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1. 发明专利

JP2014187790A Inverter equipment 有权
标题翻译：逆变器装置
公开(公告)号：JP2014187790A
公开(公告)日：2014-10-02
申请号：JP2013060493
申请日：2013-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ONISHI MASAMI , TOKUYAMA TAKESHI
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
CPC分类号： H02M7/53 , H01L24/36 , H01L24/40 , H01L2224/40245 , H01L2924/00014 , H01L2924/12032 , H01L2924/13055 , H01L2924/13091 , H02M1/34 , H02M7/003 , H01L2924/00 , H01L2224/37099 , H01L2224/84801
摘要： PROBLEM TO BE SOLVED: To sufficiently release heat of each reflux diode when a plurality of reflux diodes are coupled in parallel.SOLUTION: In an inverter device 100, switching elements 101, 102 and reflux diodes 103a to 103d, 104a to 104d having a square shape are coupled in parallel, respectively. Both of the reflux diodes 103a to 103d, 104a to 104d mutually placed in adjacent positions are disposed so that any one of apexes of both of the reflux diodes are mutually facing.
摘要翻译：要解决的问题：当多个回流二极管并联耦合时，充分释放每个回流二极管的热量。解决方案：在逆变器装置100中，开关元件101,102和回流二极管103a至103d，104a至104d具有正方形形状分别并联耦合。相互放置在相邻位置的回流二极管103a〜103d，104a〜104d都被配置成使得两个回流二极管的顶点中的任一个相互面对。

2. 发明专利

JP2014161159A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2014161159A
公开(公告)日：2014-09-04
申请号：JP2013030593
申请日：2013-02-20
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KUSUKAWA JUNPEI , KAMITSUMA HIROSHI , TOKUYAMA TAKESHI , HATTORI YUKIO , NAKATSU KINYA
IPC分类号： H02M7/48 , H01G2/08 , H01G2/10 , H01G4/224
CPC分类号： H01G2/04 , H01G2/08 , H01G2/10 , H01G4/224 , H02M7/003 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To provide a power conversion apparatus using a small, high capacity, and highly reliable film capacitor, which prevents creation of a gap between films of the film capacitor in a case where a film capacitor element with a large ellipticity is applied in the power conversion apparatus.SOLUTION: In a power conversion apparatus, a housing with a plurality of chambers formed therein accommodates a power semiconductor module, which converts between DC and AC, in the first chamber, and accommodates a wound type flat film capacitor, which makes DC voltage smooth, in the second chamber. The power semiconductor module and the film capacitor are electrically connected by a conductor plate. The conductor plate is fixed to the housing. The flat film capacitor is installed on a seat member in the second chamber with its flat faces facing upward and downward. The upper flat face abuts on the conductor plate, and the conductor plate is fixed to the housing. Thereby the conductor plate is pressed and fixed between the conductor plate and the seat member.
摘要翻译：要解决的问题：提供一种使用小型，高容量，高可靠性的薄膜电容器的功率转换装置，其在应用具有大椭圆率的薄膜电容器元件的情况下，防止在薄膜电容器的膜之间产生间隙在电力转换装置中。在电力转换装置中，形成有多个室的壳体容纳在第一室中在DC和AC之间转换的功率半导体模块，并容纳卷绕型平板电容器，这使得直流电压平滑，在第二个室中。功率半导体模块和薄膜电容器通过导体板电连接。导体板固定在壳体上。平板电容器安装在第二室中的座构件上，其平面面向上和向下。上平面靠在导体板上，导体板固定在壳体上。由此，导体板被压固并固定在导体板和座椅构件之间。

