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1. 发明专利

JPH0697320A LIGHT EMITTING DEVICE 失效
公开(公告)号：JPH0697320A
公开(公告)日：1994-04-08
申请号：JP24618492
申请日：1992-09-16
申请人： HITACHI LTD
发明人： SATO AKIHIKO
IPC分类号： H01L23/22 , H01L23/42 , H01L33/64 , H01L33/00
摘要： PURPOSE:To increase heat radiating efficiency of radiating the heat generated from a light emitting element. CONSTITUTION:In a light emission device in which a light emitting element 2 is hermetically sealed within a cavity formed of a stem 1 and a sealing cap 5, a liquid 10 for improving the light emission characteristics of the light emitting element 2 is filled within the cavity. The light emitting element is a laser diode or infrared emitting diode, and the liquid 10 for improving the light emission characteristics is one which does not obstruct the course of the laser beam or the infrared beam. Also, the liquid 10 for improving the light emission characteristics has a high thermal conductivity.

2. 发明专利

JPH0629388A METHOD AND APPARATUS FOR WAFER BREAKING AND SEPARATION 失效
公开(公告)号：JPH0629388A
公开(公告)日：1994-02-04
申请号：JP17997592
申请日：1992-07-07
申请人： HITACHI LTD
发明人： SATO AKIHIKO , OGURA TAKESHI
IPC分类号： B28D5/00 , H01L21/301 , H01L21/78
摘要： PURPOSE:To protect a chip from damage like a split, a break or a crack when the chips are separated from a wafer in a wafer breaking separation method. CONSTITUTION:In a wafer breaking separation method, a wafer 1 having breaking grooves 1A is made on a tape 2 to separate the wafer 1 using a roller 3. While the tape 2 with the wafer 1 is stretched in a reverse direction to the rotational direction of the roller 3, the wafer 1 is separated into chips 4. Also, a breaking separation apparatus comprises a tape stretching means for stretching the tape 2, to which the wafer 1 is attached, in a reverse direction to the rotational direction of the roller 3, an upward pulling means for pulling the tape 2 upward so that the tape stretching direction is slanted upward with respect to a plane of a work stage, and an upward pulling angel setting means for setting a pulling angle in the upward pulling means.

3. 发明专利

JPH03190218A SEMICONDUCTOR MANUFACTURING APPARATUS 失效
公开(公告)号：JPH03190218A
公开(公告)日：1991-08-20
申请号：JP32851689
申请日：1989-12-20
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： SATO AKIHIKO , UEHARA HIROAKI
IPC分类号： H01L21/205
摘要： PURPOSE:To form a uniform crystal composition and thickness with entire gas in a reactor as a uniform laminar flow by providing a gas supply port at a position lower than a susceptor for holding a wafer, and disposing a gas exhaust port above the susceptor. CONSTITUTION:A gas supply port 15 is provided under a reactor 4, and a gas exhaust port 18 is provided above the reactor 4. Accordingly, the flow of gas in the reactor 4 becomes rising, and carrier gas having light specific weight and made of H2 gas in treating gas 16 becomes rising. The rising stream due to heating is generated oven at the center of the reactor 4 in which material to be treated is disposed. Thus, the entire flow of the gas in the reactor 4 becomes rising to a laminar flow to be scarcely disordered in the flow. Thus, homogeneous film forming speed becomes uniform on a wafer surface 10, thereby forming a film having less irregularity in thickness.

