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1. 发明专利

JPH11135691A ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JPH11135691A
公开(公告)日：1999-05-21
申请号：JP29984997
申请日：1997-10-31
申请人： HITACHI LTD
发明人： OKADA RYOJI , OSANAWA TAKASHI , TAGUCHI KEIJI , HONMA MITSURU
IPC分类号： H01L23/36 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To realize an electronic circuit device which dissipates heat from a semiconductor element effectively and prevents hindrances due to thermal deformation. SOLUTION: Resin 6 coated with grease or oil is arranged between a chip carrier 2 and thermal conductor 3. The chip carrier 2 is brought closely into contact with the thermal conductor 3 via the resin 6. Thereby the irregularities of height and inclination of the chip carrier 2 can be canceled by elasticity of the resin 6, and an superior state of close contact can be obtained. Contact thermal resistance due be significantly reduced by the satisfactory state of close contact and the application of grease or oil.

2. 发明专利

JPH11111897A MULTI-CHIP SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11111897A
公开(公告)日：1999-04-23
申请号：JP27084297
申请日：1997-10-03
申请人： HITACHI LTD
发明人： OKADA RYOJI , OSANAWA TAKASHI , TAGUCHI KEIJI , NAKAJIMA TADAKATSU
IPC分类号： H01L23/36 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To enhance heat transmission characteristics by sealing grease or oil in a region defined by a frame-like resin, a plate and the contact face of a heat spreader and bringing the plate coated with grease or oil into tight contact with a semiconductor element or a chip carrier. SOLUTION: A plate 5 is coated with a frame-like resin 6 which is then injected with a sufficient quantity of grease 7 having high heat conductivity. A heat spreader 2 is then mounted thereon and heated while applying an appropriate load. Consequently, the frame-like resin 6 touches the contact face of the heat spreader 2 before being cured to deformed in the thickness direction thus eliminating fluctuation in the height of a chip carrier 1. When it is heated under that state, the frame-like resin 6 is cured and adheres to the heat spreader 2 and the plate 5 thus enclosing the grease 7 having high heat conductivity. After it is cooled down, the heat spreader 2 is taken out and the plate 5 bonded through the frame-like resin 6 is coated with oil 71. Finally, a wiring board 3 and the heat spreader 2 bonded with the frame-like resin 6 and the plate 5 are tightened by means of bolts.

3. 发明专利

JPH09144689A PUMP AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH09144689A
公开(公告)日：1997-06-03
申请号：JP23536096
申请日：1996-09-05
申请人： HITACHI LTD
发明人： OKADA RYOJI , TAGUCHI KEIJI , UEYAMA TOSHIHARU , KATSURA HIROYUKI
IPC分类号： F04D29/02 , F04D29/24
摘要： PROBLEM TO BE SOLVED: To secure high corrosion resistance and abrasion resistance in the case where water having high dissolved oxygen concentration is taken by covering a part of or all surfaces of a shaft or an impeller surface with a film impregnating resin or glass and including Cr. SOLUTION: The shaft 3 of a boiler water feed pump is formed of, for example 13% Cr + several % Mo steel material, and it is covered with hard plating film 8 formed by electric plating method. Since multiple file cracks 110 which exceed the vicinity of an interface between the shaft 3 and the film 8 surface exist on the film 8, in this case, treatment is carried out so as to impregnate fluorocarbon resin 111 in the fine cracks 110. Electric corrosion is prevented in the interface between the film 8 and the shaft 3 without that oxygen exceeds the shaft 3 surface even in water having high dissolved oxygen concentration. Since the hard Cr plating film 8 is hard for 800 to 1000 degree in hardness, it is possible to improve engaging resistance at the time of assembly and disassembly of the impellers.