3. 发明专利

JP2009219270A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2009219270A
公开(公告)日：2009-09-24
申请号：JP2008061185
申请日：2008-03-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , SAITO RYUICHI , HORIUCHI KEISUKE , SATO TOSHIYA , MIYAZAKI HIDEKI
IPC分类号： H02M7/48 , H01L23/36
CPC分类号： H05K7/20927 , B60K6/26 , B60K6/28 , B60K6/46 , B60K17/16 , B60L11/1803 , B60L15/007 , B60L2210/40 , B60L2220/14 , B60L2240/429 , B60Y2200/92 , H01L23/3121 , H01L23/36 , H01L23/3675 , H01L23/473 , H01L23/492 , H01L23/49517 , H01L24/45 , H01L25/072 , H01L2224/40137 , H01L2924/00014 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H02M7/003 , H02M7/537 , H02P27/06 , H05K1/0262 , H05K7/2089 , Y10S903/906 , Y10S903/907 , Y10S903/909 , H01L2924/00 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To improve a miniaturization technique as well as to improve reliability and productivity necessary for commercial production and enhance the cooling efficiency by devising the disposition and arrangement of constituent components, which leads to the reduction in size of the entire power conversion apparatus. SOLUTION: The power conversion apparatus includes: semiconductor modules 500, each having such a structure that semiconductor chips for an upper and a lower arm of an inverter circuit are each held from both sides by heat radiation metal; and a channel housing 212 which also serves as a lower case for cooling the semiconductor modules. The channel housing is formed with a central opening and side openings on both sides of the central opening. A capacitor module 390 is slotted in the central opening, while the semiconductor modules 500 are slotted in the side openings. Not only the semiconductor modules but also the capacitor module are cooled in the channel housing. Furthermore, the entire apparatus is miniaturized by installing a driver substrate, a control substrate, and an AC bus bar on the upper surface of the capacitor module 390. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了改进小型化技术以及提高商业生产所需的可靠性和生产效率，通过设计组成部件的布置和布置来提高冷却效率，从而导致整体尺寸的减小电力转换装置。电力转换装置包括：半导体模块500，其各自具有这样的结构，即用于通过散热金属从两侧保持逆变器电路的上臂和下臂的半导体芯片; 以及还用作冷却半导体模块的下壳体的通道外壳212。通道壳体形成有中央开口和位于中心开口两侧的侧开口。电容器模块390在中心开口中开槽，而半导体模块500在侧开口中开槽。不仅半导体模块而且电容器模块都在通道外壳中冷却。此外，通过在电容器模块390的上表面上安装驱动器基板，控制基板和AC汇流条，整个装置小型化。（C）2009，JPO＆INPIT