4. 发明专利

JPS62192582A VACUUM EVACUATION DEVICE 失效
公开(公告)号：JPS62192582A
公开(公告)日：1987-08-24
申请号：JP3296986
申请日：1986-02-19
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： MURAMATSU KIMIO , SATO AKIHIKO , KUSAKA TADAO , TOMIYAMA SHIGEO , SAKAMOTO HIROAKI , UEDA SHINJIRO , MASE MASAHIRO , OSAKABE ICHIRO , NAGAOKA TAKASHI
IPC分类号： B01J3/02 , B01J3/00 , C23C14/24 , C23C16/24 , C23C16/44 , C23C16/455 , C23F4/00 , F04D19/04 , H01L21/205 , H01L21/302 , H01L21/3065
摘要： PURPOSE:To develop a vacuum evacuation device which does not contaminate the inside of a vacuum chamber with the back diffusion of oil vapor by using an oil-free vacuum pump which permits control of the rotating speed by an inverter and for which a sealant for oil, etc., is not used for a vacuum pump to be used for a vacuum CVD device. CONSTITUTION:The oil-free vacuum pump is used for the vacuum evacuation device to be used in the vacuum CVD device of an apparatus for producing semiconductors to prevent the contamination of the inside of the vacuum chamber with the back diffusion of the oil. The rotating speed of the driving motor of the oil-free vacuum pump can be controlled by the inverter 16 and is provided with a centrifugal compression pump stage 23 on the suction port 21A side thereof and a circumferential flow compression pump stage 24 on the discharge port 21B side. The rotating body of the former is constituted of an open type impeller 23A having plural pieces of back sweep vanes and the stator for the impeller is constituted of plural pieces of stationary disks 23B attached with the vanes facing inward with respect to the rotating direction in a manner as to face the rear of the impeller 23A. The need for using a suction medium for the oil, etc., is thus eliminated.

5. 发明专利

JPS62162455A WAFER GRINDING METHOD 失效
公开(公告)号：JPS62162455A
公开(公告)日：1987-07-18
申请号：JP13016786
申请日：1986-06-06
申请人： HITACHI LTD
发明人： TAKAHASHI NOBUAKI , SATO AKIHIKO , NAKAMURA SOICHIRO
IPC分类号： B24B7/07 , B24B41/06 , B28D5/00 , H01L21/304
摘要： PURPOSE:To enable holding of a wafer by means of a low cost equipment which relieves impact produced during grinding and enables protection of a surface, by a method wherein a wafer is placed on a securing table, made of a porous member, through a flexible film, and is ground as the wafer is absorbed by the porous member. CONSTITUTION:A securing stand 6 is attached to a chuck base bed 8 by means of a screw 7, and a wafer 2, to which flexible film 11 is laminated, is placed on the surface of a porous member 9, e.g., ceramic, sintered metal. Vacuum is drawn through the plural pores of the porous member 9 to absorb and hold the wafer togetherwith the film 11 to grind it by means of a grinding stone 1. In this case, vibration during grinding and an impact force, e.g., beat by grinding grain, are relieved by cushion action of the film 11, and since the film is located between the securing stand 6 and the wafer 2, there is no fear of a surface being damaged during mounting and demounting. The holes of the porous member are easily formed by sintering, a work of high-precisely boring plural holes is eliminated, and equipment is reduced in a cost.

6. 发明专利

JPS6298618A PROCESSING DEVICE 失效
公开(公告)号：JPS6298618A
公开(公告)日：1987-05-08
申请号：JP23742685
申请日：1985-10-25
申请人： HITACHI TOKYO ELECTRONICS , HITACHI LTD
发明人： TOMIYAMA SHIGEO , MURAMATSU KIMIO , SATO AKIHIKO
IPC分类号： H01L21/22
摘要： PURPOSE:To make possible the use of a soft landing type boat loader even under the condition in which a jig is adhered to processing tube by a reaction product by a method wherein a fork, on which the jig is placed with one side floated up while a processing is being performed, is provided on a soft landing type boat loader. CONSTITUTION:The use of a soft landing type boat loader is made possible by scooping up a boat with a fork after the adhered boat has been moved. To be more precise, if the state of holding of the front leg 7a formed short in length is removed by the second fork 16 when the boat 7 is carried out from the treatment chamber 2 of a processing tube 1 using the first fork 15, the boat 7 moves a little by its own weight when it is inclined forward with the rear leg 7b as the center. As a result, the part adhered to the rear leg 7b by the reaction product can be peeled off easily.

