专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2000200868A LEAD FRAME, MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000200868A
公开(公告)日：2000-07-18
申请号：JP9699
申请日：1999-01-04
申请人： HITACHI LTD
发明人： KUSUKAWA JUNPEI , YAMAGUCHI MOTOO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To enhance the adjacent inner leads of a lead frame in insulating reliability between them. SOLUTION: An adhesive agent layer 2 which bonds inner leads 1 to an insulating sheet 3 is formed smaller in width than the inner lead 1 in a direction vertical to the longer direction of the inner lead 1. When the adhesive agent layer 2 is provided as mentioned above, no adhesive agent layer is present between the adjacent inner leads 1, so that metal material dissolved in the adhesive agent layer is prevented from causing a short circuit between the adjacent inner leads 1 even if metal material is dissolved into the adhesive agent layer 2. Therefore, adjacent inner leads can be kept high in electrical insulation properties between them.

2. 发明专利

JP2000133740A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000133740A
公开(公告)日：2000-05-12
申请号：JP30064498
申请日：1998-10-22
申请人： HITACHI LTD
发明人： KUSUKAWA JUNPEI , TAKEUCHI RYOZO , YAMAGUCHI MOTOO
IPC分类号： H01L23/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To prevent humidity from generating a semiconductor device from the side surfaces of its supporting board, and to make hard the generation of migration in it, by fastening to its supporting board its semiconductor element connected electrically with its metallic wiring patterns, and by covering with an insulating resin one portion of the outer peripheral side surfaces of its supporting board. SOLUTION: A semiconductor element 8 is die-bonded to a supporting board 1 with previously formed metallic wirings 4 to connect by metallic fine wires 9 the terminal electrodes of the semiconductor element 8 and the metallic terminal electrodes formed on the supporting board 1. Furthermore, the top surface of the support board 1 is so sealed with a molding region 6 as to cover with the molding resin 6 the semiconductor element 8 and the connective portions, whereby the terminal electrodes of the semiconductor element 8 and the metallic terminal electrodes formed on the supporting board 1 are connected. Also, solder balls 7 are formed on the rear surface of the support board 1. Then, to the four outer peripheral side surfaces of the end portions of the supporting board 1, an overcoat resin of an insulating resin having low elasticity and high heat-resistance is impregnated and dipped, to dry harden it and form an insulating resin layer 12.

3. 发明专利

JPH1187869A PRINTED CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH1187869A
公开(公告)日：1999-03-30
申请号：JP24500697
申请日：1997-09-10
申请人： HITACHI LTD
发明人： KUSUKAWA JUNPEI , YAMAGUCHI MOTOO
IPC分类号： H05K1/11 , H05K1/03 , H05K3/00 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To eliminate migration in the case of exposure of fiber base material with an inner wall surface of a through hole by forming an insulation resin layer different from resin of a resin insulation base material of a printed circuit board between conductor metal of the hole and the base material of the board. SOLUTION: A hole is opened at a copper-clad laminate made of glass woven fabric epoxy resin. And, filling resin 6 of phenol novolac type epoxy resin, bisphenol A type epoxy resin and imidazole curing agent is filled in the hole 5 and cured. And, after a through hole 7 is formed at a center of the resin 6, it is electrolessly copper plated, and then copper sulfate plated to form a plating layer 8. Then, etching resist pattern is formed, and an outer layer wiring 9 is formed by etching. Thus, the base material is not soaked with the metal, and no migration occurs.

4. 发明专利

JP2014187150A Capacitor device and power conversion device 有权
标题翻译：电容器和电源转换器件
公开(公告)号：JP2014187150A
公开(公告)日：2014-10-02
申请号：JP2013060494
申请日：2013-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KAMITSUMA HIROSHI , NAKATSU KINYA , KUSUKAWA JUNPEI , TOKUYAMA TAKESHI
IPC分类号： H01G4/224 , H01G2/08 , H01G2/10 , H01G4/40
CPC分类号： H01G4/258 , H01G2/08 , H01G4/224 , H01G4/228 , H02M7/003 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To provide a capacitor device and a power conversion device in which the cooling performance of a film capacitor element is improved.SOLUTION: A couple of inserts are inserted between each one of a couple of facing inner walls and each one of a couple of collector electrodes, consisting of an electrode side facing surface that faces the collector electrode and a case-side facing surface that faces a facing inner wall. On the electrode side facing surface, an electrode side contact portion contacting with the collector electrode and an electrode side separation portion separating from the collector electrode are provided. On a case side facing surface, a case side contact portion contacting with the facing inner wall and a case side separation portion separating from the facing inner wall are provided. An insulating sealing material is also filled between the collector electrode and the electrode side separation portion, and between the facing inner wall and the case side separation portion.
摘要翻译：要解决的问题：提供一种电容器装置和电容转换装置，其中薄膜电容器元件的冷却性能得到改善。解决方案：一对插入件插入到两个相对的内壁中的每一个之间，一对集电极，由面对集电极的电极侧朝向表面和面向相对的内壁的面向壳体的表面组成。在电极侧面上设置有与集电极接触的电极侧接触部和与集电极分离的电极侧分离部。在壳体侧表面上设置有与相对的内壁接触的壳体侧接触部分和与相对的内壁分离的壳体侧分离部。绝缘密封材料也填充在集电极和电极侧分离部之间，并且在相对的内壁和壳体侧分离部之间。