4. 发明专利

JP2008193867A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2008193867A
公开(公告)日：2008-08-21
申请号：JP2007028303
申请日：2007-02-07
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , SAITO RYUICHI
IPC分类号： H02M7/00
CPC分类号： H05K7/20927 , H01L23/473 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H02M7/003 , H02M7/537 , H02M7/5387 , H05K7/209 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide technology relating to improvements in reliability and improvement in productivity that are necessary for commercial production, while providing technology that leads to size reduction in a power conversion device having cooling function. SOLUTION: Series circuits comprising an upper arm and a lower arm of an inverter circuit are built into a single semiconductor module 500. The semiconductor module has cooling metals on both sides, and an upper-arm semiconductor chip and a lower-arm semiconductor chip are wedged in between the cooling metals. The semiconductor module is inserted inside a channel case body unit 214. A DC positive-electrode terminal 532, a DC negative-electrode terminal 572, and the AC terminal 582 of a semiconductor chip are disposed in the semiconductor module; the DC terminals 532, 572 are electrically connected to a terminal of a capacitor module; and the AC terminal 582 is electrically connected to a motor generator via an AC connector. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供与商业生产所必需的可靠性提高和生产率提高相关的技术，同时提供导致具有冷却功能的功率转换装置的尺寸减小的技术。解决方案：包括反相器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属，并且上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。半导体模块插入通道壳体单元214内。半导体模块中设置有DC正极端子532，DC负极端子572和半导体芯片的AC端子582，直流端子532,572电连接到电容器模块的端子; 并且AC端子582经由AC连接器电连接到电动发电机。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007299781A Electronic circuit device, electronic circuit module and power conversion device 有权
标题翻译：电子电路装置，电子电路模块和电力转换装置
公开(公告)号：JP2007299781A
公开(公告)日：2007-11-15
申请号：JP2006123835
申请日：2006-04-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , KAWABATA ATSUSHI
IPC分类号： H01L25/07 , B60L9/18 , H01L25/18 , H02M7/48
CPC分类号： H05K7/02 , H01G2/08 , H01G4/224 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To mainly provide an electric circuit device capable of establishing compatibility between improvement of cooling capability and reduction of loss in operation due to a wiring inductance. SOLUTION: The above problem can be solved by configuring a plurality of planar conductors electrically connected to a plurality of semiconductor chips, so that the conductors are thermally connected to both chip surfaces of each of the semiconductor chips, heat can be radiated from the chip surfaces of each of the semiconductor chips and, of the planar conductors, conductor surfaces of the planar conductor for a DC positive electrode and the planar conductor for a DC negative electrode oppose to each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：主要提供一种电路装置，其能够在由于布线电感引起的冷却能力的提高和操作损耗的减少之间建立兼容性。解决方案：通过配置电连接到多个半导体芯片的多个平面导体，可以解决上述问题，使得导体热连接到每个半导体芯片的两个芯片表面，热量可以从每个半导体芯片和平面导体的芯片表面，用于DC正极的平面导体的导体表面和用于DC负极的平面导体彼此相对。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2014187150A Capacitor device and power conversion device 有权
标题翻译：电容器和电源转换器件
公开(公告)号：JP2014187150A
公开(公告)日：2014-10-02
申请号：JP2013060494
申请日：2013-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KAMITSUMA HIROSHI , NAKATSU KINYA , KUSUKAWA JUNPEI , TOKUYAMA TAKESHI
IPC分类号： H01G4/224 , H01G2/08 , H01G2/10 , H01G4/40
CPC分类号： H01G4/258 , H01G2/08 , H01G4/224 , H01G4/228 , H02M7/003 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To provide a capacitor device and a power conversion device in which the cooling performance of a film capacitor element is improved.SOLUTION: A couple of inserts are inserted between each one of a couple of facing inner walls and each one of a couple of collector electrodes, consisting of an electrode side facing surface that faces the collector electrode and a case-side facing surface that faces a facing inner wall. On the electrode side facing surface, an electrode side contact portion contacting with the collector electrode and an electrode side separation portion separating from the collector electrode are provided. On a case side facing surface, a case side contact portion contacting with the facing inner wall and a case side separation portion separating from the facing inner wall are provided. An insulating sealing material is also filled between the collector electrode and the electrode side separation portion, and between the facing inner wall and the case side separation portion.
摘要翻译：要解决的问题：提供一种电容器装置和电容转换装置，其中薄膜电容器元件的冷却性能得到改善。解决方案：一对插入件插入到两个相对的内壁中的每一个之间，一对集电极，由面对集电极的电极侧朝向表面和面向相对的内壁的面向壳体的表面组成。在电极侧面上设置有与集电极接触的电极侧接触部和与集电极分离的电极侧分离部。在壳体侧表面上设置有与相对的内壁接触的壳体侧接触部分和与相对的内壁分离的壳体侧分离部。绝缘密封材料也填充在集电极和电极侧分离部之间，并且在相对的内壁和壳体侧分离部之间。

7. 发明专利

JP2014050118A Electric circuit device and method for manufacturing electric circuit device 审中-公开
标题翻译：电气电路装置及制造电路装置的方法
公开(公告)号：JP2014050118A
公开(公告)日：2014-03-17
申请号：JP2012188543
申请日：2012-08-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HIRANO SATOSHI , NANBA AKIHIRO , OGATA MAKOTO , TOKUYAMA TAKESHI , NAKATSU KINYA
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
CPC分类号： H05K7/02 , B23K2201/38 , H01L23/49562 , H01L25/072 , H01L25/18 , H01L2924/0002 , H02M7/003 , H02M7/537 , H05K7/1432 , Y10T29/49149 , H01L2924/0001 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electric circuit device capable of securing the durability of a connection part while reducing thermal influences on a periphery in the case of connecting a DC terminal to a connection terminal part.SOLUTION: A power electric circuit includes: a power module 300 having a DC positive electrode branch terminal 315D and a DC negative electrode branch terminal 319D; and a power board 700 having a power board P bus bar and a power board N bus bar sealed with an insulating resin member such that a P terminal 701 and an N terminal 702 are exposed for transmitting DC currents. Thus, it is possible to reduce thermal influences on the resin member, and to improve connection durability.
摘要翻译：要解决的问题：提供一种能够确保连接部件的耐久性的电路装置，同时在将DC端子连接到连接端子部件的同时减少对周围的热影响。解决方案：电力电路包括：具有DC正极分支端子315D和DC负极分支端子319D的功率模块300; 以及电源板700，其具有电源板P母线和用绝缘树脂构件密封的电源板N母线，使得P端子701和N端子702暴露用于传输DC电流。因此，能够降低对树脂构件的热影响，提高连接耐久性。