7. 发明专利

JPS6293922A PROCESSING DEVICE 失效
公开(公告)号：JPS6293922A
公开(公告)日：1987-04-30
申请号：JP23322085
申请日：1985-10-21
申请人： HITACHI LTD
发明人： SATO AKIHIKO , FUJITA MASAHIRO
IPC分类号： H01L21/205 , H01L21/31
摘要： PURPOSE:To suppress the adhesion of a non-reaction product in the vicinity of a blow-out hole by a method wherein a rectifying part, widened toward the tip, is pro vided on the edge of a blow-out hole located on the side where sucking force of an exhaust means works intensely, and gas is flowed smoothly in the direction at right angle to the direction of blowing out. CONSTITUTION:The head 11 of the cube, having a recessed part 10 on four side faces, is inserted into an exhaust hood 7, and an exhaust path 9 is formed with the recessed part 10 and the hood 7. A slit-like blow-out hole 12 is provided on the lower surface of the head. Sucking holes 12 are provided in parallel, both ends of them are made even, their longitudinal direction crosses at right angle with the conveying direction of a conveyor 6, and a rectifying part 13 is formed by providing an inclined surface expanding downward on the side where the exhaust of an exhaust path 9 works heavily. Two systems of gas feeding paths 15a and 15b are provided in the head 11, and they are connected to the passages 14a and 14b. The gas blown out from the hole 12 is strongly sucked sidewise by the exhaust path 9, it makes a laminar stream along the rectifying part 13, and no eddy stream is generated on the edge of the blow-out hole 12. Accordingly, non-reaction product is not adhered to or deposited on the circumference of an aperture 12.

8. 发明专利

JPS6252940A SEMICONDUCTOR MEASURING APPARATUS 失效
公开(公告)号：JPS6252940A
公开(公告)日：1987-03-07
申请号：JP19194585
申请日：1985-09-02
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： KIYOKUNI YOSHIHIKO , SATO AKIHIKO , SHIGYO YOSHIHARU , KATAYAMA JUNICHI
IPC分类号： H01L21/66 , G01R31/26
摘要： PURPOSE:To avoid measurement errors and increase the degree of freedom of the movement of a conductive measuring stage and improve the aptitude for automation by a method wherein a pair of electrodes which touch a semiconductor device and the conductive measuring stage, on which the semiconductor device is placed, from the same side are provided. CONSTITUTION:The tip of one 3 of a pair of electrodes 3 and 11 touches the top surface of a semiconductor device 1 and presses and fixes the semiconductor device 1 on a chip to a measuring stage 2. At the same time, the tip of the other electrode 11 touches the top surface of the conductive measuring stage 2 at the position near the semiconductor device 1. With this arrangement, the power source for measurement is supplied to the top and bottom of the semiconductor device 1 from the pair of electrodes 3 and 11 to carry out the measurement of predetermined items. In an automatic test equipment composed of a plurality of the semiconductor measuring apparatuses, the semiconductor devices 1 are subjected to the respectively different measurement items at the respective measuring stations 101-105 during the rotation of a movable table 12. After all the measurement items are carried out, the device 1 is recovered out of the measuring stage 2 by an unloading apparatus 20.

9. 发明专利

JPS5115970A 失效
公开(公告)号：JPS5115970A
公开(公告)日：1976-02-07
申请号：JP8699974
申请日：1974-07-31
申请人： HITACHI LTD
发明人： SATO AKIHIKO , WATANABE MAKOTO
IPC分类号： H01L21/22 , H01L21/68

10. 发明专利

JP2002359218A SEMICONDUCTOR WAFER REAR-SURFACE POLISHING MACHINE 失效
公开(公告)号：JP2002359218A
公开(公告)日：2002-12-13
申请号：JP2001166519
申请日：2001-06-01
申请人： HITACHI LTD
发明人： SATO AKIHIKO , IHAYAZAKA TAKASHI , TAKAHASHI NOBUAKI
IPC分类号： H01L21/677 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent deterioration in polishing performance, by utilizing self-generating action. SOLUTION: The machine includes a first-axis grinding wheel 15 for grinding a wafer to a coarse finish level in a first chuck table 12, a second-axis grinding wheel 17 for grinding the wafer of a second chuck table 13 to a fine finish level, first and second cassette stages 18 and 20 having cassettes 19 and 21 installed for accommodating plural normal and reproduction wafers Wa and Wb therein respectively, a transfer robot 23 for transferring the wafer, and a controller 24 for controlling the wheels, stages and robot. The controller 24 alternately supplies the normal and reproduction wafers Wa and Wb to the second chuck table 13 to accurate-finish grind the wafers by the second-axis grinding wheel 17. Upon accurate-finish grinding by the second-axis wheel the usual wafer coarse-finish ground by the first-axis wheel, since the second-axis wheel is made autogenous by the normal wafer, the second-axis wheel can be prevented from becoming clogged and reduced in its grinding performance, so that proper accurate-finish grinding can always be secured.

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