5. 发明专利

JP2010186789A Insulating circuit board, inverter device, and power semiconductor device 审中-公开
标题翻译：绝缘电路板，逆变器器件和功率半导体器件
公开(公告)号：JP2010186789A
公开(公告)日：2010-08-26
申请号：JP2009028388
申请日：2009-02-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KUSUKAWA JUNPEI , MATSUMOTO KEIKI
IPC分类号： H01L23/36 , H01L23/12 , H01L23/373 , H05K1/05
CPC分类号： H05K1/056 , H01L23/142 , H01L23/145 , H01L23/3735 , H01L23/49894 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H05K2201/0195 , H05K2201/0209 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulating circuit board with high insulation reliability, and related technique using the insulating circuit board.
SOLUTION: In the insulating circuit board 12 where a conductor circuit 4 is formed on a metal base substrate 1 with an insulating layer interposed, the insulating layer 2 is formed by laminating a plurality of layers each including at least a composite insulating layer 2a forming an interface with the conductor circuit 4 and formed by dispersing an inorganic filler 8 in an insulating resin 7, and a resin single-substance insulating layer 2b which does not contain the inorganic filler 8.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有高绝缘可靠性的绝缘电路板以及使用绝缘电路板的相关技术。解决方案：在绝缘电路板12中，在绝缘层插入的金属基底基板1上形成导体电路4，绝缘层2通过层叠多个层而形成，每个层至少包括复合绝缘层 2a与导体电路4形成并通过将无机填料8分散在绝缘树脂7中而形成的界面，以及不含有无机填料8的树脂单体绝缘层2b。版权所有（C）2010 ，JPO＆INPIT

6. 发明专利

JP2002075099A RESIN BLOCK INSULATION SYSTEM 失效
公开(公告)号：JP2002075099A
公开(公告)日：2002-03-15
申请号：JP2000265842
申请日：2000-09-01
申请人： HITACHI LTD
发明人： TAKEUCHI RYOZO , KUSUKAWA JUNPEI , OHATA KOJI
IPC分类号： H01B17/64 , H01B17/66
摘要： PROBLEM TO BE SOLVED: To provide a memory system for an electric apparatus, which is easy to be dismantled, and materials of which can be separated and reused. SOLUTION: A high voltage portion is tightly covered with insulation blocks 1 like floored with tiles; and gaps between the blocks are sealed with a silicone viscous element, to prevent moisture from intruding and to improve the withstand voltage of the electric apparatus.