4. 发明专利

JPH06272696A IMPELLER AND DIFFUSER, AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06272696A
公开(公告)日：1994-09-27
申请号：JP8248593
申请日：1993-03-18
申请人： HITACHI LTD
发明人： KONO AKIOMI , YOKOI KAZUAKI , TAGUCHI KEIJI , MISUMI YOJI , UEYAMA TOSHIHARU , KOIDE KAZUMASA , HAYASHI KOSHI
IPC分类号： B23K20/00 , B23K20/02 , B23K20/16 , C21D1/00 , C21D9/00 , F04D29/02 , F04D29/22 , F04D29/28 , F04D29/54
摘要： PURPOSE:To provide an impeller and a diffuser having high dimensional accuracy and high strength reliability. CONSTITUTION:A member having the sides 1 of a plurality of blades integrated with a side plate section 2 at the side thereof, and another member having the core plate side 3 of blades integrated with a core plate section 4, are abutted to each other, so that the section 1 and the edge of the section 3, or joint planes are faced to each other. Then, a solder material is laid between the joint planes for diffusion junction under the application of heat and pressure. Thereafter, thermal treatment is applied to form a martensite tissue at a joint section including the joint planes.

5. 发明专利

JPS62276860A SEALING STRUCTURE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPS62276860A
公开(公告)日：1987-12-01
申请号：JP10094686
申请日：1986-05-02
申请人： HITACHI LTD
发明人： KONO AKIOMI , YAMADA TOSHIHIRO , SATO MOTOHIRO , YAMAMOTO AKIHIKO , TAGUCHI KEIJI , OGURO TAKAHIRO , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/02 , H01L23/10
摘要： PURPOSE:To enable ceramic members to be disconnected and rejoined, by making a melting temperature of adhesive materials for jointing a one-sided. ceramic member and frames become lower than that of adhesive materials for jointing the other-sided ceramic member and the frames and than that of the frames. CONSTITUTION:A ceramic member 1, which is disposed opposite to a ceramic member 7, and one-sided ends of frames 3 are jointed by high melting-point adhesive materials, while the other-sided ends of the frames 3 and one-sided ends of intermediate materials 8 jointed on those ends of the frames 3 are jointed by high melting-point adhesive materials. And the other-sided ends of the intermediate materials 8 and the other opposite ceramic member 7 are jointed by low melting-point adhesive materials which melt at a temperature lower than the high melting-point adhesive materials. These, adhesive materials 2 and 6, by which the frames 3 are jointed with the facing jointed ceramic members 1 and 7, differ largely in their melting temperatures. Therefore the frames 3 can be disconnected from the ceramic member 1 by heating these jointed parts at temperatures of melting the low melting-point adhesive materials 6. Rejoining of them can be also performed entirely without effects on the other parts jointed by the high melting-point adhesive materials.

6. 发明专利

JPH05305462A 失效
公开(公告)号：JPH05305462A
公开(公告)日：1993-11-19
申请号：JP11457292
申请日：1992-05-07
申请人： HITACHI LTD
发明人： SADAMURA HIROYOSHI , ISSHIKI OSAMU , NAKAGAWA SADAO , HASHIURA MASAYOSHI , SASAKI KOJI , FUKUDA SHINJI , TAGUCHI KEIJI , YOKOI KAZUAKI
IPC分类号： B23K20/12 , H01H33/02
摘要： PURPOSE:To enable the formation of a mechanical joint part together with a mechanical bond by pouring the plastically deformed part of an aluminum material into a groove provided on a copper material at the time of friction welding a copper material to an aluminum pipe. CONSTITUTION:The aluminum pipe 8 is pressurized and friction welded to the copper material 7 provided with the groove 10 at the joint while the copper material is kept rotated at a high speed. Build-ups are formed on both the inside and outside diameters of the joint surface of the aluminum pipe by plastic deformation at this time. The pressure welding is completed in the form that the build-up of the aluminum bites into the groove 10 at the end of the copper material 7 and, therefore, not only the metallic joint by the friction pressure welding and the mechanical joint are obtd. in combination and the joint strength equal to or higher than the joint strength of the base metal is obtd.

