type GaAs cap layer 3 are provided on an N-type GaAs substrate 7, sequentially in that order, and a P-side electrode 8 and an N-side electrode 9 are formed. SiO2 is then provided on both the reflecting surfaces as first dielectric films. Amorphous Si films are formed thereon as second dielectric films. A quantum well layer is formed in stripes for transverse mode control in which five layers of Ga0.9 Al0.1As 5b and six layers of Ga0.7Al0.3As are layered alternately. The end faces on which the dielectric films are adhered have a reflectivity of about 40-85% as determined by a material used, producing conditions and thicknesses of the films. When the reflectivity is 50% or more, it has an effect of decreasing noise. According to this method, a semiconductor laser having low aberration of laser light, low noise and high reliability can be obtained.
    • 5. 发明专利
    • Information pickup device using semiconductor laser
    • 使用半导体激光器的信息拾取器件
    • JPS5933641A
    • 1984-02-23
    • JP13274683
    • 1983-07-22
    • Hitachi Ltd
    • AIKI KUNIOSASAKI YOSHIMITSUSUGIYAMA TOSHIOMAEDA TAKESHIOSHIMA MASAHIRO
    • G11B7/125G11B7/12H01S5/00
    • G11B7/123
    • PURPOSE:To improve the optical coupling efficiency of reproducing laser light and to ensure the stable reproduction of information, by setting both the light emitting end face of a semiconductor laser and the photodetecting surface of a photodetecting element in a container staring them so that they are put on a straight line to the light transmitting window of the container. CONSTITUTION:A light transmitting window 9, the light emitting end face of a semiconductor laser 1 and the photodetecting surface of a photodetecting element 2 are set in a container so that they are approximately put on a straight line along an axial line passing through the center of a support ring. The laser light radiated from a light transmitting part is irradiated on the surface 3 of an optical disk, and the information recorded on the surface 3 is reproduced by means of the reflected light given from the surface 3. Thus the reproducing laser light is extracted from the upper surface of the container with use of a single light emitting part. This extracted laser light is fitted to a cylinder which supports optical systems 4 and 4' that lead the laser light to the surface 3. This device facilitates coupling of laser light as well as position matching of optical axes. As a result, the optical coupling efficiency is improved for the reproducing laser light.
    • 目的:为了提高再现激光的光耦合效率并确保信息的稳定再现,通过将半导体激光器的发光端面和受光元件的光检测面两者设置在容器中,使其成为 放在容器的透光窗口的直线上。 构成:将透光窗9,半导体激光器1的发光端面和受光元件2的受光面设置在容器中,使其大致沿着穿过中心的轴线放置在直线上 的支撑环。 从光传输部分照射的激光照射在光盘的表面3上,并且通过从表面3给出的反射光再现记录在表面3上的信息。因此,再现激光从 使用单个发光部分的容器的上表面。 该提取的激光被装配到支撑将激光导向表面3的光学系统4和4'的圆柱体。该装置有助于激光的耦合以及光轴的位置匹配。 结果,再现激光的光耦合效率得到改善。
    • 10. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH03101266A
    • 1991-04-26
    • JP23703689
    • 1989-09-14
    • HITACHI LTD
    • KURODA TAKARONAKAMURA HITOSHIUCHIDA YOKOSASAKI YOSHIMITSUMIYAZAKI TAKAO
    • H01L27/14
    • PURPOSE:To eliminate thermal metamorphism of a substrate by forming a number of layers of hetero junctions on a semiinsulating InP substrate in one operation of MBE method and by forming an HEMT and a pin photodiode simultaneously. CONSTITUTION:A HEMT construction which consists of a buffer layer 11, a channel layer 12, a spacer layer 13, and a carrier supply layer 14 is formed on a semiinsulating InP substrate 1 by using MBE method. A pin photodiode structure is formed thereon, which consists of an undoped InGaAs photoabsorbing layer 15/p InAlAs layer 16/a p InGaAs contact layer 17. Then, mesa etching is carried out as far as a semiinsulating InP substrate. As for a pin photodiode A, an N-type ohmic electrode 2 is formed on a two-dimensional electronic gas layer or HEMT and a P-type electrode 4 is formed on the p InGaAs contact layer 17 by vaporization. Then, a source electrode 21 and a drain electrode 22 are formed in a part B of HEMT by AuGe/Ni/Au metal and Al is deposited as a gate electrode 3. In a part of a resistance C, AuGe/Ni/ Au ohmic electrodes 23, 24 are formed. Thereby, a photosensitive OEIC can be manufactured using only a highly reliable simplified process.