7. 发明专利

JP2011155720A Totally enclosed motor 有权
标题翻译：全封闭电机
公开(公告)号：JP2011155720A
公开(公告)日：2011-08-11
申请号：JP2010013822
申请日：2010-01-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUMOTO KEIKI , OTAKE ATSUSHI , MORITA YUTAKA , KUSUKAWA JUNPEI , KOBAYASHI KINYA , NAKATSUGAWA JUNNOSUKE
IPC分类号： H02K9/06 , H02K1/20 , H02K1/32
CPC分类号： H02K9/08 , H02K1/32 , H02K9/14
摘要： PROBLEM TO BE SOLVED: To provide a totally enclosed motor that has high performance of cooling, even if miniaturized. SOLUTION: The totally enclosed motor which includes a rotor 1 disposed inside a housing 5 to transfer heat to the housing 5, a stator 2 disposed inside the housing to transfer heat to the housing, and an inner fin 6 which is disposed in the rotor 1 and agitates air inside the housing 5. The totally enclosed motor Z is cooled by a forced convection by an outer fan 8 disposed outside the housing 5, or by a natural convention in the vicinity of an outer surface of the housing 5, and a shape of the rotor 1 is different between one end side and the other end side of the rotor in an extending direction of a rotary shaft 3 of the rotor. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使是小型化，也可提供具有高冷却性能的全封闭式电动机。解决方案：包括设置在壳体5内部以将热量传递到壳体5的转子1的全封闭马达，设置在壳体内部以将热量传递到壳体的定子2和布置在壳体5中的内翅片6 转子1并搅动壳体5内的空气。全封闭马达Z被外壳8外部的外风扇8的强制对流冷却，或通过外壳5的外表面附近的自然惯例来冷却，并且转子1的形状在转子的旋转轴3的延伸方向上的一端侧和另一端侧之间不同。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2003068965A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2003068965A
公开(公告)日：2003-03-07
申请号：JP2001261824
申请日：2001-08-30
申请人： Hitachi Ltd , Hitachi Ulsi Systems Co Ltd , 株式会社日立製作所 , 株式会社日立超エル・エス・アイ・システムズ
发明人： KUSUKAWA JUNPEI , TAKEUCHI RYOZO , ISHII TOSHIAKI , SUZUKI HIROMICHI , ITO FUJIO , NISHIDA TAKAFUMI , KAMEOKA AKIHIKO , YAMADA MASARU
IPC分类号： H01L23/50 , H01L23/00 , H01L23/28 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/498
CPC分类号： H01L23/564 , H01L23/3128 , H01L23/4334 , H01L23/49582 , H01L23/49816 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of a trouble such as leakage, short- circuiting, etc., caused by ion migration in a semiconductor device. SOLUTION: The semiconductor device is assembled by using a lead frame with heat sink which is constituted by bonding inner leads 1a composed of copper or copper alloys to a heat sink 3 through an adhesive layer 2 formed on the surface of the heat sink 3 and plating at least parts of the inner leads 1a with metal for connecting metallic thin wires. In this device, the bonded portions of the inner leads 1a to the adhesive layer 2 are entirely coated with at least one kind of metal which is different from the metal plated to the parts of the inner leads 1a for connecting thin metal wires, and selected from among gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium, and zirconium or its alloy.
摘要翻译：要解决的问题：为了防止在半导体器件中由离子迁移引起的诸如漏电，短路等故障的发生。解决方案：通过使用具有散热器的引线框架组装半导体器件，该引线框架通过将由铜或铜合金构成的内部引线1a通过形成在散热器3的表面上的粘合剂层2和电镀层3结合到散热器3而构成具有用于连接金属细线的金属的内部引线1a的至少一部分。在该装置中，内引线1a与粘合剂层2的接合部分全部涂覆有至少一种不同于镀金的金属与用于连接薄金属线的内引线1a的部分的金属，并选择从金，铂，铱，铑，钯，钌，铟，锡，钼，钨，镓，锌，铬，铌，钽，钛和锆或其合金中选择。

9. 发明专利

JP2002026219A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002026219A
公开(公告)日：2002-01-25
申请号：JP2000206748
申请日：2000-07-07
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： ITO FUJIO , KAMEOKA AKIHIKO , SUZUKI HIROMICHI , NAGAI AKIRA , KUSUKAWA JUNPEI , TSUGANE MASAYOSHI
IPC分类号： H01L23/28 , H01L23/29 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent migration of lead material, in a semiconductor device of a plastic package type having a heat spreader. SOLUTION: In the semiconductor device 1 of the plastic package type including the heat spreader 5, leads 3 are connected with the heat spreader 5 via an adhesive agent layer 9. A plating layer 10 is formed on the surface of the lead 3 in such a manner that a distance d is ensured from the upper surface of the adhesive agent layer 9.

10. 发明专利

JPH09312474A MULTILAYER PRINTED-WIRING BOARD 失效
公开(公告)号：JPH09312474A
公开(公告)日：1997-12-02
申请号：JP12680396
申请日：1996-05-22
申请人： HITACHI LTD
发明人： YAMAGUCHI MOTOO , KUSUKAWA JUNPEI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To avoid the direction contact of a copper wiring and the glass fiber of prepreg for assuring long life without deteriorating the electric insulating capacity between copper wirings and layers for a long time even if the prepreg for laminating inner leyer materials is thin by providing an insulating layer in the wiring gap of patterned both side plate. SOLUTION: Copper wirings 2 are patterned on both sides of a multilayer printed-wiring board filled up with insulating resin excluding the resing containing supply source in a prepreg in the gap part of copper wiring. Next, the prepreg reinforcing insulating resin with glass fiber is arranged between an outer layer copper foil 6 and inner layer materials (3-1) as well as the inner layer materials (3-2) to be stacked into multilayers. Finally, this mulyilayer printed-wiring board formed by thermal compression is filled up with the insulating resin excluding the resin containing supply source in the prepreg in the gap part of the copper wiring.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式