8. 发明专利

JP2009159815A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2009159815A
公开(公告)日：2009-07-16
申请号：JP2009096102
申请日：2009-04-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , SAITO RYUICHI
IPC分类号： H02M7/48 , H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a technology contributing to compactification and a technology for improvement in reliability and productivity required for products, in regard to a power conversion apparatus having a cooling function. SOLUTION: The power conversion apparatus has a configuration in which a series circuit having an upper arm and a lower arm of an inverter circuit is incorporated in one semiconductor module 500. The semiconductor module has cooling metals on both sides thereof, sandwiches a semiconductor chip for the upper arm and a semiconductor chip for the lower arm between the cooling metals, respectively. The semiconductor module is inserted in a water passage housing body 214 and is provided with DC positive electrode terminals 532, DC negative electrode terminals 572 and AC terminals 582 arranged thereon, wherein the DC terminals 532, 572 are electrically connected with terminals of a capacitor module and the AC terminals 582 are electrically connected with a motor generator via AC connectors. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：就具有冷却功能的电力转换装置而言，提供有助于压实的技术和用于提高产品所需的可靠性和生产率的技术。解决方案：电力转换装置具有将具有逆变器电路的上臂和下臂的串联电路结合在一个半导体模块500中的结构。半导体模块在其两侧具有冷却金属，夹着分别用于上臂的半导体芯片和用于下臂的半导体芯片在冷却金属之间。半导体模块插入水通道壳体214中，并且设置有DC正极端子532，DC负极端子572和布置在其上的AC端子582，其中DC端子532,572与电容器模块的端子电连接并且AC端子582经由AC连接器与电动发电机电连接。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008259267A Semiconductor module for inverter circuit 有权
标题翻译：用于逆变器电路的半导体模块
公开(公告)号：JP2008259267A
公开(公告)日：2008-10-23
申请号：JP2007096536
申请日：2007-04-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOKUYAMA TAKESHI , NAKATSU KINYA , SAITO RYUICHI
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H01L25/115 , H01L23/473 , H01L25/072 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H02M7/003 , H02M7/81 , H05K7/20927 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enhance productivity and reliability by performing the great portion of formation work in the series circuit of the upper and lower arms of an inverter circuit on one heat sink side. SOLUTION: The double side cooling semiconductor module 500 incorporating the series circuit of the upper and lower arms of an inverter circuit has first and second heat sinks 522 and 562 with fins wherein conductor plates 534 are formed on the other opposing sides of the first and second heat dissipation plates through an insulating sheet 524. The conductor plate 534 formed on the first heat sink is provided with a portion 536 for securing the collector surface of semiconductor chips 538 and 547 on the upper and lower arms. Furthermore, a conductor for gate being connected with the gate terminal 553 of the semiconductor module is provided, the gate electrode terminal of the semiconductor chip and the conductor 555 for gate are connected electrically by wire bonding, and the conductor plate formed on the second heat sink is connected with the emitter surface of a semiconductor chip secured to the first heat sink. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过在一个散热器侧的逆变器电路的上下臂的串联电路中进行大量的形成工作来提高生产率和可靠性。解决方案：结合逆变器电路的上臂和下臂的串联电路的双面冷却半导体模块500具有带翅片的第一和第二散热器522和562，其中导体板534形成在第一和第二散热板通过绝缘片524.形成在第一散热器上的导体板534设置有用于将半导体芯片538和547的集电器表面固定在上臂和下臂上的部分536。此外，设置与半导体模块的栅极端子553连接的栅极导体，半导体芯片的栅电极端子和栅极用导体555通过引线接合电连接，形成在第二加热器上的导体板接收器与固定到第一散热器的半导体芯片的发射极表面连接。版权所有（C）2009，JPO＆INPIT

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