7. 发明专利

JPS63170282A JOINING METHOD 失效
公开(公告)号：JPS63170282A
公开(公告)日：1988-07-14
申请号：JP40087
申请日：1987-01-07
申请人： HITACHI LTD
发明人： HORINO MASAYA , TAGUCHI KEIJI , KONO AKIOMI , ARAI MASATSUGU
IPC分类号： C04B37/02 , B23K1/19 , B23K20/00

8. 发明专利

JPS61101473A Method of bonding ceramic and metal 失效
公开(公告)号：JPS61101473A
公开(公告)日：1986-05-20
申请号：JP22203184
申请日：1984-10-24
申请人： Hitachi Ltd
发明人： SATO MOTOHIRO , YAMADA TOSHIHIRO , KONO AKIOMI , YOKOI KAZUAKI , TAGUCHI KEIJI , YAMAMOTO AKIHIKO
IPC分类号： C04B37/02 , B23K20/00

9. 发明专利

JPS591077A Diffusion bonding method of sintered hard alloy and steel 失效
标题翻译：烧结硬质合金和钢的扩散接合方法
公开(公告)号：JPS591077A
公开(公告)日：1984-01-06
申请号：JP10842582
申请日：1982-06-25
申请人： Hitachi Ltd
发明人： TAGUCHI KEIJI , KOUNO AKIOMI , NAKAE HIDEO
IPC分类号： B23K20/00 , B23K20/227 , B23K35/00
CPC分类号： B23K20/227 , B23K35/004
摘要： PURPOSE:To relieve the tensile stress in a sintered hard alloy and to prevent cracking in the diffusion bonding stage of the sintered hard alloy and steel, by changing the thickness of an insert material in conformity with the size of materials to be joined. CONSTITUTION:A sintered hard alloy material 1 and an alloy 3 made of tool steel are combined after an insert material 2 of an Ni alloy is inserted between both. The assembly is put into a diffusion bonding furnace and is set under a hot press, then a vacuum pump is operated to operate the diffusion bonding furnace. Thereafter, the bonding pressur is released and the assembly is cooled in the furnace. The thickness of the material 2 in this case is properly selected in conformity with the size of the parts to be joined, whereby the tensile stress on the sintered hard alloy side is relieved.
摘要翻译：目的：通过根据待接合材料的尺寸改变插入材料的厚度，减轻烧结硬质合金中的拉伸应力并防止烧结硬质合金和钢的扩散结合阶段的开裂。构成：在Ni合金的插入材料2插入两者之间之后，组合烧结硬质合金材料1和由工具钢制成的合金3。将该组件放入扩散接合炉中并设置在热压机下，然后操作真空泵来操作扩散接合炉。此后，释放粘合压力并在炉中冷却组件。在这种情况下，材料2的厚度根据待接合部件的尺寸适当地选择，由此缓和烧结硬质合金侧的拉伸应力。

10. 发明专利

JPS58137418A FILTER MATERIAL FOR FILTER 失效
公开(公告)号：JPS58137418A
公开(公告)日：1983-08-15
申请号：JP1977282
申请日：1982-02-12
申请人： HITACHI PLANT ENG & CONSTR CO , HITACHI LTD
发明人： HAYATA FUMITAKA , TSURUTA AKIRA , YUGAWA TAKAO , NAKAE SHIBAO , TAGUCHI KEIJI
IPC分类号： B01D35/06 , B03C1/034
摘要： PURPOSE:To obtain a filter material for a filter capable of purifying contaminated water stably in high reliability, by filling a casing with a diffusion bonded magnetic stainless fiber to increase the strength of the filter material. CONSTITUTION:A casing 20 is filled with a magnetic stainless steel fiber 22 and, after said fiber is degreased with trichloroethylene, it is subjected to intermetallic diffusion bonding in a vacuum heating furnace and thereafter cooled rapidly. Thus obtained filter material is free from the outflow of a metal fiber piece even if filtration and backwashing are repeated compared to a filter material with a conventional structure because of intermetallic diffusion bond and the lowering of filtering capacity.

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